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公开(公告)号：KR101023541B1
公开(公告)日：2011-03-21
申请号：KR1020090089799
申请日：2009-09-22
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0236 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K2201/09309 , H05K2201/09627 , H01L2924/00014
Abstract: PURPOSE: A printed circuit board for reducing an EMI noise is provided to shield a radiation noise by inserting an electromagnetic bandgap structure into the substrate. CONSTITUTION: A ground layer and a power layer are formed on a first region(100). A second region is positioned on the side of the first region and includes an electromagnetic bandgap structure to shield an EMI noise emitted to the outside through the side of the first region. A first conductive plate(220a) and a second conductive plate(220b) are formed on the same plane along the side of the first region. A stitching via part(250) electrically connects the first and second conductive plates.
Abstract translation: 目的：提供用于降低EMI噪声的印刷电路板，通过将电磁带隙结构插入基板来屏蔽辐射噪声。 构成：在第一区域（100）上形成接地层和功率层。 第二区域位于第一区域的侧面，并且包括电磁带隙结构，以屏蔽通过第一区域的一侧发射到外部的EMI噪声。 第一导电板（220a）和第二导电板（220b）沿着第一区域的一侧形成在同一平面上。 缝合通孔部分（250）电连接第一和第二导电板。
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公开(公告)号：KR1020090080462A
公开(公告)日：2009-07-24
申请号：KR1020080057444
申请日：2008-06-18
Applicant: 삼성전기주식회사
CPC classification number: H01P1/2005 , H01L2224/16225
Abstract: An electromagnetic band-gap structure and a printed circuit board are provided to shield a coupling noise of a high frequency when an operation frequency having a high frequency band is used. An electromagnetic band gap structure wafer(300) comprises a dielectric layer and a plurality of conductive plates, a stitching via, and a through via. A switching bar penetrates a dielectric layer and connects the conductive plate by passing the conductive plate and the other plane. The trough via passes a clearance hole formed on a conductive plate and connects two conductive layers electrically.
Abstract translation: 提供电磁带隙结构和印刷电路板，以在使用具有高频带的操作频率时屏蔽高频耦合噪声。 电磁带隙结构晶片（300）包括电介质层和多个导电板，缝合通孔和通孔。 切换杆穿透电介质层，并且通过使导电板和另一个平面通过来连接导电板。 槽通过形成在导电板上的间隙孔并且电连接两个导电层。
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公开(公告)号：KR100851075B1
公开(公告)日：2008-08-12
申请号：KR1020070041991
申请日：2007-04-30
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H01Q15/008 , H01L2224/16225 , H01P1/2005 , H05K1/0236 , H05K2201/09309 , H05K2201/09663
Abstract: An electromagnetic band gap structure and a printed circuit board are provided to block a noise with a specific frequency and to prevent mixed signals in an electronic device having an RF circuit and a digital circuit on the same substrate. An electromagnetic band gap structure includes first and second metal layers(210-1,210-2), first through third dielectric layers(220a,220b,220c), first and second metal plates(330,335), and first and second vias(340,345). The first dielectric layer is formed on the first metal layer. The first metal plate is formed on the first dielectric layer. The first via connects the first metal layer and the first metal plate. The second dielectric layer is formed on the first metal layer and the first dielectric layer. The second metal layer is formed on the second dielectric layer and has a hole(350). The third dielectric layer is formed on the second metal plate. The second metal plate is formed on the third dielectric layer. The second via connects the first metal plate and the second metal plate through the hole.
Abstract translation: 提供电磁带隙结构和印刷电路板以阻挡具有特定频率的噪声，并且防止具有RF电路和数字电路的电子设备中的混合信号在同一基板上。 电磁带隙结构包括第一和第二金属层（210-1,210-2），第一至第三介电层（220a，220b，220c），第一和第二金属板（330,335）以及第一和第二通孔（340,345）。 第一介电层形成在第一金属层上。 第一金属板形成在第一电介质层上。 第一通孔连接第一金属层和第一金属板。 第二电介质层形成在第一金属层和第一电介质层上。 第二金属层形成在第二电介质层上并具有孔（350）。 第三电介质层形成在第二金属板上。 第二金属板形成在第三电介质层上。 第二通孔通过孔连接第一金属板和第二金属板。
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公开(公告)号：KR1020080072505A
公开(公告)日：2008-08-06
申请号：KR1020070093956
申请日：2007-09-17
Applicant: 삼성전기주식회사
IPC: H05K3/40
CPC classification number: H05K1/0236 , H05K1/115 , H05K3/4038
Abstract: An electromagnetic band gap structure and a printed circuit board are provided to solve a mixed signal problem in an electronic device having an RF(Radio Frequency) circuit and a digital circuit on the same substrate. An electromagnetic band gap structure(400) is formed by stacking a first metal layer(410), a first dielectric layer(430a), a second dielectric layer(430b), and a second metal layer(420) and includes a first metal plate(440a), a second metal plate(440b), and a via(450). The first metal plate is formed between the first and second dielectric layers. The second metal plate is formed on the same plane as the first metal plate, received in a hole(445) formed on the first metal plate, and electrically connected to the first metal plate through a metal line(442). The via connects the second metal plate to any one of the first and second metal layers.
Abstract translation: 提供电磁带隙结构和印刷电路板，以解决在同一基板上具有RF（射频）电路和数字电路的电子设备中的混合信号问题。 通过堆叠第一金属层（410），第一介电层（430a），第二电介质层（430b）和第二金属层（420）来形成电磁带隙结构（400），并且包括第一金属板 （440a），第二金属板（440b）和通孔（450）。 第一金属板形成在第一和第二电介质层之间。 第二金属板形成在与第一金属板相同的平面上，容纳在形成在第一金属板上的孔（445）中，并通过金属线（442）与第一金属板电连接。 通孔将第二金属板连接到第一和第二金属层中的任何一个。
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公开(公告)号：KR1020080020280A
公开(公告)日：2008-03-05
申请号：KR1020060083583
申请日：2006-08-31
Applicant: 삼성전기주식회사
CPC classification number: H01R13/2407 , H01R12/58 , H05K3/365 , H05K2201/10295
Abstract: A PCB with a connection portion is provided to connect a PCB and a PCB electrically through a simple structure of forming a terminal hole on the PCB and inserting a connector pin into the terminal hole, thereby securing a good signal transfer characteristic. A PCB(Printed Circuit Board) with a connection portion(10) comprises a terminal portion(13) and a connector pin(15). The terminal portion has a terminal hole(11) formed in a side of the PCB. An end of the connector pin is inserted to the terminal hole. The other end of the connector pin is in electrical contact with a pad portion(3a') installed in the connection target PCB by a contact portion(15b) formed which is projected and extended to the outside and is elastically transformed by bending several times.
Abstract translation: 提供具有连接部分的PCB，以通过在PCB上形成端子孔并将连接器插头插入端子孔的简单结构电连接PCB和PCB，从而确保良好的信号传递特性。 具有连接部分（10）的PCB（印刷电路板）包括端子部分（13）和连接器引脚（15）。 端子部分具有形成在PCB一侧的端子孔（11）。 连接器针的端部插入端子孔。 连接器针的另一端通过形成的接触部分（15b）与安装在连接目标PCB中的焊盘部分（3a'）电接触，该接触部分突出并延伸到外部并通过弯曲多次而弹性变形。
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Patent Agency Ranking
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公开(公告)号：KR101892903B1
公开(公告)日：2018-08-28
申请号：KR1020180059812
申请日：2018-05-25
Applicant: 삼성전기주식회사
IPC: H01L25/065 , H01L25/07 , H01L25/11 , H01L23/538 , H01L23/498 , H01L23/522 , H01L23/525 , H01L23/31 , H01L23/00
CPC classification number: H01L2224/18 , H01L2224/32145 , H01L2224/48091 , H01L2924/00014
Abstract: 본개시는관통홀을갖는코어부재, 상기관통홀에배치된제1 및제2반도체칩, 상기코어부재와상기제1 및제2반도체칩의적어도일부를봉합하는봉합재, 및상기코어부재와상기제1 및제2반도체칩의활성면상에배치된연결부재를포함하며, 상기연결부재의재배선층은제1도체및 제2도체를통해상기제1접속패드및 상기제2접속패드와각각연결되되, 상기제2도체가상기제1도체보다높이가큰, 팬-아웃반도체패키지에관한것이다.
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公开(公告)号：KR20180061109A
公开(公告)日：2018-06-07
申请号：KR20180059812
申请日：2018-05-25
Applicant: 삼성전기주식회사
IPC: H01L25/065 , H01L23/00 , H01L23/31 , H01L23/498 , H01L23/522 , H01L23/525 , H01L23/538 , H01L25/07 , H01L25/11
CPC classification number: H01L2224/18 , H01L2224/32145 , H01L2224/48091 , H01L2924/00014 , H01L25/0657 , H01L23/3114 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5226 , H01L23/525 , H01L23/5383 , H01L23/5384 , H01L25/073 , H01L25/117
Abstract: 본개시는관통홀을갖는코어부재, 상기관통홀에배치된제1 및제2반도체칩, 상기코어부재와상기제1 및제2반도체칩의적어도일부를봉합하는봉합재, 및상기코어부재와상기제1 및제2반도체칩의활성면상에배치된연결부재를포함하며, 상기연결부재의재배선층은제1도체및 제2도체를통해상기제1접속패드및 상기제2접속패드와각각연결되되, 상기제2도체가상기제1도체보다높이가큰, 팬-아웃반도체패키지에관한것이다.
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公开(公告)号：KR1020170112907A
公开(公告)日：2017-10-12
申请号：KR1020160107766
申请日：2016-08-24
Applicant: 삼성전기주식회사
IPC: H01L23/522 , H01L23/00 , H01L23/525 , H01L23/538 , H01L23/498 , H01L23/50 , H01L23/043 , H01L23/31
CPC classification number: H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/18 , H01L2224/24195 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/18162 , H01L2924/19105 , H01L2924/19106
Abstract: 본개시는접속패드가배치된활성면및 상기활성면의반대측에배치된비활성면을갖는반도체칩; 상기반도체칩주위에배치된제1커패시터; 상기제1커패시터및 상기반도체칩의비활성면의적어도일부를봉합하는봉합재; 상기봉합재, 상기제1커패시터, 및상기반도체칩의활성면상에배치된제1연결부재; 및상기제1연결부재의상기반도체칩이배치된측의반대측에배치된제2커패시터; 를포함하며, 상기제1연결부재는상기반도체칩의접속패드, 상기제1커패시터, 및상기제2커패시터와전기적으로연결된재배선층을포함하며, 상기제1커패시터및 상기제2커패시터는상기재배선층의동일한파워용배선을통하여상기접속패드와전기적으로연결된, 팬-아웃반도체패키지에관한것이다.
Abstract translation: 本公开涉及一种半导体芯片，该半导体芯片具有其上设置有连接焊盘的有源表面以及设置在有源表面的相对侧上的无源表面; 围绕半导体芯片设置的第一电容器; 一种密封材料，用于密封第一电容器和半导体芯片的非活性表面的至少一部分; 第一连接构件，设置在密封剂，第一电容器和半导体芯片的有效表面上; 以及第二电容器，设置在所述第一连接构件的布置有所述半导体芯片的一侧的相反侧; 其中第一连接件包括与半导体芯片，第一电容器和第二电容器的连接焊盘电连接的重布线层，其中第一电容器和第二电容器连接到上层电容器， 通过扇出半导体封装的相同电源布线电连接到连接焊盘的半导体封装。
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公开(公告)号：KR101038236B1
公开(公告)日：2011-06-01
申请号：KR1020090087645
申请日：2009-09-16
Applicant: 삼성전기주식회사
IPC: H05K1/02
CPC classification number: H05K1/0233 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H05K1/0236 , H05K1/112 , H05K2201/086 , H05K2201/1003 , H01L2924/00014
Abstract: 전자기 밴드갭 구조를 구비하는 인쇄회로기판이 개시된다. 상기 인쇄회로기판은, 노이즈를 차폐하는 전자기 밴드갭 구조물이 내부에 삽입되는 인쇄회로기판으로서, 상기 밴드갭 구조물은, 제1 도전판; 상기 제1 도전판과 상이한 평면 상에 배치되는 제2 도전판; 상기 제2 도전판과 상이한 평면 상에 배치되는 제3 도전판; 상기 제2 도전판이 배치되는 평면을 경유하여 상기 제1 도전판과 상기 제3 도전판을 연결하며, 인덕터 소자를 포함하는 스티칭 비아부를 포함한다.
기판, EMI, 전자기 밴드갭 구조, 차폐Abstract translation: 公开了一种包括电磁带隙结构的印刷电路板。 用于阻挡噪声的电磁带隙结构被插入到印刷电路板中。 电磁带隙结构可以包括第一导电板; 布置在与第一导电板不同的平面上的第二导电板; 布置在与第二导电板的平面不同的平面上的第三导电板; 以及缝合通孔单元，其被配置为通过旁路布置所述第二导电板的平面并且包括第一电感器元件来连接所述第一导电板和所述第三导电板。
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