Abstract:
PURPOSE: A non-volatile memory device and a method for programming the same are provided to obtain a cell unit with a multi-level without the increase of a chip-size. CONSTITUTION: A first electrode(142) is formed on the upper side of a substrate. A first phase change material pattern(144) is formed on the first electrode. A second phase change material pattern(152) is formed on the first phase change material pattern. A second electrode(154) is formed on the second phase change material pattern. The volume of the second phase change material pattern is larger than the volume of the first phase change material pattern.
Abstract:
A phase change memory device is provided to reduce current applied in reset action and overcome patterning limit and implement phase change memory device which is good for high integration. A substrate in which bottom patterns are equipped is formed. Bottom electrodes of a linear type or a L type are contacted to bottom patterns on the substrate mounting the bottom patterns and are equipped with an upper side having x-axis and y-axis. Phase change patterns are contacted to the upper side of the bottom electrodes and have the respective wider width than the x-axis and y-axis. Upper electrodes are arranged on the phase change patterns.
Abstract:
A phase change memory device and a manufacturing method thereof are provided to reduce a current supplied in reset operation by reducing interface dimensions between a phase change pattern and a bottom electrode in which joule heat is generated. Bit lines(BL) are parallel arranged with a vertical direction. Word lines(WL) are parallel arranged with a horizontal direction. The bit lines intersect with the word lines. Each phase change pattern(Rp) is arranged on an intersection of the bit lines and the word lines. Each diode(D) is serially connected to one corresponding to each phase change pattern. Each phase change pattern is connected to one corresponding to each bit line. Each diode is connected to one corresponding to each word line.
Abstract:
A phase change memory device and a fabricating method thereof are provided to prevent defects of a phase-change material by contacting two terminals connected to a phase-change pattern with a lower surface of the phase-change pattern. A mold insulating layer is formed on a semiconductor substrate, and a first plug electrode(160) and a second plug electrode(161) are formed in the mold insulating layer. A phase-change pattern(165) is disposed on the mold insulating layer, and is connected to an upper surface of the first plug electrode and a first portion of an upper surface of the second plug electrode. The entire surface of the substrate is covered by an upper insulating layer. A wiring plug(190) is connected to a second portion of the upper surface of the second plug electrode through the upper insulating layer. A wiring is disposed on the upper insulating layer.
Abstract:
a first adder for adding input data and a coefficient; a second adder for adding the input data and an inverted value of the coefficient; first and second absolute value circuits for respectively outputting absolute values for the outputs of the first and second adders; first and second memories for addressing output values from the first and second absolute value circuits and for memorizing the addressed values as data values; and a third adder for adding an output of the first memory and an inverted value of an output from the second memory.
Abstract:
The digital data storage for digital audio system includes a data storage device which stores and reads out data. A digital signal processor operates on a digital signal from the data storage device, and an interface, between the data storage and processor, drives and buffers the read-out data. A system control microcomputer controls the digital signal processor, and a memory connected to the processor is capable of reading and writing data. A main computer monitors the data stored in the memory, and an interface portion, between the memory and main computer, interfaces the data.
Abstract:
The method calculates error values with a simple circuit of a little delay to correct error. The apparatus includes the 1st adder (110) for correcting the error in received data by adding the error value (Y1 or Y2) from a buffer memory (101) to the data received from a buffer memory section (100), an error discriminator (100) for detecting error, and a controlling section (190) for controlling overall operation of the apparatus.