-
公开(公告)号：KR1020050029808A
公开(公告)日：2005-03-29
申请号：KR1020030066018
申请日：2003-09-23
Applicant: 전자부품연구원
IPC: G02B6/36
Abstract: A window mounting jig for an optic device package and a method for manufacturing the window structure using the same are provided to know the adhesion intensity and the hermeticity of the optic device package by forming the window structure. A window mounting jig for an optic device package includes a guide plate, a mounting tape, a pair of metal layers(152,155), a pair of transparent disks(121,122), and a photoresist pattern(160). The guide plate is provided with a plurality of apertures to insert the transparent disks(121,122) of the optic device package window structure. The mounting tape is attached to the bottom surface of the guide plate.
Abstract translation: 提供了一种用于光学器件封装的窗户安装夹具和使用其的窗户结构的制造方法，以通过形成窗户结构来了解光学器件封装的粘附强度和密封性。 用于光学器件封装的窗户安装夹具包括引导板，安装带，一对金属层（152,155），一对透明盘（121,122）和光致抗蚀剂图案（160）。 引导板设置有多个孔以插入光学器件封装窗口结构的透明盘（121,122）。 安装带安装在导板的底面上。
-
公开(公告)号：KR100447032B1
公开(公告)日：2004-09-07
申请号：KR1020020075744
申请日：2002-12-02
Applicant: 전자부품연구원
IPC: H05K3/46
Abstract: PURPOSE: A flat LTCC(Low Temperature Cofired Ceramic) multilayer substrate having a resistor and a fabricating method thereof are provided to reduce the surface curvature by performing simultaneously a firing process and a process for laminating a high-temperature firing material on a top side and a bottom side of a LTF ceramic laminator. CONSTITUTION: A resistor pattern and an internal electrode are formed on a first low temperature cofired green sheet. A via is formed on a second LTF(Low Temperature Fired) green sheet. A LTF ceramic laminator is formed by laminating the first and the second LTF green sheets. An HTF(High Temperature Fired) green sheet is fabricated and a via is formed on the HTF green sheet. A multilayer ceramic substrate is formed by adhering the HTF green sheet on a top side and a bottom side of the LTF ceramic laminator. The LTF green sheet and the HTF green sheet are unified by pressing the multilayer ceramic substrate. A firing process for the multilayer ceramic substrate is performed under the temperature of 800 to 900 degrees centigrade. An LTCC substrate is formed by cleaning and polishing the HTF green sheet. A surface circuit pattern is printed on the LTCC substrate.
Abstract translation: 目的：提供一种具有电阻器的扁平LTCC（低温共烧陶瓷）多层基板及其制造方法，以通过同时执行烧制工艺和在顶侧上层压高温烧制材料的工艺来减少表面曲率，以及 LTF陶瓷层压机的底面。 构成：电阻图案和内部电极形成在第一低温共烧绿片上。 通孔形成在第二LTF（低温燃烧）生片上。 LTF陶瓷层压机通过层压第一和第二LTF生坯片形成。 制造HTF（高温烧制）生片，并在HTF生片上形成通孔。 通过在LTF陶瓷层压机的顶侧和底侧上粘合HTF生坯片来形成多层陶瓷基板。 LTF生片和HTF生片通过压制多层陶瓷基片而统一。 多层陶瓷基板的烧成工序在800〜900℃的温度下进行。 通过清洁和抛光HTF生片来形成LTCC基片。 表面电路图案印刷在LTCC衬底上。
-
公开(公告)号：KR1020040048004A
公开(公告)日：2004-06-07
申请号：KR1020020075750
申请日：2002-12-02
Applicant: 전자부품연구원
CPC classification number: H01B3/12 , C04B35/453 , C04B35/46 , C04B35/495 , C04B35/6303
Abstract: PURPOSE: Provided is a low temperature co-fired ceramic composition having a middle dielectric constant, which is excellent in a quality coefficient and a resonant frequency temperature coefficient. CONSTITUTION: The low temperature co-fired ceramic composition is produced by a process comprising the steps of: ball-milling ZnO, Nb2O5, TiO2 raw powders in the ratio of 1:1:2; calcining the milled powder at 950-1100deg.C; adding 0.1-1.0wt% of SnO2 powder to the first calcined powder and then calcining at 950-1100deg.C to obtain a second calcined powder; adding a low temperature-sintering agent to the second calcined powder and then ball-milling to obtain a mixture powder; molding the mixture powder to obtain an article; and calcining the article at 850-950deg.C.
Abstract translation: 目的：提供具有中等介电常数的低温共烧陶瓷组合物，其质量系数和共振频率温度系数优异。 构成：低温共烧陶瓷组合物通过包括以下步骤的方法制备：将ZnO，Nb 2 O 5，TiO 2原料粉末以1:1:2的比例球磨; 将研磨粉末煅烧至950-1100℃; 向第一煅烧粉末中添加0.1-1.0重量％的SnO 2粉末，然后在950-1100℃下煅烧，得到第二煅烧粉末; 向第二煅烧粉末中加入低温烧结剂，然后进行球磨，得到混合粉末; 将混合粉末成型得到制品; 并在850-950℃下煅烧文章。
-
公开(公告)号：KR1020040048000A
公开(公告)日：2004-06-07
申请号：KR1020020075744
申请日：2002-12-02
Applicant: 전자부품연구원
IPC: H05K3/46
CPC classification number: H05K3/4629 , H05K1/0306 , H05K3/1225 , H05K3/429
Abstract: PURPOSE: A flat LTCC(Low Temperature Cofired Ceramic) multilayer substrate having a resistor and a fabricating method thereof are provided to reduce the surface curvature by performing simultaneously a firing process and a process for laminating a high-temperature firing material on a top side and a bottom side of a LTF ceramic laminator. CONSTITUTION: A resistor pattern and an internal electrode are formed on a first low temperature cofired green sheet. A via is formed on a second LTF(Low Temperature Fired) green sheet. A LTF ceramic laminator is formed by laminating the first and the second LTF green sheets. An HTF(High Temperature Fired) green sheet is fabricated and a via is formed on the HTF green sheet. A multilayer ceramic substrate is formed by adhering the HTF green sheet on a top side and a bottom side of the LTF ceramic laminator. The LTF green sheet and the HTF green sheet are unified by pressing the multilayer ceramic substrate. A firing process for the multilayer ceramic substrate is performed under the temperature of 800 to 900 degrees centigrade. An LTCC substrate is formed by cleaning and polishing the HTF green sheet. A surface circuit pattern is printed on the LTCC substrate.
Abstract translation: 目的：提供一种具有电阻器的扁平LTCC（低温烧结陶瓷）多层基板及其制造方法，以通过同时进行焙烧工艺和在顶侧层压高温焙烧材料的工艺来降低表面曲率， LTF陶瓷层压机的底部。 构成：在第一低温共烧生片上形成电阻图案和内部电极。 在第二LTF（低温烧制）生坯上形成通孔。 通过层叠第一和第二LTF生片形成LTF陶瓷层压机。 制造HTF（高温烧制）生片，在HTF生片上形成通孔。 通过将HTF生片粘接在LTF陶瓷层压机的顶侧和底侧上来形成多层陶瓷基板。 通过挤压多层陶瓷基板将LTF生片和HTF生片均匀化。 多层陶瓷基板的烧成工序在800〜900℃的温度下进行。 通过清洗和研磨HTF生片来形成LTCC基片。 表面电路图案印刷在LTCC基板上。
-
公开(公告)号：KR1020010017373A
公开(公告)日：2001-03-05
申请号：KR1019990032856
申请日：1999-08-11
Applicant: 전자부품연구원
IPC: H01L23/48
Abstract: PURPOSE: A multiple-line grid array package is provided to simplify a manufacturing process, by soldering a multiple line grid on a package body in which an input/output node is arranged. CONSTITUTION: A semiconductor chip(13) is built in a package body, and a plurality of input/output nodes(12) are arranged on an upper surface of the package body(10). A multiple line grid(20) is soldered to the input/output node of the package body. The multiple line grid has a substrate(23) of a non-conductive material, and has the same size as the package body. A hole is located in a one-to-one correspondence with the input/output node. A unit lead(22) is formed by filling and applying a conductive material in the hole and soldered to the input/output node.
Abstract translation: 目的：提供多行网格阵列封装，以通过将多行网格焊接在其中布置输入/输出节点的封装体上来简化制造过程。 构成：半导体芯片（13）内置在封装主体中，并且多个输入/输出节点（12）布置在封装主体（10）的上表面上。 多线栅格（20）被焊接到封装体的输入/输出节点。 多线栅格具有非导电材料的衬底（23），并且具有与封装主体相同的尺寸。 孔与输入/输出节点一一对应地设置。 通过在孔中填充并施加导电材料并焊接到输入/输出节点来形成单元引线（22）。
-
Patent Agency Ranking
公开(公告)号：KR101472454B1
公开(公告)日：2014-12-16
申请号：KR1020130047127
申请日：2013-04-29
Applicant: 전자부품연구원
Abstract: 범용백색광원을이용한투과광원과반사광원을이용하여시료의실공간영상정보를획득하고, 이와동시에실공간영상정보에대한 2차원퓨리에분석을수행하여역공간으로전환하여역공간산란정보를분석하는장치를제공한다. 본발명에따른광 산란분석장치는, 분석하고자하는시료를올려놓을수 있는재물대; 상기재물대의높이를조절할수 있는높이제어모터; 범용백색광원으로구성된광원; 상기광원으로부터나온빛에의한상기시료의영상을획득하는영상획득장치; 상기영상획득장치에의해획득된영상을캡춰하는영상캡춰보드; 상기높이제어모터를구동하여상기재물대의높이를조절함으로써초점을자동으로제어하는초점제어부; 상기광원의전원및 광량을자동으로제어하는광원제어부; 상기영상캡춰보드에의해캡춰된영상데이터를처리하는데이터처리부; 및상기데이터처리부에의해처리된결과를표시하는표시부를포함한다.
-
公开(公告)号：KR1020110047781A
公开(公告)日：2011-05-09
申请号：KR1020090104542
申请日：2009-10-30
Applicant: 전자부품연구원
CPC classification number: H01L21/52
Abstract: PURPOSE: A semiconductor chip package method is provided to shorten the packaging time of a semiconductor chip by aligning and attaching a chip once through an exposure process using a dicing tape and a photomask. CONSTITUTION: A dicing tape(100) is attached to a wafer and the wafer is diced. The dicing tape is exposed through a photomask(300) including an exposure area to cover a diced chip area. A chip corresponding to the exposure area is attached to an attachment area by contacting the substrate with the dicing tape.
Abstract translation: 目的：提供一种半导体芯片封装方法，通过使用切割胶带和光掩模的曝光工艺对准和附接芯片来缩短半导体芯片的封装时间。 构成：将切割胶带（100）附接到晶片并切割晶片。 切割胶带通过包括曝光区域的光掩模（300）曝光以覆盖切片芯片区域。 通过使基板与切割带接触，将与曝光区域对应的芯片附着到安装区域。
-
公开(公告)号：KR1020110035540A
公开(公告)日：2011-04-06
申请号：KR1020090093308
申请日：2009-09-30
Applicant: 전자부품연구원
IPC: H01L33/50
Abstract: PURPOSE: An LED chip, an LED chip package, and an LED module for fishing squids are provided to have a blue LED and a fluorescent material layer optimized for collecting squids, thereby inexpensively maximizing squid collecting efficiency. CONSTITUTION: An LED chip comprises a blue LED(110) and a fluorescent material layer(120). The blue LED has an emitting wavelength which is in 405 to 470 nm. The blue LED comprises a first conductive semiconductor layer(111), a second conductive semiconductor layer(112), and an active layer(113). The fluorescent material layer is located on the light emitting surface of the blue LED. The fluorescent material layer comprises a fluorescent object(121) which converts the wavelength of light emitted from the blue LED into 480 to 500 nm.
Abstract translation: 目的：提供LED芯片，LED芯片封装和用于鱿鱼的LED模块，以具有蓝色LED和为收集鱿鱼而优化的荧光材料层，从而廉价地最大化鱿鱼收集效率。 构成：LED芯片包括蓝色LED（110）和荧光材料层（120）。 蓝色LED的发光波长为405〜470nm。 蓝色LED包括第一导电半导体层（111），第二导电半导体层（112）和有源层（113）。 荧光体层位于蓝色LED的发光面上。 荧光材料层包括将从蓝色LED发射的光的波长转换为480nm至500nm的荧光物体（121）。
-
公开(公告)号：KR100762824B1
公开(公告)日：2007-10-04
申请号：KR1020060118769
申请日：2006-11-29
Applicant: 전자부품연구원
Abstract: A conductive paste is provided to reduce a gap around a via hole to be formed during a constrained sintering process of low temperature co-fired ceramics. A conductive paste is filled in a via hole of a multi-layer ceramic substrate having a via hole and subsequently fired. The conductive paste comprises silver particles and a shrinkage retardant for enhancing an initial shrinkage temperature upon sintering. The shrinkage retardant is silver-palladium composite particles. The silver-palladium composite particles are contained in an amount of 5-35 parts by weight based on 100 parts by weight of the silver particles. The silver particles have a particle size of 0.5-5mum.
Abstract translation: 提供导电膏以减少在低温共烧陶瓷的约束烧结过程期间形成的通孔周围的间隙。 将导电膏填充在具有通孔的多层陶瓷基板的通孔中，然后烧制。 导电浆料包含银颗粒和用于在烧结时提高初始收缩温度的收缩阻燃剂。 收缩阻燃剂是银 - 钯复合颗粒。 相对于100重量份的银颗粒，银 - 钯复合颗粒的含量为5-35重量份。 银颗粒的粒径为0.5-5μm。
-
公开(公告)号：KR100716796B1
公开(公告)日：2007-05-14
申请号：KR1020050101115
申请日：2005-10-26
Applicant: 전자부품연구원
Abstract: 본 발명은 서로 다른 3개의 주파수 대역을 갖는 입출력 신호를 효과적으로 분리할 수 있는 트리플렉서에 관한 것이다.
본 발명에 따른 프리플렉서는, 트리플 밴드 안테나를 통해 수신되는 제1 내지 제3 주파수 대역의 신호 중 제1 및 제2 주파수 대역의 신호를 분리하는 다이플렉서와, 제3 주파수 대역의 신호를 통과시키는 필터와, 트리플 밴드 안테나와 다이플렉서 사이에 접속되어, 스위칭 제어신호에 따라 트리플 밴드 안테나 및 다이플렉서를 접속시키는 제1 스위치 및 트리플 밴드 안테나 및 제1 스위치의 접속점과 필터 사이에 접속되어, 스위칭 제어신호에 따라 트리플 밴드 안테나와 필터를 접속시키는 제2 스위치를 포함하여 이루어진다. 이에 의해, 본 발명에 따르면 상대 대역의 주파수 특성에 영향을 미치는 것을 방지할 수 있음은 물론 삽입손실 특성을 우수하게 할 수 있다.
트리플렉서, CDMA, GPS, PCS, 다이플렉서, BPF
-
-
-
-
-
-
-
-
-
Search Results
88
records
(took 0.021 seconds)
