Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus which enables more accurate alignment in a smaller time. SOLUTION: The method of producing a marker (11) on a substrate (W) includes projecting a patterned beam on a layer (R) of resist disposed on the substrate (W) in a lithographic apparatus to create a latent marker (10); and locally heating the substrate (W) at the marker location in the lithographic apparatus to transform the latent marker (10) into a detectable marker (11). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a device inspection method which has solved the conventional defects. SOLUTION: In the method, an asymmetrical marker on a device to be inspected is included; the form of the asymmetrical marker depends on the parameters to be inspected; a first measurement value of the position of the marker is obtained by directing light at the marker and detecting the diffracted light of a specified wavelength or of a diffracted angle; a secondary measured value of the position of the marker which is obtained by detecting the diffracted light of a different wavelength or at a different diffracted angle; a comparison between the first and second measurement positions which is performed so as to determine a shift indicating the degree of asymmetry of the marker. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
A lithographic apparatus includes an illumination system configured to condition a radiation beam, a support for a patterning device, a substrate table for a substrate, a projection system, and a control system. The patterning device is capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam. The projection system is configured to project the patterned radiation beam as an image onto a target portion of the substrate along a scan path. The scan path is defined by a trajectory in a scanning direction of an exposure field of the lithographic apparatus. The control system is coupled to the support, the substrate table and the projection system for controlling an action of the support, the substrate table and the projection system, respectively. The control system is configured to correct a local distortion of the image in a region along the scan path by a temporal adjustment of the image in that region, hereby reducing the intra-field overlay errors.
Abstract:
A lithographic system includes a lithographic apparatus and a scatterometer. In an embodiment, the lithographic apparatus includes an illumination optical system arranged to illuminate a pattern and a projection optical system arranged to project an image of the pattern on to a substrate (W). In an embodiment, the scatterometer includes a measurement system (2) arranged to direct a beam of radiation (10) onto a target pattern on said substrate (W) and to obtain an image of a pupil plane representative of radiation scattered from the target pattern. A computational arrangement (P4) represents the pupil plane by moment functions calculated from a pair of orthogonal basis function and correlates the moment function to lithographic feature parameters to build a lithographic system identification. A control arrangement uses the system identification to control subsequent lithographic processes performed by the lithographic apparatus.
Abstract:
A method of device inspection, the method comprising providing an asymmetric marker on a device to be inspected, the form of asymmetry of the marker being dependent upon the parameter to be inspected, directing light at the marker, obtaining a first measurement of the position of the marker via detection of diffracted light of a particular wavelength or diffraction angle, obtaining a second measurement of the position of the marker via detection of diffracted light of a different wavelength or diffraction angle, and comparing the first and second measured positions to determine a shift indicative of the degree of asymmetry of the marker.
Abstract:
METHOD AND APPARATUS FOR ANGULAR-RESOLVED SPECTROSCOPIC LITHOGRAPHY CHARACTERIZATION Both the 1st and 0th diffraction orders are detected in a scatterometer. The 1st diffraction orders are used to detect the overlay error. The 0[err] diffraction order is then used to flag if this is a false overlay error calculation of magnitude greater than the bias but smaller than the pitch of the grating. Fig 1 & 4 [Fig. 4]
Abstract:
The invention relates to a method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus. First a set of grid models is provided. Subsequently, alignment data are obtained by performing an alignment measurement on a plurality of alignment marks on a number of substrates. For each grid model it is checked whether the alignment data is suitable to solve the grid model. If so, the grid model is added to a subset of grid models. The grid model with lowest residuals is selected. In addition to alignment data, metrology data may be obtained by performing an overlay measurement on a plurality of overlay marks on the number of substrates. For each grid model of the subset simulated metrology data may then be determined that is used to determine overlay performance indicators. The grid model is then selected using the overlay performance indicators.