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127 records (took 0.028 seconds)

    32.
    发明专利
    未知

    公开(公告)号：DE112006001414A5

    公开(公告)日：2008-03-06

    申请号：DE112006001414

    申请日：2006-05-05

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG

    IPC: H01L33/48 ,  H01L33/62

    Abstract: A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.

    33.
    发明专利
    未知

    公开(公告)号：DE102005031336B4

    公开(公告)日：2008-01-31

    申请号：DE102005031336

    申请日：2005-07-05

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： KROMOTIS PATRICK ,  ENGL MORITZ ,  KUHN GERHARD ,  WANNINGER MARIO ,  GROETSCH STEFAN ,  BOGNER GEORG ,  HUETTNER JOSEF

    IPC: G03B21/14 ,  F21K2/00 ,  G02B27/18 ,  H01L33/58 ,  H01L33/60

    Abstract: A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size AM and a maximum acceptance angle α for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle &bgr;. At least one of the LED chips has a radiation decoupling area of the size AD. The relation 0.7·(AM·sin2(α))/(AD·sin2(&bgr;)·n2)≦̸N≦̸1.3·(AM·sin2(α))/(AD·sin2(&bgr;)·n2) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.

    37.
    发明专利
    未知

    公开(公告)号：DE102004045950A1

    公开(公告)日：2006-03-30

    申请号：DE102004045950

    申请日：2004-09-22

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  HIEGLER MICHAEL ,  WAITL GUENTER ,  BRUNNER HERBERT

    IPC: F21K99/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/60

    Abstract: A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

    38.
    发明专利
    未知

    公开(公告)号：DE112004000552D2

    公开(公告)日：2005-12-08

    申请号：DE112004000552

    申请日：2004-01-29

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： ARNDT KARLHEINZ ,  BOGNER GEORG ,  BRAUNE BERT ,  WAITL GUENTER

    IPC: H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/00 ,  H01L31/0203

    Abstract: Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip ( 1 ), which is disposed in a recess ( 2 ) of a housing base body ( 3 ) and is there encapsulated with an encapsulant ( 4 ) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip ( 1 ). The recess ( 2 ) comprises a chip well ( 21 ) in which the semiconductor chip ( 1 ) is secured, and a trench ( 22 ) that runs at least partway around the chip well ( 21 ) inside the recess ( 2 ), such that between the chip well ( 21 ) and the trench ( 22 ) the housing base body ( 3 ) comprises a wall ( 23 ) whose apex, viewed from a bottom face of the chip well ( 21 ), lies below the level of the surface of the housing base body ( 3 ) from which the recess ( 2 ) leads into the housing base body ( 3 ), and the encapsulant ( 4 ) extends outward from the chip well ( 21 ) over the wall into the trench ( 22 ). A corresponding housing base body is also disclosed.

    39.
    发明专利
    未知

    公开(公告)号：DE10319274A1

    公开(公告)日：2004-12-02

    申请号：DE10319274

    申请日：2003-04-29

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  GROETSCH STEFAN

    IPC: H01L33/58 ,  H01L33/00

    Abstract: A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.

    40.
    发明专利
    未知

    公开(公告)号：DE10245933A1

    公开(公告)日：2004-04-08

    申请号：DE10245933

    申请日：2002-09-30

    Applicant: SIEMENS AG ,  OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： BOGNER GEORG ,  BREINICH HERBERT ,  LUDEWIG BERND ,  MAYER RALF ,  NOLL HEINRICH ,  SORG JOERG-ERICH

    IPC: H01L25/075 ,  H01L33/60 ,  G09F9/35

    Abstract: The invention relates to a device for producing a bundled light flux. According to the invention, a light source consisting of a light emitting diode matrix is provided, an optical device for bundling and scattering the light produced by the light-emitting diodes is arranged between the light source and a light outlet. The device for bundling and scattering comprises a latticed reflector which respectively forms a light channel for each matrix point, the walls of said light channel being reflective, and the end of each light channel, facing the light source contains a convergent lens.

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