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公开(公告)号：JP2007112134A
公开(公告)日：2007-05-10
申请号：JP2006302593
申请日：2006-11-08
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： BOGNER GEORG DIPL PHYS , GRAMANN WOLFGANG , KROMOTIS PATRICK , MARCHL WERNER , SPAETH WERNER DR , WAITL GUENTHER
IPC: B29C33/38 , B29C39/02 , B29D11/00 , B29L11/00 , F21V5/04 , G02B3/00 , H01L21/56 , H01L25/075 , H01L33/00
CPC classification number: G02B3/0031 , B29D11/00278 , B29D11/00365 , F21V5/04 , F21Y2115/10 , G02B3/0056 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01019 , H01L2924/12041 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a rational manufacturing method of a lens mold suitable for manufacturing a lens area.
SOLUTION: When spheres are fully tightly arranged in a hexagonal housing part, a group of spheres spontaneously becomes a hexagonal lattice structure. Therefore the housing part can be completely filled with spheres to be shaped. Since the housing part 20 has a hexagonal cross section and the small spheres 22 are tightly mounted, the small spheres 22 can be arranged correspondingly to the hexagonal lattice structure. The small sphere 22 has a radius substantially corresponding to the radius of a micro lens 8 to be manufactured, and the small sphere 22 can be tightly housed in the housing part 20.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供适合于制造透镜区域的透镜模具的合理制造方法。 解决方案：当球体完全紧密地布置在六边形壳体部分中时，一组球自发地变成六边形格子结构。 因此，壳体部分可以被完全填充成球形。 由于壳体部件20具有六边形横截面并且小球体22紧密地安装，所以小球体22可以相对于六边形格子结构排列。 小球22具有与要制造的微透镜8的半径基本对应的半径，并且小球体22可以紧密地容纳在壳体部分20中。版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2006190684A
公开(公告)日：2006-07-20
申请号：JP2006000251
申请日：2006-01-04
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： WANNINGER MARIO , HOFFMANN MARKUS , WAITL GUENTHER , WILM ALEXANDER
IPC: F21S2/00 , F21S8/04 , F21V8/00 , F21Y101/02 , H01L33/00
CPC classification number: G02B6/003 , B60Q1/2611 , F21S43/14 , F21S43/237 , F21S43/245 , F21S43/247 , F21W2103/00 , F21W2103/20 , F21W2111/00 , F21Y2115/10 , G02B6/0038 , G02B6/0046 , G02B6/0055 , G02B6/008
Abstract: PROBLEM TO BE SOLVED: To improve a lighting device having a plurality of semiconductor light sources at low cost. SOLUTION: In the lighting device having a plurality of semiconductor light sources arranged on a support body, each of the light of the light sources enters into a predetermined light guide in a fixed angle for the normal plane of the support body so as to couple thereto. The light guide is constructed so as to equip a light reflection plane and a light emission plane in which the envelope surface of the light reflection plane forms a curved surface segment. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：以低成本改进具有多个半导体光源的照明装置。 解决方案：在具有布置在支撑体上的多个半导体光源的照明装置中，光源的每个光以固定的角度进入到支撑体的正常平面的预定光导中，以便 与其结合。 光导被构造成装备光反射面和光反射面的包络面形成曲面段的发光面。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2005322923A
公开(公告)日：2005-11-17
申请号：JP2005134682
申请日：2005-05-02
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： GUENTHER EWALD KARL MICHAEL , WAITL GUENTHER , BRUNNER HERBERT , STRAUS JOERG
IPC: H01L25/075 , H01L33/50 , H01L33/54 , H01L33/00
CPC classification number: H01L33/56 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting diode device which can be manufactured at a particularly low cost, and to provide a method of manufacturing the light-emitting diode device.
SOLUTION: A light-emitting diode device has at least one light-emitting diode chip 11, provided with a radiation emission surface 12 via which most of the electromagnetic radiation generated in the light-emitting diode chip is emitted; at least one light-emitting layer 13 positioned on the radiation emitting surface; and a housing 17 in which the light-emitting diode chip is embedded.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 解决的问题：提供可以以特别低的成本制造的发光二极管器件，并提供一种制造发光二极管器件的方法。 解决方案：发光二极管器件具有至少一个发光二极管芯片11，该发光二极管芯片11具有发射在发光二极管芯片中产生的大部分电磁辐射的辐射发射表面12; 位于辐射发射表面上的至少一个发光层13; 以及嵌入发光二极管芯片的壳体17。 版权所有（C）2006，JPO＆NCIPI
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4.发明专利Leadframe and housing for radiation emitting component, radiation emitting component and method for manufacturing the component 有权用于辐射发射部件的发光元件和壳体，辐射发射元件及其制造方法
公开(公告)号：JP2009200531A
公开(公告)日：2009-09-03
申请号：JP2009138210
申请日：2009-06-09
Applicant: Osram Opto Semiconductors Gmbh , オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH
Inventor： BOGNER GEORG DIPL PHYS , BRUNNER HERBERT , HIEGLER MICHAEL , WAITL GUENTHER
CPC classification number: H01L33/62 , H01L33/486 , H01L33/60 , H01L33/642 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01057 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a heat conduction means or a heat dissipation means improved so as to allow generation of optical high-output in a radiation emitting component.
SOLUTION: A thermal connection part 4 separately formed is inserted into and connected to a support section having a wire connection area 10 and connection strips 3a, 3b. A housing base body 1 is formed from a molding material, and a conductor frame 2 is embedded in the housing base body so that the electric connection strips are lead from the housing base body, and a thermal connection surface of the thermal connection part is thermally connectable from the outside. The housing base body includes a radiation emitting window 8, and the thermal connection part 4 is embedded in the housing base body so that a chip mounting area 11 is located in the radiation emitting window. A sidewall 9 of the radiation emitting window 8 is shaped as a reflection plane.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种改进的热传导装置或散热装置，以便在辐射发射部件中产生光学高输出。 解决方案：单独形成的热连接部分4插入并连接到具有导线连接区域10的支撑部分和连接条3a，3b。 壳体基体1由成型材料形成，导体框架2嵌入壳体基体内，使电连接带从壳体基体引出，热连接部的热连接面热 可从外部连接。 壳体基体包括辐射发射窗8，并且热连接部分4嵌入壳体基体中，使得芯片安装区域11位于辐射发射窗口中。 辐射发射窗8的侧壁9被成形为反射平面。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2000261165A
公开(公告)日：2000-09-22
申请号：JP2000059246
申请日：2000-03-03
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BACHL BERNHARD , WAITL GUENTHER
IPC: H05K7/12 , F21S8/10 , F21V5/00 , F21V19/00 , F21V29/00 , F21Y115/10 , H01L25/13 , H05K1/02 , H05K1/18
Abstract: PROBLEM TO BE SOLVED: To radiate optimally heat from an LED by a method wherein a plurality of rigid wiring boards are connected with each other at intervals on a main surface of a flexible wiring board, respectively, and further the LED is attached onto the flexible wiring board in a region of the rigid wiring board. SOLUTION: An LED multiple module comprises a plurality of bar-like or lever-like rigid wiring boards 2, and these rigid wiring boards 2 are mutually disposed at intervals, and are mounted on a flexible wiring board 1. A circuit 3 is attached onto the flexible rigid wiring board 2 with a solder, and comprises an LED 30 and a resistor 31, and the LED 30 is attached to a region of the rigid wiring board 2, and the resistor 31 is attached to a region of a flexible part of a flex board existing between the rigid wiring boards 2. Thus, it is possible to radiate optimally heat from the LED 30.
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Patent Agency Ranking
公开(公告)号：DE19536454B4
公开(公告)日：2006-03-09
申请号：DE19536454
申请日：1995-09-29
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： ARNDT KARLHEINZ , BRUNNER HERBERT , SCHELLHORN FRANZ , WAITL GUENTHER
IPC: H01L31/0203 , H01L31/0232 , H01L31/024 , H01L31/109 , H01L33/48 , H01L33/60 , H01L33/62 , H01L33/64
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公开(公告)号：DE10065381A1
公开(公告)日：2002-07-11
申请号：DE10065381
申请日：2000-12-27
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： ZEHNDER ULRICH , BRAUNE BERT , GRUBER STEFAN , WAITL GUENTHER
Abstract: The invention relates to a radiation-emitting semiconductor component with a luminescence conversion element (8). A reflector (7) is connected downstream of a semiconductor body (3), this reflector being coated with a luminescence conversion element (8) or containing a luminescence conversion element (8). Said luminescence conversion element (8) converts part of the radiation (6) that is emitted by the semiconductor body during operation in a first wavelength range into radiation (9) in a second wavelength range. The semiconductor body (3) and the luminescence conversion element (8) are preferably tuned to each other in such a way that mixed-colour white light is emitted.
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公开(公告)号：DE19945131A1
公开(公告)日：2001-04-12
申请号：DE19945131
申请日：1999-09-21
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： HOEHN KLAUS , WAITL GUENTHER
IPC: B23K1/00 , B23K101/36 , H01L23/00 , H01L23/12 , H01L31/02 , H01L33/38 , H01L33/40 , H01L33/48 , H01L33/62 , H05K3/34 , H01L23/28 , H01L33/00 , H01L23/482
Abstract: The invention relates to an electronic component comprising, in predetermined areas, soldered regions that are arranged on at least one outer surface, whereby the component is coated on its surface that is not formed by the soldered regions with a layer that prevents the adherence of soldering agents thereto. The invention also relates to a coating agent for reducing the amount of solder tailings.
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公开(公告)号：DE60038668D1
公开(公告)日：2008-06-05
申请号：DE60038668
申请日：2000-11-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BRAUNE BERT , WAITL GUENTHER , BOGNER GEORG , HINTZEN H T , VAN KREVEL J W H , BOTTY IR G
Abstract: Red emitting luminescent material with a host lattice of the nitridosilicate type MxSiyNz:Eu, wherein M is at least one of an alkaline earth metal chosen from the group Ca, Sr, Ba and wherein z = 2/3x + 4/3y.
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公开(公告)号：DE19947044B4
公开(公告)日：2006-11-16
申请号：DE19947044
申请日：1999-09-30
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： BOGNER GEORG , WAITL GUENTHER , HAENGGI ROLF
IPC: H01L21/56 , H01L23/28 , H01L23/48 , H01L25/16 , H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/60 , H01L33/62
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