公开(公告)号：JP2009200531A

公开(公告)日：2009-09-03

申请号：JP2009138210

申请日：2009-06-09

Applicant: Osram Opto Semiconductors Gmbh ,  オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH

Inventor： BOGNER GEORG DIPL PHYS ,  BRUNNER HERBERT ,  HIEGLER MICHAEL ,  WAITL GUENTHER

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a heat conduction means or a heat dissipation means improved so as to allow generation of optical high-output in a radiation emitting component.
SOLUTION: A thermal connection part 4 separately formed is inserted into and connected to a support section having a wire connection area 10 and connection strips 3a, 3b. A housing base body 1 is formed from a molding material, and a conductor frame 2 is embedded in the housing base body so that the electric connection strips are lead from the housing base body, and a thermal connection surface of the thermal connection part is thermally connectable from the outside. The housing base body includes a radiation emitting window 8, and the thermal connection part 4 is embedded in the housing base body so that a chip mounting area 11 is located in the radiation emitting window. A sidewall 9 of the radiation emitting window 8 is shaped as a reflection plane.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种改进的热传导装置或散热装置，以便在辐射发射部件中产生光学高输出。 解决方案：单独形成的热连接部分4插入并连接到具有导线连接区域10的支撑部分和连接条3a，3b。 壳体基体1由成型材料形成，导体框架2嵌入壳体基体内，使电连接带从壳体基体引出，热连接部的热连接面热 可从外部连接。 壳体基体包括辐射发射窗8，并且热连接部分4嵌入壳体基体中，使得芯片安装区域11位于辐射发射窗口中。 辐射发射窗8的侧壁9被成形为反射平面。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：DE102004031391B4

公开(公告)日：2009-06-04

申请号：DE102004031391

申请日：2004-06-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HIEGLER MICHAEL ,  SCHMID JOSEF ,  ENGL MORITZ ,  GROETSCH STEFAN ,  ARNDT KARLHEINZ ,  SCHNEIDER MARKUS ,  BOGNER GEORG

IPC: H01L23/60 ,  H01L23/10 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

公开(公告)号：DE102004051379A1

公开(公告)日：2006-03-23

申请号：DE102004051379

申请日：2004-10-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WAITL GUENTER ,  ROSE MONIKA ,  HIEGLER MICHAEL ,  WOLF MANFRED ,  BOGNER GEORG

IPC: H01L31/02 ,  G01B7/00 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58

Abstract: An apparatus having a least one fixing element is specified, the fixing element being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

公开(公告)号：DE102004031391A1

公开(公告)日：2006-01-26

申请号：DE102004031391

申请日：2004-06-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： HIEGLER MICHAEL ,  SCHMID JOSEF ,  ENGL MORITZ ,  GROETSCH STEFAN ,  ARNDT KARLHEINZ ,  SCHNEIDER MARKUS ,  BOGNER GEORG

IPC: H01L23/60 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

公开(公告)号：DE10117889A1

公开(公告)日：2002-10-24

申请号：DE10117889

申请日：2001-04-10

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： BOGNER GEORG ,  BRUNNER HERBERT ,  HIEGLER MICHAEL ,  WAITL GUENTHER

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/00 ,  H01L23/495 ,  H01S5/022

Abstract: Leadframe (2) comprises a chip assembly region, a wire connecting region (10) and external electrical connecting strips (3a, 3b). A support part is provided which is coupled with a thermal connecting part (4). Independent claims are also included for (a) a radiation-emitting component having a radiation-emitting chip and the leadframe; and (b) a process for the production of the semiconductor component.

公开(公告)号：DE102004064150B4

公开(公告)日：2010-04-29

申请号：DE102004064150

申请日：2004-06-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： ARNDT KARLHEINZ ,  HIEGLER MICHAEL ,  GROETSCH STEFAN ,  ENGL MORITZ ,  SCHNEIDER MARKUS ,  SCHMID JOSEF ,  BOGNER GEORG

IPC: H01L23/60 ,  H01L23/06 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H01S5/022

公开(公告)号：DE102006062066A1

公开(公告)日：2008-07-03

申请号：DE102006062066

申请日：2006-12-29

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： GROETSCH STEFAN ,  ENGL MORITZ ,  KOEHLER STEFFEN ,  BLUEMEL SIMON ,  HIEGLER MICHAEL ,  ZEILER THOMAS

IPC: H01L33/58

Abstract: The lens arrangement (6) has a lens (8) with a lens surface and an optical axis, which penetrates the lens surface of the lens. The lens arrangement has a transparent transitional body (10), which is firmly coupled to the lens on the lens surface, which is more temperature-resistant than the lens, and which has an optical axis that is parallel to the optical axis of the lens. An independent claim is also included for a light emitting diode display device with a housing and an opening.

公开(公告)号：DE10221857A1

公开(公告)日：2003-11-27

申请号：DE10221857

申请日：2002-05-16

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WINTER MATTHIAS ,  WAITL GUENTER ,  HIEGLER MICHAEL ,  BOGNER GEORG

IPC: H01L21/52 ,  H01L21/60 ,  H01L23/08 ,  H01L33/62 ,  H01L21/58 ,  H01L33/00

Abstract: Process for applying a semiconductor chip (9) on a thermal and/or electrically conducting connecting part (12) arranged in or on a plastic housing body (5) comprises using a soft soldering process. Independent claims are also included for the following: (1) Optoelectronic semiconductor component; and (2) Process for the production of the optoelectronic semiconductor component.

公开(公告)号：DE102007004807A1

公开(公告)日：2008-08-07

申请号：DE102007004807

申请日：2007-01-31

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： WEBERPALS FRANK ,  BLUEMEL SIMON ,  GRUBER STEFAN ,  HIEGLER MICHAEL ,  SORG JOERG ERICH ,  OSWALD FLORIN ,  BRAUNE BERT

IPC: H01L33/58

Abstract: The LED has a reflector (11), where a semiconductor chip, which is suitable for transmitting light, is fastened relative to the reflector. A lens (10) is suitable for conducting the transmitted light from the semiconductor chip during operation. A casting compound (12) is arranged between the semiconductor chip and the lens. A stand (103,104,105,106) is connected integrally with the lens and extends in a direction, which exhibits a direction portion, which is aligned in a direction of the semiconductor chip.

公开(公告)号：WO2008080390A3

公开(公告)日：2008-09-25

申请号：PCT/DE2007002321

申请日：2007-12-21

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH ,  GROETSCH STEFAN ,  ENGL MORITZ ,  KOEHLER STEFFEN ,  BLUEMEL SIMON ,  HIEGLER MICHAEL ,  ZEILER THOMAS

Inventor： GROETSCH STEFAN ,  ENGL MORITZ ,  KOEHLER STEFFEN ,  BLUEMEL SIMON ,  HIEGLER MICHAEL ,  ZEILER THOMAS

IPC: G02B7/02 ,  H01L33/58

CPC classification number: G02B7/028 ,  H01L33/58

Abstract: A lens arrangement (6) for an LED display device (2) comprises a lens (8). The lens (8) has a first lens surface, and an optical axis. The optical axis penetrates the first lens surface of the lens (8). The lens arrangement (6) further comprises a transparent transitional body (10), which is firmly coupled to the lens (8) on the first lens surface, which is more temperature-resistant than the lens (8), and which has an optical axis that is parallel to the optical axis of the lens (8).

Abstract translation: 用于LED显示装置（2）的透镜装置（6）包括透镜（8）。 所述透镜（8）具有第一透镜表面和光轴。 光轴穿过透镜（8）的第一透镜表面。 此外，透镜装置（6）包括被固定到第一透镜表面和（8）被耦合在所述透镜的透明的过渡体（10），它是温度比透镜（8），并具有光轴，所述光学平行于耐 是透镜（8）的轴线。