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    3차원 형태의 구리 나노구조물 및 그 형성 방법
    37.
    发明公开
    3차원 형태의 구리 나노구조물 및 그 형성 방법 有权
    三维铜纳米结构及其制备方法

    公开(公告)号：KR1020150015130A

    公开(公告)日：2015-02-10

    申请号：KR1020130090733

    申请日：2013-07-31

    Applicant: 아주대학교산학협력단

    Inventor： 조성운 ,  김창구

    IPC: C23C18/22 ,  C23C18/31 ,  C23F4/00 ,  H01L21/3065

    CPC classification number: C23F1/12 ,  B22F1/0018 ,  B22F1/0044 ,  B22F9/02 ,  B22F2001/0037 ,  B22F2304/05 ,  B81C1/00492 ,  B81C2201/0187 ,  B81C2201/034 ,  C23C18/1605 ,  C23C18/1657 ,  C23C18/1893 ,  C23C18/405 ,  C23F4/00 ,  H01J2237/0203 ,  H01J2237/3341 ,  H01L21/288 ,  Y10T29/49982

    Abstract: The present invention relates to a method of forming a three-dimensional copper nanostructure which includes steps of: manufacturing a test piece in a structure including an SiO2 mask; etching a plasma inclined in multiple directions to form a three-dimensional etching structure layer on the test piece; coating to enable metal to be filled in the portion in which the plasma inclined in multiple directions is etched; removing an overcoated portion and the SiO2 mask from the metal; and removing portions besides the metal which is the three-dimensional etching structure layer from the surface of the test piece. According to the present invention, to overcome a limitation of a focused ion beam etching (FIBE) method for manufacturing a copper nanostructure, a high-density plasma is used for etching the plasma inclined in multiple directions on a large test piece arranged on a faraday box, a copper film is formed on a gap of the etched test piece, and the overcoated copper film and the SiO2 mask are removed, thereby forming uniform arrays of a copper nanostructure, and being able to randomly control a diameter of the copper nanostructure for high applicability.

    Abstract translation: 本发明涉及一种形成三维铜纳米结构的方法，包括以下步骤：在包括SiO 2掩模的结构中制造试片; 蚀刻沿多个方向倾斜的等离子体，在试片上形成三维蚀刻结构层; 涂覆以使金属能够被填充在其中等离子体在多个方向上倾斜的部分被蚀刻; 从金属中除去外涂部分和SiO 2掩模; 从该试片的表面除去作为三维蚀刻结构层的金属以外的部分。 根据本发明，为了克服用于制造铜纳米结构的聚焦离子束蚀刻（FIBE）方法的限制，使用高密度等离子体在布置在法拉第的大型试片上蚀刻沿多个方向倾斜的等离子体 在蚀刻试验片的间隙上形成铜膜，除去外涂铜膜和SiO 2掩模，形成均匀的铜纳米结构体阵列，能够随机控制铜纳米结构体的直径 适用性高。

    톱니 모양의 단면을 갖는 실린더 채널 및 이를 포함하는 동축 채널 및 이의 제조방법
    38.
    发明公开
    톱니 모양의 단면을 갖는 실린더 채널 및 이를 포함하는 동축 채널 및 이의 제조방법 有权
    具有锯齿状交叉部分的圆柱体通道和相同通道的制备方法

    公开(公告)号：KR1020120072653A

    公开(公告)日：2012-07-04

    申请号：KR1020100134507

    申请日：2010-12-24

    Applicant: 고려대학교 산학협력단

    Inventor： 이상훈 ,  강에드워드

    IPC: G01N35/08 ,  G01N33/48

    CPC classification number: B81B1/002 ,  B01L3/502707 ,  B01L3/502746 ,  B01L2300/0816 ,  B01L2300/0858 ,  B01L2300/0887 ,  B01L2400/086 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C1/00103 ,  B81C1/00634 ,  B81C99/0085 ,  B81C2201/019 ,  B81C2201/034 ,  C12N5/0618 ,  C12N2535/00 ,  Y10T428/13

    Abstract: PURPOSE: A cylindrical channel for a micro fluid chip, a method for manufacturing the same, a coaxial channel including the cylindrical channel, and a method for manufacturing the coaxial channel are provided to improve the performance of a mixer or a uniform agitator by inducing unstable fluid. CONSTITUTION: A cylindrical channel for a micro fluid chip includes saw-toothed grooves on the cross section. The cross section of the cylinder channel is tapered or constant. The thicknesses of the grooves are in a range between 3 and 15um. The widths of the grooves are in a range between 5 and 15um. Gaps between the grooves are in a range between 10 and 20um. A method for manufacturing the cylinder channel includes the following: a film is located on a base mold with a mold groove and a pressure adjusting hole; and pressures to the film are adjusted to arrange a plurality of saw-toothed grooves on the upper side of the film.

    Abstract translation: 目的：提供一种用于微流体芯片的圆柱形通道，其制造方法，包括圆柱形通道的同轴通道和用于制造同轴通道的方法，以通过诱导不稳定的方式来改善混合器或均匀搅拌器的性能 流体。 构成：用于微流体芯片的圆柱形通道在横截面上包括锯齿槽。 气缸通道的横截面为锥形或恒定。 槽的厚度在3和15um之间的范围内。 槽的宽度在5和15um之间的范围内。 槽之间的间隙在10和20um之间的范围内。 一种制造气缸通道的方法包括：一个薄膜位于具有模槽和压力调节孔的基模上; 并且调节胶片的压力以在胶片的上侧布置多个锯齿形凹槽。

    마이크로 부품 복제를 위한 마이크로 몰드 및 그제조방법
    39.
    发明公开
    마이크로 부품 복제를 위한 마이크로 몰드 및 그제조방법 失效
    用于复制微型零件的微型模具及其制造方法，用于在镍丝模具上涂覆镍 - 钨合金

    公开(公告)号：KR1020040094460A

    公开(公告)日：2004-11-10

    申请号：KR1020030028246

    申请日：2003-05-02

    Applicant: 전자부품연구원

    Inventor： 박준식 ,  황완식 ,  박순섭 ,  조진우 ,  정석원 ,  이인규

    IPC: B81C1/00

    CPC classification number: B81C1/00031 ,  B29C33/38 ,  B29C33/42 ,  B81C1/00444 ,  B81C2201/034

    Abstract: PURPOSE: A micro mold for reproducing micro parts and a method for manufacturing the same are provided to achieve a mechanical characteristic superior to that of a Ni plating mold by performing Ni plating for a master mold and sequentially coating an Ni-W alloy on the Ni plating. CONSTITUTION: A method for manufacturing a micro mold includes a first process of forming an Ni master mold(200) by performing electroplating on developed and etched sections of a substrate, a second process of coating an Ni-W alloy(300a) on an upper surface of the Ni master mold(200), and a third process of removing a photoresist from the substrate. While performing the first process, current is applied through a direct current scheme, a pulse scheme, or a pulse-reverse scheme. The pulse-reverse scheme is carried out by using a plastic injection molding material.

    Abstract translation: 目的：提供一种用于再现微型部件的微型模具及其制造方法，以通过对母模进行Ni镀层并在Ni上依次涂覆Ni-W合金来实现优于Ni镀覆模具的机械特性 电镀。 构成：微型模具的制造方法包括：通过在基板的显影和蚀刻部分上进行电镀来形成Ni母模（200）的第一工序，在上部涂覆Ni-W合金（300a）的第二工序 Ni母模（200）的表面，以及从基板去除光致抗蚀剂的第三工序。 在执行第一过程时，通过直流方案，脉冲方案或脉冲反向方案施加电流。 脉冲反向方案通过使用塑料注射成型材料进行。

    박막 칩 레플리카 제조방법 및 이를 사용하여 제조된 마이크로 플루이딕 칩
    40.
    发明公开
    박막 칩 레플리카 제조방법 및 이를 사용하여 제조된 마이크로 플루이딕 칩 有权
    薄芯片复制的制造方法和薄切片复制制造的微流控芯片

    公开(公告)号：KR1020140026075A

    公开(公告)日：2014-03-05

    申请号：KR1020120093027

    申请日：2012-08-24

    Applicant: 한국표준과학연구원

    Inventor： 박상열 ,  김영호

    IPC: G01N35/08 ,  G01N35/00 ,  B81B7/00

    CPC classification number: B01L3/502707 ,  B01L2300/0816 ,  B81B2201/058 ,  B81C99/0085 ,  B81C2201/034

    Abstract: The present invention relates to a method for producing a thin film chip replica and a method for producing a microfluidic chip using a film chip replica produced by the method and, more specifically, to a method for producing a film chip replica by injecting hardening-type polymer solution to the top of a microfluidic chip mold and by performing processes for coating, hardening, and heteromorphism of the hardening-type polymer solution to produce film hardening-type polymer solution having a particular thickness by using a blade having microcracks, and to a method for producing a microfluidic chip through a step of bonding plate substrates at the bottom and the top of the film chip replica produced thereby. The microfluidic chip having the film chip replica according to the present invention analyzes particular amino acids or proteins to be utilized for disease diagnosis, food analysis, and biochemistry. Tissue cells can be cultured in the microfluidic chip, and medical or biological experiments can be performed through the cultured tissue cells.

    Abstract translation: 本发明涉及一种薄膜芯片复制品的制造方法和使用该方法制造的薄膜芯片复制品的微流控芯片的制造方法，更具体地说，涉及一种通过注入硬化型的薄膜芯片复制品的制造方法 聚合物溶液到微流体芯片模具的顶部并且通过执行硬化型聚合物溶液的涂覆，硬化和异相的方法，以通过使用具有微裂纹的刮板产生具有特定厚度的薄膜硬化型聚合物溶液，并且 通过在由其制造的薄膜芯片副本的底部和顶部粘合平板基板的步骤来制造微流体芯片的方法。 具有根据本发明的膜芯片复制品的微流体芯片分析用于疾病诊断，食品分析和生物化学的特定氨基酸或蛋白质。 可以在微流体芯片中培养组织细胞，并且可以通过培养的组织细胞进行医学或生物学实验。

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