公开(公告)号：WO1994022281A1

公开(公告)日：1994-09-29

申请号：PCT/JP1994000327

申请日：1994-02-28

Applicant: FUJITSU LIMITED ,  MISHIRO, Hidehiro ,  TSUBONE, Kenichiro ,  ABE, Mitsunori ,  TAKADA, Rie

Inventor： FUJITSU LIMITED

IPC: H05K03/46

CPC classification number: H05K1/162 ,  H01F17/0006 ,  H03H1/00 ,  H03H7/0115 ,  H03H7/175 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/165 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09309 ,  H05K2201/09945

Abstract: This invention provides a laminated circuit board capable of setting constants of various circuit devices mounted on the laminated circuit board by selective connection between wiring layers, and a laminated circuit board capable of arbitrarily setting distributed circuit constants in a high frequency wiring layer interposed between two shield wiring layers. The laminated circuit board includes a plurality of wiring layers (11-1m) each having a conductive pattern formed on an insulator layer, a connection wiring layer (2) laminated on the surface of a plurality of laminated wiring layers, a plurality of terminal patterns (21 to 2n, 20) formed in a mutually insulated state on the connection wiring layer, a plurality of vias (P1 to Pn) for electrically connecting at least two of the terminal patterns to the corresponding patterns of the wiring layers, and connection means for connecting mutually and selectively the terminal patterns.

Abstract translation: 本发明提供一种层叠电路板，其能够通过布线层之间的选择性连接来设置安装在层叠电路板上的各种电路装置的常数，以及能够任意设置插入在两个屏蔽层之间的高频布线层中的分布电路常数的层叠电路板 接线层。 层压电路板包括：多个布线层（11-1m），其各自具有形成在绝缘体层上的导电图案，层叠在多个层叠布线层的表面上的连接布线层（2），多个端子图案 （21〜2n，20），连接配线层上形成为相互绝缘状态的多个通孔（P1〜Pn），用于将至少两个端子图案电连接到布线层的相应图案，以及连接装置 用于连接和选择性地连接端子图案。

公开(公告)号：WO1993026146A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000148

申请日：1993-06-10

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K07/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: According to a process for producing a thermal layout, not only massive heat sinks are provided for absorbing heat, but also an optimized number of thermoconductive strips which distribute the heat over the printed circuit board. In the collecting zones are arranged higher capacity sinks into which the heat is transmitted. The thermoconductive strips may be thermoconductors (TL) provided for that purpose and more massive than the conductive strips for the electric connections, or conductive strips for electric connections, the electroconductors (EL), may also be used for heat transfer. An optimum design interconnects the TL'S and EL's into a functional whole, a thermal management network. With a certain technique, which could be called pocket groove technique, "cooling channels" of a type may be created. Such thermoconductors may be included in the electric layout, so that a thermal layout is superimposed on the connection layout (TL/EL network). Heat distribution and transfer may thus be calculated and optimized by a computer in the same way as the electric distribution by the conductive strips, i.e. the known electric layout, which is produced by a computer-assisted process.

公开(公告)号：WO2016109652A1

公开(公告)日：2016-07-07

申请号：PCT/US2015/068038

申请日：2015-12-30

Applicant: ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY

Inventor： JIANG, Hanqing ,  LV, Cheng ,  YU, Hongyu

IPC: H01B5/08 ,  H01B7/06 ,  H01B1/08

CPC classification number: H05K1/11 ,  H01L23/145 ,  H01L23/49866 ,  H01L23/5387 ,  H01M2/202 ,  H05K1/0283 ,  H05K1/09 ,  H05K1/14 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09263 ,  H05K2201/09945 ,  H05K2201/10037

Abstract: The invention provides an electronic device that includes a first functional body, a second functional body, and at least one connection member connecting the first functional body to the second functional body. The at least one connection member has a spiral pattern, and is suspended in air to allow tor stretching, flexing or compressing.

Abstract translation: 本发明提供了一种电子设备，其包括第一功能体，第二功能体以及将第一功能体连接到第二功能体的至少一个连接构件。 至少一个连接构件具有螺旋图案，并且悬挂在空气中以允许拉伸，弯曲或压缩。

公开(公告)号：WO2015068544A1

公开(公告)日：2015-05-14

申请号：PCT/JP2014/077433

申请日：2014-10-15

Applicant: 株式会社オートネットワーク技術研究所 ,  住友電装株式会社 ,  住友電気工業株式会社

Inventor： 蜂矢　賀一

IPC: H02G3/16 ,  H05K1/02 ,  H05K7/06

CPC classification number: B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

Abstract: 　電気接続箱の防水構造に寄らずとも浸水後の車両火災の発生を防止することができる、新規な構造の電気接続箱を提供すること。　電源ラインに接続された電源側バスバー２８ｃと、グランドラインに接続されたグランド側バスバー２８ｄを含んだ複数のバスバー２８ａ～ｇが絶縁板２６ａ，２６ｂ上に配設されてなるバスバー回路体１２を備えた電気接続箱１０において、電源側バスバー２８ｃとグランド側バスバー２８ｄが隣接配置されている一方、電源側バスバー２８ｃとグランド側バスバー２８ｄの隣接隙間から露呈する絶縁板２６ａの露呈部４４ａ～ｃに対して、酸化物堆積阻止構造４２が施されているようにした。

Abstract translation: 提供一种具有新颖结构的电连接盒，通过该电连接盒，可以防止在电连接盒暴露于水之后发生车辆火灾，而不管电连接盒是否具有防水结构。 该电气接线盒（10）设置有汇流条电路体（12），该汇流条电路体（12）包括多个汇流条（28a-28g），包括连接到电源线和地面的电源侧汇流条（28c） 所述多个汇流条（28a-28g）设置在绝缘板（26a，26b）上，其中，所述电源侧母线（28c）和所述接地线路（28c） 侧面汇流条（28d）彼此相邻设置，并且在相邻的电源侧母线28c之间的间隙露出的绝缘板（26a）的露出部分（44a-44c）上设置氧化物聚集防止结构（42） 侧母线（28c）和接地侧母线（28d）。

公开(公告)号：WO2005096442A1

公开(公告)日：2005-10-13

申请号：PCT/JP2005/006584

申请日：2005-03-29

Applicant: 東海ゴム工業株式会社 ,  別所 久美 ,  佐藤 秀之 ,  佐藤 明生 ,  下村 政嗣 ,  田中 賢 ,  薮 浩

Inventor： 別所 久美 ,  佐藤 秀之 ,  佐藤 明生 ,  下村 政嗣 ,  田中 賢 ,  薮 浩

IPC: H01R11/01

CPC classification number: H01R12/7076 ,  C09J7/22 ,  C09J7/26 ,  C09J2201/128 ,  C09J2201/602 ,  H01R13/2414 ,  H05K3/323 ,  H05K2201/0116 ,  H05K2201/09945 ,  H05K2201/10378 ,  Y10T428/24322

Abstract: 　接続信頼性を維持しつつ、被接続物のさらなる狭ピッチ化に対応可能であり、また、従来に比較して低コストな異方性導電膜およびその製造方法を提供すること。膜厚方向に貫通した多数の孔部を有し、孔部はハニカム状に配列されるとともに孔部の内壁面は外側方向に湾曲されている、高分子よりなる多孔質膜と、この多孔質膜の孔部内に充填された導電性物質と、多孔質膜の両面に被覆された接着層とを備えた異方性導電膜とする。また、多孔質膜の形成には、水と混ざらず、揮発する有機溶媒中に高分子を溶かし、この高分子溶液をキャストした支持基板を、高湿度条件下に存在させる手法などを用いる。

Abstract translation: 与现有技术相比，能够以较低的成本提供适用于要连接的物体的较窄间距，同时保持连接可靠性的各向异性导电膜。 还提供了制造这种各向异性导电膜的方法。 各向异性导电膜设置有多孔膜。 该薄膜具有许多沿着膜厚度方向穿透的孔部，其内壁面在外部方向弯曲而呈蜂窝状配置，并且由聚合物形成。 膜还设置有施加在多孔膜的孔中的导电材料和覆盖多孔膜两侧的粘合剂层。 多孔膜通过以下方法形成：其中聚合物在不与水混合的挥发性有机溶剂中熔融，并且通过浇铸聚合物溶液制成的支撑板允许在高湿度条件下存在。

公开(公告)号：WO1995018476A1

公开(公告)日：1995-07-06

申请号：PCT/US1994013353

申请日：1994-11-15

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： MINNESOTA MINING AND MANUFACTURING COMPANY ,  KOSKENMAKI, David, C. ,  CALHOUN, Clyde, D.

IPC: H01R13/24

CPC classification number: H01R13/2414 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/104 ,  Y10T428/1452 ,  Y10T428/25 ,  Y10T428/28

Abstract: The present invention provides electrically conductive sheet materials (10) that contain columns of electrically conductive particles aligned to form continuous columns (19) between lateral faces of the conductive sheet material (10). The particle columns (19) are arranged so that the sheet is conductive through the thickness, but is electrically insulating in lateral directions. The present invention also provides methods by which such electrically conductive sheet materials (10) can be made. The present invention is able to provide conductive pathways in a precise, regular array, at a very fine pitch.

Abstract translation: 本发明提供了一种导电片材材料（10），其包含排列成在导电片材（10）的侧面之间形成连续柱（19）的导电颗粒柱。 颗粒柱（19）被布置成使得片材在厚度上是导电的，但在横向上是电绝缘的。 本发明还提供了可以制造这种导电片材（10）的方法。 本发明能够以非常细的间距以精确的，规则的阵列提供导电路径。

公开(公告)号：WO1993026143A1

公开(公告)日：1993-12-23

申请号：PCT/CH1993000145

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG ,  SCHMIDT, Walter ,  MARTINELLI, Marco

Inventor： DYCONEX PATENTE AG

IPC: H05K03/00

CPC classification number: H05K3/4655 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/42 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4635 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The initial intention in the semi-finished product of the invention is to provide a functional separation between the requirement for mechanical strength and the previously concomitant requirement, for completing a circuit, in order to bring the pure circuit connection, especially for signals, "closer" to the electrical and technical properties of chips. To do this, the layout miniaturisation is optimised without regard for the mechanical strength of the substrate. Instead of a printed circuit board (MCM), a semi-finished product which can be developed into a printed circuit board is made. The semi-finished product of the invention consists of an extremely thin film (8) with a plurality of extremely small holes (14) made simultaneously by an etching process. The hole diameters can be reduced by almost an order of magnitude (down to 20 mu m), facilitating, for instance, definite sub-100 mu m technology. Such a semi-finished product (19) does not act as a mechanical support but is designed only for signal conduction. The semi-finished product (19) which carries the densely packed wiring pattern, is bonded to a not densely packed power supply plane (22) acting as the service plane and the printed circuit board thus made is finally secured to a mechanical support (20).

公开(公告)号：KR101039889B1

公开(公告)日：2011-06-09

申请号：KR1020107028883

申请日：2007-05-28

Applicant: 히타치가세이가부시끼가이샤

Inventor： 시미즈,다께히로 ,  오까니와,가오루 ,  후꾸시마,나오끼

IPC: H01B5/16 ,  H01L31/042

CPC classification number: H05K3/323 ,  H01L31/0512 ,  H01L31/18 ,  H05K2201/09945 ,  Y02E10/50 ,  Y10T428/25

Abstract: 본 발명의 도전성 접착 필름은 태양 전지 셀의 표면 전극과, 배선 부재를 전기적으로 접속하기 위한 도전성 접착 필름이며, 절연성 접착제 (2)와 도전성 입자 (1)을 함유하고, 상기 도전성 입자 (1)의 평균 입경을 r(㎛), 상기 도전성 접착 필름의 두께를 t(㎛)로 할 때, (t/r)의 값이 0.75 내지 17.5의 범위 내이고, 상기 도전성 입자 (1)의 함유량이 상기 도전성 접착 필름의 전체 부피를 기준으로 1.7 내지 15.6 부피％인 것이다.

Abstract translation: 导电和粘接膜，绝缘性粘接剂2和导电性粒子1所含，以及导电性粒子（1）用于本发明的导电性粘接薄膜是光伏电池的表面电极和配线部件电之间的电连接 （T / r）在0.75〜17.5的范围内，导电性粒子（1）的含量为导电性（1） 基于粘合剂膜的总体积为1.7至15.6体积％。

公开(公告)号：KR1020090088793A

公开(公告)日：2009-08-20

申请号：KR1020090005936

申请日：2009-01-23

Applicant: 세이코 엡슨 가부시키가이샤

Inventor： 사이멘무네히데

IPC: C09J7/02 ,  C09J9/02

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2203/0425 ,  Y10T428/254 ,  H01L2924/00 ,  C09J7/20 ,  C09J9/02

Abstract: A conductive adhesive film is provided to reduce costs in electrical connection between terminals using the conductive adhesive film and to improve connection reliability between the terminals. A plurality of conductive particles(3) are dispersed on a conductive adhesive film(1) in the insulating adhesive materials(2). Each conductive particle has predetermined intervals(P) is arranged in the insulating adhesive material. The conductive adhesive film electrically connects the first terminal and the second terminal. The first terminal and the second terminal comprise a plurality of terminal parts(102t) arranged to the respective first direction (H).

Abstract translation: 提供导电粘合膜以降低使用导电粘合剂膜的端子之间的电连接成本并提高端子之间的连接可靠性。 多个导电颗粒（3）分散在绝缘粘合材料（2）中的导电粘合膜（1）上。 每个导电颗粒在绝缘粘合剂材料中布置有预定间隔（P）。 导电粘合膜将第一端子和第二端子电连接。 第一端子和第二端子包括布置在相应的第一方向（H）上的多个端子部分（102t）。

公开(公告)号：JP6004192B2

公开(公告)日：2016-10-05

申请号：JP2013229217

申请日：2013-11-05

Applicant: 株式会社オートネットワーク技術研究所 ,  住友電装株式会社 ,  住友電気工業株式会社

Inventor： 蜂矢 賀一

IPC: H05K7/06 ,  H02G3/16

CPC classification number: B60R16/03 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K3/4626 ,  B60R16/0239 ,  H05K1/0265 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617