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    INTEGRATED CIRCUIT PACKAGE WITH LEAD STOPS
    32.
    发明申请
    INTEGRATED CIRCUIT PACKAGE WITH LEAD STOPS 审中-公开
    集成电路包与引脚

    公开(公告)号：WO2006091940A1

    公开(公告)日：2006-08-31

    申请号：PCT/US2006/006853

    申请日：2006-02-27

    Applicant: TEXAS INSTRUMENTS INCORPORATED ,  LANGE, Bernhard ,  BOYD, William, David

    Inventor： LANGE, Bernhard ,  BOYD, William, David

    IPC: H01L23/495 ,  H01L23/36 ,  H05K1/18 ,  H05K7/06

    CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: An integrated circuit (IC) package (100) comprises an IC (102) and leads (104) coupled to the IC. Each lead has a first end (106) configured to be coupled to the integrated circuit and a second end (108) configured to pass through one of a plurality of mounting holes (110) extending through a mounting board (112). The leads comprise at least one positioning lead (114) comprising a stop (118) being a continuous part of the positioning lead and having a lateral dimension (120) greater than a diameter (122) of a first hole (124) of the plurality of mounting holes. The leads further comprise at least one non-positioning lead (116) having a continuous uniformly shaped body (130) with a lateral dimension (132) less than a diameter (134) of a second hole (136) of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

    Abstract translation: 集成电路（IC）封装（100）包括耦合到IC的IC（102）和引线（104）。 每个引线具有被配置为耦合到集成电路的第一端（106）和被配置为穿过延伸穿过安装板（112）的多个安装孔（110）中的一个的第二端（108）。 引线包括至少一个定位引线（114），该定位引线（114）包括作为定位引线的连续部分的止动件（118），并且具有大于多个第一孔（124）的直径（122）的横向尺寸（120） 的安装孔。 引线还包括至少一个具有连续均匀成形的主体（130）的非定位引线（116），其横向尺寸（132）小于多个安装孔中的第二孔（136）的直径（134） 。 停止限制非定位导线通过第二个孔的延伸。

    COMPONENT FOR A PRINTED CIRCUIT BOARD AND METHOD FOR FITTING A PRINTED CIRCUIT BOARD WITH THIS COMPONENT
    33.
    发明申请
    COMPONENT FOR A PRINTED CIRCUIT BOARD AND METHOD FOR FITTING A PRINTED CIRCUIT BOARD WITH THIS COMPONENT 审中-公开
    COMPONENT用于电路板和方法用于装配电路板，此组件

    公开(公告)号：WO2005006821A3

    公开(公告)日：2005-04-14

    申请号：PCT/EP2004007440

    申请日：2004-07-07

    Applicant: ROSENBERGER HOCHFREQUENZTECH ,  BLAKBORN WILLEM

    Inventor： BLAKBORN WILLEM

    IPC: H01R12/71 ,  H05K1/18 ,  H05K3/34 ,  H01R12/20

    CPC classification number: H01R12/707 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10787

    Abstract: The invention relates to a component for a printed circuit board (32) comprising a housing (10) on which at least one peg (28) is formed for engaging inside a hole (30) of the printed circuit board (32). This peg (28) has at least one detent lug (52) that projects in a radial direction with regard to the peg (28) beyond the outer periphery thereof. The detent lug (52) is placed and formed on the peg (28) in such a manner that the outer periphery of the peg (28) is smaller in the area of the detent lug (52) than the diameter of the hole (30) in the printed circuit board (32). The outer periphery of the section of the peg (28) projecting into the hole (30) in the printed circuit board (32) is formed in such a manner that, between the outer periphery of this section and the inner wall of the hole (30) in the printed circuit board (32), a space having a capillarity for solder is formed over at least a portion of the outer periphery, whereby during a soldering process, solder (50) located on the surface of the printed circuit board (32) enters, by means of capillary action, the space while filling the same.

    Abstract translation: 本发明涉及一种用于电路板具有用于与印刷电路板的一个孔（30）卡​​合的壳体（10），其上的至少一个销（28）的组件（32），（32）形成，所述销（28）的至少一个 ， 闩锁凸耳（52），其突出于相对于径向方向。在其外圆周上的销（28）的。 这里，闩锁凸耳（52）被布置在所述销上的方式（28）形成为使得在锁定凸耳的区域中的销（28）的外圆周（52）是在印刷电路板（32），其特征在于，比所述孔（30）的直径小 在印刷电路板（32）突出的销的部分中的孔（30）的外周（28）被形成为使得。 本节中的印刷电路板（32）在所述外周的一部分的外周和孔（30）的内​​壁之间，以毛细管作用为地块这样的间隙使至少该期间所述电路板（32）焊料的表面上的焊接工艺befindliches（50 ）通过毛细管作用进入该空间和穿入该填充。

    Method of arranging socket to circuit board and socket using the method
    36.
    发明专利
    Method of arranging socket to circuit board and socket using the method 审中-公开
    使用该方法将插座安装到电路板和插座的方法

    公开(公告)号：JP2005026213A

    公开(公告)日：2005-01-27

    申请号：JP2004142650

    申请日：2004-05-12

    Applicant: Yamaichi Electronics Co Ltd ,  山一電機株式会社

    Inventor： MASAKI HIROAKI ,  UCHIUMI TAKUMA ,  MATSUOKA NORIYUKI

    IPC: H01L23/32 ,  H01R13/24 ,  H01R33/74 ,  H01R33/76 ,  H01R43/20 ,  H05K3/30 ,  H01R12/22

    CPC classification number: H01R12/58 ,  H01R12/7023 ,  H01R13/24 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2201/10787

    Abstract: PROBLEM TO BE SOLVED: To provide a method of arranging and installing a socket on a board in which an ordinary printed-circuit board can be used, and which can be applied to various diameters of through holes in the printed-circuit board by the amount of sliding of the socket, and in which stable and steady contact between the conductive layer and the terminal of the socket at the inner peripheral part or peripheries of the through hole of the printed-circuit board can be obtained in a plurality of points, and the soldering work of the terminal of the socket can be eliminated, and a socket using this method. SOLUTION: The method is composed of a process of inserting a contact of a socket into a through hole of the printed-circuit board and a process of sliding the socket to the printed-circuit board. Thereby, the contact is made to contact electrically the through hole of the printed-circuit board. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：提供一种在可以使用普通印刷电路板的板上布置和安装插座的方法，并且可以应用于印刷电路板中的各种直径的通孔 通过插座的滑动量，可以以多种方式获得导电层与插座端子之间在印刷电路板的通孔的内周部分或周边处的稳定接触， 点，并且可以消除插座端子的焊接工作，以及使用该方法的插座。 解决方案：该方法包括将插座的触点插入印刷电路板的通孔的过程和将插座滑动到印刷电路板的过程。 由此，使接触件与印刷电路板的通孔电接触。 版权所有（C）2005，JPO＆NCIPI

    Electronic device including printed circuit board and electronic element mounted on the printed circuit board
    38.
    发明公开
    Electronic device including printed circuit board and electronic element mounted on the printed circuit board 有权
    与印刷电路板和电子装置安装在印刷电路板上的电子元件上

    公开(公告)号：EP2034809A2

    公开(公告)日：2009-03-11

    申请号：EP08013851.4

    申请日：2008-08-01

    Applicant: DENSO CORPORATION

    Inventor： Honda, Takayoshi ,  Hozuka, Minoru

    IPC: H05K3/34

    CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

    Abstract: An electronic device (100) includes a printed circuit board (31) and an electronic element (50) having a terminal (52). The terminal (52) has a surface section (60) and an insertion section (59). The printed circuit board (31) includes a through hole (33) extending from a first surface to a second surface of the printed circuit board (31), a surface land (34) disposed on the first surface, and an insertion land (35) integrally disposed on a sidewall of the through hole (33) and on a periphery around the through hole (33). The surface section (60) is coupled with the surface land (34) through a solder (72). The insertion section (59) is disposed in the through hole (33) and is coupled with the insertion land (35) through the solder (72). The surface section (60) has a recess part (62) and a portion of recess part (62) is disposed so as to be axially aligned with a portion of the through hole (33).

    Abstract translation: 一种电子设备（100）包括印刷电路板（31）和电子元件（50）具有一个端子（52）。 终端（52）具有一个表面部分（60），并在插入部（59）。 所述印刷电路板（31）包括通孔（33）从第一表面延伸到所述印刷电路板（31），设置在所述第一表面上的表面国家（34）的第二表面上，并在插入国家（35 ）一体地设置在所述通孔（33的侧壁）和围绕所述通孔（33）的周边。 表面部分（60）耦合与表面国家（34）通过焊料（72）。 插入部（59）在通孔（33），其设置和耦接所述插入国家（35）通过所述焊料（72）。 表面部分（60）具有凹部（62）和凹部（62）被布置成与所述通孔（33）的一部分轴向对齐的部分。

    BAUTEIL FÜR EINE LEITERPLATTE UND VERFAHREN ZUM BESTÜCKEN EINER LEITERPLATTE MIT DIESEM BAUTEIL
    39.
    发明公开
    BAUTEIL FÜR EINE LEITERPLATTE UND VERFAHREN ZUM BESTÜCKEN EINER LEITERPLATTE MIT DIESEM BAUTEIL 有权
    COMPONENT用于电路板

    公开(公告)号：EP1645013A2

    公开(公告)日：2006-04-12

    申请号：EP04740752.3

    申请日：2004-07-07

    Applicant: Rosenberger Hochfrequenztechnik GmbH & Co.

    Inventor： BLAKBORN, Willem

    IPC: H01R12/20 ,  H05K3/34

    CPC classification number: H01R12/707 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2201/10787

    Abstract: The invention relates to a component for a printed circuit board (32) comprising a housing (10) on which at least one peg (28) is formed for engaging inside a hole (30) of the printed circuit board (32). This peg (28) has at least one detent lug (52) that projects in a radial direction with regard to the peg (28) beyond the outer periphery thereof. The detent lug (52) is placed and formed on the peg (28) in such a manner that the outer periphery of the peg (28) is smaller in the area of the detent lug (52) than the diameter of the hole (30) in the printed circuit board (32). The outer periphery of the section of the peg (28) projecting into the hole (30) in the printed circuit board (32) is formed in such a manner that, between the outer periphery of this section and the inner wall of the hole (30) in the printed circuit board (32), a space having a capillarity for solder is formed over at least a portion of the outer periphery, whereby during a soldering process, solder (50) located on the surface of the printed circuit board (32) enters, by means of capillary action, the space while filling the same.

    Leuchtdiode
    40.
    发明公开
    Leuchtdiode 审中-公开
    LED

    公开(公告)号：EP0940861A2

    公开(公告)日：1999-09-08

    申请号：EP99103171.7

    申请日：1999-02-18

    Applicant: E.G.O. Control Systems GmbH & Co. KG

    Inventor： Gänsler, Walter

    IPC: H01L33/00

    CPC classification number: H05K3/306 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/301 ,  H05K2201/10106 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00

    Abstract: Eine Leuchtdiode umfassend einen Anschlußpins (30) einbettenden Basiskörper (10) und einen daran anschließenden Leuchtkörper (20), wobei der Leuchtkörper (20) einen kleineren Durchmesser als der Basiskörper (10) aufweist, ist dadurch gekennzeichnet, daß die axiale Länge des Basiskörpers (l G ) größer ist als die axiale Länge des Leuchtkörpers (l L ).

    Abstract translation: 一种发光二极管，包括一连接销（30）埋设在基体（10）和一个相邻的发光体（20），其中，所述发光体（20）具有比所述基体更小的直径（10）的特征在于，所述基体的轴向长度（ LG）比发光元件（LL）的轴向长度更大。

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