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公开(公告)号：US09713245B2
公开(公告)日：2017-07-18
申请号：US15058502
申请日：2016-03-02
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Yoshito Fujimura , Yuu Sugimoto
CPC classification number: H05K1/0213 , G11B5/4853 , H05K1/118 , H05K1/18 , H05K1/181 , H05K3/341 , H05K2201/05 , H05K2203/048 , Y02P70/613
Abstract: A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals arranged in parallel to be spaced apart from each other, and a second insulating layer disposed on the first insulating layer so as to cover the conductive pattern. Each of the terminals includes a main body portion and a protruding portion protruding from the main body portion and having a dimension in a parallel arrangement direction of the terminals which is shorter than a dimension of the main body portion thereof. The second insulating layer includes a plurality of end-portion covering portions disposed individually on both end portions of the main body portion in the parallel arrangement direction and exposing a middle portion of the main body portion and the protruding portion.
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公开(公告)号：US09693448B2
公开(公告)日：2017-06-27
申请号：US14926195
申请日：2015-10-29
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Xian-Qin Hu , Ming-Jaan Ho
CPC classification number: H05K1/0219 , H05K1/0221 , H05K1/024 , H05K1/0296 , H05K3/022 , H05K3/06 , H05K3/4697 , H05K2201/05 , H05K2201/0715
Abstract: A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line and the opening portions, and are connected to each end of each ground line. Each electromagnetic interference shielding layer covers one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the portions of each gap not covered by the two photosensitive resin layers to define a receiving chamber. Each end of each receiving chamber communicates with one opening portion of the corresponding gap to define a cavity.
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公开(公告)号：US09674949B1
公开(公告)日：2017-06-06
申请号：US14266700
申请日：2014-04-30
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H05K1/0283 , H05K1/028 , H05K1/09 , H05K1/11 , H05K1/118 , H05K1/145 , H05K2201/0137 , H05K2201/0162 , H05K2201/032 , H05K2201/05 , H05K2201/10287
Abstract: A stretchable wire assembly includes a metal wire coupled between two elastic substrates. The two elastic substrates are selectively coupled together, and the metal wire is attached to one or both elastic substrates at select locations. The form of the metal wire is such that when the elastic substrates are in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the coupled elastic substrates. The tortuous path of the metal wire provides slack such that as the elastic substrates are stretched the slack is taken up. Once released, the elastic substrates move from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path.
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公开(公告)号：US09661743B1
公开(公告)日：2017-05-23
申请号：US14565247
申请日：2014-12-09
Applicant: Multek Technologies Ltd.
Inventor： Mark Bergman , Joan K. Vrtis
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.
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公开(公告)号：US09622342B2
公开(公告)日：2017-04-11
申请号：US14335710
申请日：2014-07-18
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Yang-Wan Kim , Won-Kyu Kwak
CPC classification number: H05K1/028 , H05K1/0277 , H05K1/0283 , H05K1/118 , H05K1/147 , H05K1/189 , H05K3/361 , H05K2201/05 , H05K2201/055 , H05K2201/09027 , H05K2201/09418 , H05K2201/10128 , H05K2201/10681
Abstract: Provided is a display apparatus. The display apparatus includes a display panel including a substrate including a display region in which a display unit is located, a non-display region that extends outward from the display region and in which a plurality of pads are located, and a sealing portion that covers the display unit. The display apparatus also includes a circuit board including a flexible film and a plurality of terminals on the flexible film that are electrically coupled to the plurality of pads. The plurality of pads are spaced from each other along a first direction of the display panel and pad central points of the plurality of pads are located at at least two different locations along the first direction.
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Patent Agency Ranking
公开(公告)号：US20170094784A1
公开(公告)日：2017-03-30
申请号：US14865632
申请日：2015-09-25
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： William L. BRODSKY , James A. BUSBY , Phillip Duane ISAACS , David C. LONG
CPC classification number: H05K1/0275 , H05K1/0298 , H05K1/034 , H05K1/09 , H05K1/183 , H05K3/12 , H05K3/30 , H05K3/301 , H05K3/46 , H05K5/0208 , H05K7/023 , H05K2201/015 , H05K2201/05 , H05K2201/055 , H05K2201/056
Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming at least one resistive network. The circuit lines are disposed on at least one of the first or second side of the at least one flexible layer, and have a line width Wl≦200 μm, as well as a line-to-line spacing width Ws≦200 μm. In certain enhanced embodiments, the tamper-respondent sensor includes multiple flexible layers, with a first flexible layer having first circuit lines, and a second flexible layer having second circuit lines, where the first and second circuit lines may have different line widths, different line-to-line spacings, and/or be formed of different materials.
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公开(公告)号：US20170064832A1
公开(公告)日：2017-03-02
申请号：US14989921
申请日：2016-01-07
Applicant: SK hynix Inc.
Inventor： Seung Yeop Lee , Joo Hyun Kang , Jong Hoon Kim , Han Jun Bae
CPC classification number: H05K1/028 , H01L23/5383 , H01L23/5384 , H01L23/5386 , H01L23/5387 , H01L2224/48227 , H01L2224/48228 , H01L2224/97 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H05K1/14 , H05K1/147 , H05K2201/0385 , H05K2201/05 , H05K2201/058 , H01L2924/00012
Abstract: A flexible device includes a first conductive pattern, a second conductive pattern, and a dielectric layer. The first conductive pattern includes a first sliding contact portion and a first extension portion. The second conductive pattern includes a second sliding contact portion overlapping with the first sliding contact portion and the second conductive pattern includes a second extension portion. The second sliding contact portion is in contact with the first sliding contact portion and is movable on the first sliding contact portion for a sliding motion. The first and second conductive patterns are embedded in the dielectric layer.
Abstract translation: 柔性器件包括第一导电图案，第二导电图案和介电层。 第一导电图案包括第一滑动接触部分和第一延伸部分。 第二导电图案包括与第一滑动接触部分重叠的第二滑动接触部分，并且第二导电图案包括第二延伸部分。 第二滑动接触部分与第一滑动接触部分接触并可在第一滑动接触部分上移动以进行滑动。 第一和第二导电图案嵌入在介电层中。
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公开(公告)号：US20170006738A1
公开(公告)日：2017-01-05
申请号：US14882168
申请日：2015-10-13
Applicant: LG ELECTRONICS INC.
Inventor： Joseph LEE , Byungsoo KIM
CPC classification number: H05K7/20963 , G02F1/13452 , G06F1/203 , H04B1/3888 , H05K1/148 , H05K5/0017 , H05K2201/041 , H05K2201/05 , H05K2201/10128
Abstract: There is disclosed a mobile terminal including a display unit comprising a drive IC provided in a predetermined portion, a frame provided in a rear surface of the display unit, a flexible printed circuit board having one portion connected to the drive IC of the display unit and the other portion bent toward the rear surface of the display unit, a main board coupled to the frame and configured to control the drive IC via the flexible printed circuit board, and a heat transfer sheet configured to cover a front surface of the display unit and a predetermined portion of the first surface of the flexible printed circuit board, wherein at least predetermined portion of the heat transfer sheet is in contact with the frame, so that the heat generated in the drive IC and the light source of the display unit may be transferred to the frame and that the performance deterioration of the mobile terminal caused by the local overheat may be reduced and the difficulty in the user's holding the mobile terminal may be also reduced.
Abstract translation: 公开了一种移动终端，包括：显示单元，包括设置在预定部分中的驱动IC，设置在显示单元的后表面中的框架;柔性印刷电路板，其一部分连接到显示单元的驱动IC; 所述另一部分朝向所述显示单元的后表面弯曲;主板，其联接到所述框架并且被配置为经由所述柔性印刷电路板控制所述驱动IC;以及传热片，其被配置为覆盖所述显示单元的前表面，以及 柔性印刷电路板的第一表面的预定部分，其中传热片的至少预定部分与框架接触，使得在驱动IC和显示单元的光源中产生的热量可以是 转移到帧，并且可能减少由局部过热引起的移动终端的性能恶化，并且用户持有移动设备的难度 终端也可以减少。
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公开(公告)号：US09504148B1
公开(公告)日：2016-11-22
申请号：US14957426
申请日：2015-12-02
Inventor： Jonathan Douglas Hatch , Stephen McGarry Hatch
CPC classification number: H05K1/0306 , H05K1/02 , H05K1/028 , H05K1/0393 , H05K1/115 , H05K1/144 , H05K3/0023 , H05K3/0064 , H05K3/007 , H05K3/048 , H05K3/103 , H05K3/125 , H05K3/386 , H05K3/389 , H05K3/4611 , H05K3/4644 , H05K2201/0145 , H05K2201/0154 , H05K2201/05 , H05K2201/09009 , H05K2203/0152
Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.
Abstract translation: PCB页面空白包括柔性基板，可固化粘合剂，导电层和导电层支撑件。 柔性基板在其上接收不透明的负电路图案。 不会被电路图案遮挡的可固化粘合剂的部分可能在暴露于光时粘合到导电层的部分。 导电层的接合部分从导电层的非接合部分剪切或撕裂，使得接合部分保留在柔性基板上，并且当柔性基板和导电层支撑时，非接合部分保留在导电层支撑件 被分开 因此，柔性基板和导电层的接合部分形成PCB原型，其中导电层的接合部分形成电路图案的电路迹线。
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公开(公告)号：US20160334927A1
公开(公告)日：2016-11-17
申请号：US15222541
申请日：2016-07-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Soo Kim , Keun Sik Lee
CPC classification number: G06F3/0416 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , G06F2203/04104 , G06F2203/04111 , H05K1/028 , H05K1/0298 , H05K2201/0145 , H05K2201/05 , H05K2201/10128
Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.
Abstract translation: 公开了触摸面板及其制造方法。 触摸面板可以包括基板，在基板上的透明电极基体，透明电极基底上的第一透明电极，并且在第一方向上延伸，第二透明电极在第二方向上延伸。 触摸面板的制造方法可以包括准备基板和透明电极基板，在透明电极基板上形成透明电极，在透明电极基板上形成电极材料。
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