公开(公告)号：KR1020120096754A

公开(公告)日：2012-08-31

申请号：KR1020110016038

申请日：2011-02-23

Applicant: 삼성전자주식회사

Inventor： 신효영 ,  박태상 ,  문영준 ,  홍순민

IPC: H01L23/48 ,  H01L23/12

CPC classification number: H01L25/0657 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/014

Abstract: PURPOSE: A three-dimensional stack structure of a wafer chip using an interposer is provided to reduce the size of a PBA(Printed Board Assembly) without separately packaging each wafer chip. CONSTITUTION: A first wafer chip(110) is mounted on a printed circuit board. A second wafer chip(120) is stacked on an upper side of the first wafer chip. A first interposer(140) is interposed between the second wafer chip and a printed circuit board in order to electrically connect the second wafer chip and the printed circuit board. The first wafer chip is electrically connected to the printed circuit board by a solder joint.

Abstract translation: 目的：提供使用插入器的晶片芯片的三维堆叠结构，以在不分开封装每个晶片芯片的情况下减小PBA（印刷电路板组件）的尺寸。 构成：将第一晶片芯片（110）安装在印刷电路板上。 第二晶片芯片（120）堆叠在第一晶片芯片的上侧。 为了电连接第二晶片芯片和印刷电路板，第一插入件（140）插入在第二晶片芯片和印刷电路板之间。 第一晶片芯片通过焊接点与印刷电路板电连接。

公开(公告)号：KR1020120070290A

公开(公告)日：2012-06-29

申请号：KR1020100131789

申请日：2010-12-21

Applicant: 삼성전자주식회사

Inventor： 박태상 ,  문영준 ,  홍순민 ,  신효영 ,  장경운

IPC: H05K3/46 ,  H05K1/18

Abstract: PURPOSE: A printed circuit board assembly is provided to stably combine a first circuit board with a second circuit board by forming protrusions in all junctions of a second circuit board and an upper layer of a first circuit board. CONSTITUTION: A second circuit board(32) is laminated on a first circuit board(31). An interposer(33) is located between the first circuit board and the second circuit board. The interposer includes a through via(330) inside. A first junction unit(351a) connects the first circuit board to the interposer. A second junction unit(351b) connects the second circuit board to the interposer.

Abstract translation: 目的：提供一种印刷电路板组件，用于通过在第二电路板和第一电路板的上层的所有接合处形成突起来稳定地组合第一电路板与第二电路板。 构成：在第一电路板（31）上层压第二电路板（32）。 插入件（33）位于第一电路板和第二电路板之间。 插入器包括内部的通孔（330）。 第一接合单元（351a）将第一电路板连接到插入器。 第二接合单元（351b）将第二电路板连接到插入器。

公开(公告)号：KR1020120009713A

公开(公告)日：2012-02-02

申请号：KR1020100070116

申请日：2010-07-20

Applicant: 삼성전자주식회사

Inventor： 장경운 ,  박승배 ,  문영준 ,  홍순민 ,  정창규 ,  김대중 ,  홍상일

IPC: H05K13/04 ,  H01L21/205

CPC classification number: H05K3/305 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83209 ,  H01L2224/83851 ,  H01L2224/83862 ,  H05K3/323 ,  H05K2203/0278 ,  H05K2203/068 ,  Y02P70/613 ,  H01L2924/00012

Abstract: PURPOSE: A manufacturing device of a printed circuit board assembly and a manufacturing method thereof are provided to prevent solder usage compare to an existing surface mount technology process, thereby reducing the purchase price for solder material and costs required for printing. CONSTITUTION: A manufacturing device(10) for a printed circuit board assembly comprises a stage(20), a printed circuit board(30), a conductive adhesive material(31), various kinds of electronic components(40), and a fixing unit(50). The stage is formed into a flat shape with metal materials. The stage comprises a heater(22). The conductive adhesive material comprises an adhesive material used for attaching a component to a substrate such as a resin including solder, a non-conductive paste(NCP), or an anisotropic conductive film(ACF). The various kinds of electronic components are able to be installed on the printed circuit board. The fixing unit comprises a housing(51), a buffer member(52), elastic granules(53), a pressurization member(54), and a heater(55).

Abstract translation: 目的：提供印刷电路板组件的制造装置及其制造方法，以防止与现有的表面贴装技术工艺相比的焊料使用，从而降低焊料材料的购买价格和印刷所需的成本。 构成：用于印刷电路板组件的制造装置（10）包括台（20），印刷电路板（30），导电粘合材料（31），各种电子部件（40）和固定单元 （50）。 舞台用金属材料形成平面形状。 舞台包括加热器（22）。 导电性粘合剂材料包括用于将组分附着到诸如包括焊料，非导电浆料（NCP）或各向异性导电膜（ACF）的树脂的基底的粘合剂材料。 各种电子部件能够安装在印刷电路板上。 固定单元包括壳体（51），缓冲构件（52），弹性颗粒（53），加压构件（54）和加热器（55）。

公开(公告)号：KR1020100102846A

公开(公告)日：2010-09-27

申请号：KR1020090021114

申请日：2009-03-12

Applicant: 삼성전자주식회사

Inventor： 장경운 ,  홍순민 ,  김미진 ,  허균

IPC: H05K1/18 ,  H05K3/30

Abstract: PURPOSE: In a process of mounting in the printed circuit board the printed circuit board assembly and manufacturing method thereof is the circuit device, by omitting the process where the heating like the reflow process is required the lamination phenomenon is prevented. CONSTITUTION: A circuit device is arranged on film. The circuit device is molded by spreading the resin(30) on film. Film is removed from the mold(40). The mold is adhered in the printed circuit board(80). The circuit device is arranged on film. The location corresponding to the lead(11) of the arranged circuit device digs up in film to intaglio. The circuit device is arranged on film.

Abstract translation: 目的：在安装印刷电路板的过程中，印刷电路板组件及其制造方法是电路装置，通过省略需要像回流处理那样的加热的过程，防止层压现象。 构成：电路设备配置在胶片上。 通过将树脂（30）铺展在膜上来模制电路装置。 从模具（40）中取出膜。 模具粘附在印刷电路板（80）中。 电路装置配置在胶片上。 与布置的电路装置的引线（11）相对应的位置在电影中挖成凹版。 电路装置配置在胶片上。

公开(公告)号：KR1020100006883A

公开(公告)日：2010-01-22

申请号：KR1020080067189

申请日：2008-07-10

Applicant: 삼성전자주식회사

Inventor： 허균 ,  문영준 ,  홍순민 ,  장세영 ,  김정웅

IPC: H01R12/51 ,  H05K5/02 ,  H04B1/38

Abstract: PURPOSE: An apparatus for interconnection between a PCB and a component mounting case is provided to reduce the number of the assembly processes of a product by integrally forming a connection unit. CONSTITUTION: A connection unit(10) is integrally projected at a predetermined height in a component mounting case(1). The connection unit is connected to a PCB(Printed Circuit Board) by using a circuit pattern(1a) formed in an upper side. The connection unit includes a ground unit(11) electrically connected to the ground surface of the PCB. The connection unit includes a supporting part(12) which electrically connects the ground unit and the ground surface as supporting the connection state.

Abstract translation: 目的：提供一种用于PCB和组件安装壳体之间的互连的装置，以通过整体地形成连接单元来减少产品的组装过程的数量。 构成：连接单元（10）在组件安装壳体（1）中以预定高度一体地投影。 连接单元通过使用形成在上侧的电路图案（1a）连接到PCB（印刷电路板）。 连接单元包括电连接到PCB的接地表面的接地单元（11）。 连接单元包括支撑连接状态的电连接地面单元和地面的支撑部分（12）。

公开(公告)号：KR1020090055673A

公开(公告)日：2009-06-03

申请号：KR1020070122418

申请日：2007-11-29

Applicant: 삼성전자주식회사

Inventor： 신효영 ,  정승부 ,  문영준 ,  홍순민 ,  이창용 ,  구자명 ,  김현태 ,  이종범 ,  한현주

IPC: H05K1/02

CPC classification number: H05K3/361 ,  H05K3/328 ,  H05K3/3452 ,  H05K3/363 ,  H05K2201/09881 ,  H05K2201/0989 ,  H05K2203/0285 ,  H05K2203/167 ,  Y10T29/49126

Abstract: A printed circuit board assembly and a manufacturing method for the same are provided to prevent the increase of resistance by maximizing a junction area of a first electrode terminal and a second electrode terminal. A printed circuit board assembly comprises a first printed circuit board(10), a second printed circuit board(20), and a separation preventing member(12). A plurality of first electrode terminals(11) are formed on the first printed circuit board, and a plurality of second electrode terminals(21) are formed on the second printed circuit board. A separation preventing member prevents the separation of the first and a second electrode terminal from a right position in ultrasonic welding.

Abstract translation: 提供一种印刷电路板组件及其制造方法，以通过最大化第一电极端子和第二电极端子的接合面积来防止电阻的增加。 印刷电路板组件包括第一印刷电路板（10），第二印刷电路板（20）和防分离部件（12）。 多个第一电极端子（11）形成在第一印刷电路板上，并且多个第二电极端子（21）形成在第二印刷电路板上。 分离防止部件防止第一和第二电极端子从超声波焊接中的正确位置分离。

公开(公告)号：KR100653075B1

公开(公告)日：2006-12-04

申请号：KR1020050110327

申请日：2005-11-17

Applicant: 삼성전자주식회사

Inventor： 홍순민 ,  노상훈 ,  장지영

IPC: H05K3/30 ,  H05K3/32

Abstract: A manufacturing method of a circuit board with a flip chip is provided to apply a mask of plane and a normal squeeze by forming a cream solder is provided to reduce a manufacturing cost and improve yield by applying a mask of a plane and a normal squeeze by forming a cream solder when the flip chip is not mounted on a substrate material. A manufacturing method of a circuit board with a flip chip includes the steps of printing a cream solder on a substrate material, at an area where electronic parts except for the flip chip are mounted and mounting the electronic parts except for the flip chip on the cream solder, wherein the cream solder contains at least one of a tin, a silver, and a copper(S100,S200) and mounting the flip chip on an area provided for the flip chip(S500).

Abstract translation: 提供具有倒装芯片的电路板的制造方法以通过形成膏状焊料来施加平面掩模和普通挤压，以通过应用平面掩模和普通挤压来降低制造成本并提高成品率 当倒装芯片未安装在基板材料上时形成膏状焊料。 具有倒装芯片的电路板的制造方法包括以下步骤：在基板材料上，除了倒装芯片之外的电子部件的安装区域上印刷膏状焊料，并将除了倒装芯片之外的电子部件安装在膏体上 焊料，其中膏状焊料包含锡，银和铜中的至少一种（S100，S200），并将倒装芯片安装在倒装芯片所提供的区域上（S500）。