公开(公告)号：KR1020130016784A

公开(公告)日：2013-02-19

申请号：KR1020110078897

申请日：2011-08-09

Applicant: 성균관대학교산학협력단

Inventor： 정승부 ,  김용일 ,  윤재현 ,  최돈현

IPC: C23C18/50 ,  H05K3/18

Abstract: PURPOSE: An optimum palladium content in ENEPIG(electroless nickel / electroless palladium / immersion gold) surface treatment for enhancing mechanical properties is provided to obtain the maximum reliability of the surface treatment by maintaining palladium content to be 0.04 wt% or less. CONSTITUTION: An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating palladium on the electroless nickel plating; and a step of plating gold on the palladium plating. The content of palladium is 0.04 wt% or less. An ENEPIG surface treatment comprises a step of plating electroless nickel on a printed circuit board; a step of plating electroless palladium on the electroless nickel plating; and a step of plating gold on the electroless palladium plating. Solder ball may be welded on the gold plating. After welding the solder ball put on component side through reflow, the substrate put on the substrate of the board side is weld again through reflow. [Reference numerals] (AA,DD,II) Solder ball; (BB) Plating process layer; (CC) Printed circuit board(PCB); (EE) Gold planting; (FF) Pd planting(0.02,0.04,0.06 wt%); (GG) Nickel planting; (HH) Copper circuit surface(PCB); (JJ) Cross-sectional diagram of binding the solder ball after planting nickel, palladium and gold on the PCB copper circuit surface

Abstract translation: 目的：提供用于增强机械性能的ENEPIG（无电镍/无电镀钯/浸金）表面处理中的最佳钯含量，以通过将钯含量保持在0.04重量％以下来获得表面处理的最大可靠性。 构成：ENEPIG表面处理包括在印刷电路板上电镀无电镀镍的步骤; 在化学镀镍上镀钯的步骤; 以及在镀钯上镀金的步骤。 钯的含量为0.04重量％以下。 ENEPIG表面处理包括在印刷电路板上电镀无电镀镍的步骤; 在化学镀镍上电镀无电镀钯的步骤; 以及在无电镀钯电镀上镀金的步骤。 焊球可以焊接在镀金上。 在通过回流焊焊接在组件侧的焊球之后，通过回流再次焊接放置在基板侧的基板上的基板。 （附图标记）（AA，DD，II）焊球; （BB）电镀工艺层; （CC）印刷电路板（PCB）; （EE）金种植; （FF）Pd种植（0.02,0.04,0.06重量％）; （GG）镍种植; （HH）铜电路表面（PCB）; （JJ）在PCB铜电路表面上种植镍，钯和金之后结合焊球的横截面图

公开(公告)号：KR101199660B1

公开(公告)日：2012-11-08

申请号：KR1020110069910

申请日：2011-07-14

Applicant: 성균관대학교산학협력단

Inventor： 정승부 ,  김용일 ,  최돈현

IPC: H01J17/16 ,  H01J17/49 ,  G02F1/1333 ,  B23K20/12

Abstract: PURPOSE: A reinforcement frame for a display panel and a manufacturing method thereof are provided to effectively emit heat generated in an LED and to shorten a mechanical processing time. CONSTITUTION: A reinforcement frame for a display panel comprises four bar type frame members. The four bar type frame members are fixed in the form of a square frame. A cross section of the four bar type frame members is bent into a shape corresponding to the corners of the display panel. End portions of the four bar type frame members which are overlapped with each other are welded by a friction stir junction method. The friction stir junction method uses a welding head(23) which rotates at a high speed.

Abstract translation: 目的：提供一种用于显示面板的加强框架及其制造方法，以有效地发射LED中产生的热量并缩短机械处理时间。 构成：用于显示面板的加强框架包括四个条形框架构件。 四杆式框架构件以方形框架的形式固定。 四个杆型框架构件的横截面弯曲成与显示面板的角部相对应的形状。 通过摩擦搅拌接合方法焊接彼此重叠的四个杆型框架构件的端部。 摩擦搅拌接合法使用高速旋转的焊接头（23）。

公开(公告)号：KR1020120000845A

公开(公告)日：2012-01-04

申请号：KR1020100061330

申请日：2010-06-28

Applicant: 성균관대학교산학협력단

Inventor： 신영의 ,  전유재 ,  손선익 ,  김도석 ,  정승부

IPC: H02M3/155 ,  A61B8/00 ,  G05F1/10

Abstract: PURPOSE: An apparatus for controlling AC power and a method thereof are provided to measure the form, current, voltage, and power value of an abnormal waveform in real time by displaying a measured AC input power to a user. CONSTITUTION: A waveform detection unit(110) detects the waveform of AC input power which is provided from the outside. A waveform comparison unit(120) compares a detected waveform and a reference waveform. A power output unit(130) outputs an AC power source to an ultrasonic device based on a comparison result. A display unit(140) displays a detected waveform to a user. A storage unit(150) stores information about a transformed detection waveform. A transmission unit(160) transmits detected waveform information to an external storage device. An emergency control unit(170) pauses one or more operations from the waveform detection unit, the waveform comparison unit, and the power output unit.

Abstract translation: 目的：提供一种用于控制AC电力的装置及其方法，用于通过向用户显示测量的AC输入功率来实时测量异常波形的形式，电流，电压和功率值。 结构：波形检测单元（110）检测从外部提供的AC输入功率的波形。 波形比较单元（120）比较检测波形和参考波形。 功率输出单元（130）基于比较结果向超声波装置输出AC电源。 显示单元（140）向用户显示检测到的波形。 存储单元（150）存储关于变换的检测波形的信息。 发送单元（160）将检测到的波形信息发送到外部存储装置。 应急控制单元（170）暂停来自波形检测单元，波形比较单元和功率输出单元的一个或多个操作。

公开(公告)号：KR1020120000303A

公开(公告)日：2012-01-02

申请号：KR1020100060604

申请日：2010-06-25

Applicant: 성균관대학교산학협력단 ,  (주)세라코

Inventor： 정승부 ,  안병욱 ,  최돈현 ,  정우현 ,  임성준 ,  박종화

IPC: B23K20/12 ,  C04B35/593 ,  C04B35/584

Abstract: PURPOSE: A tool for friction stir welding and a molding method thereof are provided to prevent the abrasion of a welding tool caused by chemical reaction to a work piece because the welding tool is made from silicon nitride sintered in a high-pressure gas atmosphere. CONSTITUTION: A tool for friction stir welding is manufactured by sintering silicon nitride powder, whose grain size is 0.3μm or less, in a high-pressure gas atmosphere. The welding tool comprises a tool body(10), a shoulder part(20) that is projected from both ends of the tool body and have a slope surface(22) inclined outward, and a fin part(30) that is projected from the center of the shoulder part to contact a welded part at the time of friction stirring.

Abstract translation: 目的：提供一种用于摩擦搅拌焊接的工具及其模制方法，以防止由于焊接工具由在高压气体气氛中烧结的氮化硅制成而导致的对工件的化学反应引起的焊接工具的磨损。 构成：通过在高压气体气氛中烧结粒径为0.3μm以下的氮化硅粉末制造摩擦搅拌焊接用工具。 焊接工具包括工具主体（10），从工具主体的两端突出并具有向外倾斜的倾斜表面（22）的肩部（20）和从该工具主体 在摩擦搅拌时，肩部的中心与焊接部分接触。

公开(公告)号：KR1020110014886A

公开(公告)日：2011-02-14

申请号：KR1020090072476

申请日：2009-08-06

Applicant: 성균관대학교산학협력단

Inventor： 백승욱 ,  이창용 ,  정승부 ,  조정래 ,  하상수 ,  이종범 ,  뷰쿡부 ,  최돈현 ,  이영철 ,  최정현 ,  안병욱

IPC: B23K20/12 ,  B23K20/26

Abstract: PURPOSE: A device and a method for processing the surface of a metal material are provided to mold the surface of a metal member without an additional device by inclining a tool. CONSTITUTION: A device for processing the surface of a metal material comprises a turntable(10) and a tool(20). A metal sample(1) is loaded on the turntable. The turn table can be horizontally reciprocated. The tool is vertically arranged on the top of the metal sample and is vertically and horizontally reciprocated. The rotary shaft(C) of the tool is inclined to the rotary shaft of the turntable.

Abstract translation: 目的：提供一种用于处理金属材料表面的装置和方法，以通过倾斜工具而无需附加装置来模制金属构件的表面。 构成：用于处理金属材料表面的装置包括转台（10）和工具（20）。 金属样品（1）装载在转台上。 转台可以水平往复运动。 该工具垂直布置在金属样品的顶部，并且垂直和水平往复运动。 工具的旋转轴（C）与转盘的旋转轴倾斜。

公开(公告)号：KR1020090009414A

公开(公告)日：2009-01-23

申请号：KR1020070072652

申请日：2007-07-20

Applicant: 성균관대학교산학협력단

Inventor： 정승부 ,  구자명 ,  김유나 ,  노보인 ,  하상수

IPC: H01L21/60

CPC classification number: H01L24/81 ,  H01L2224/11 ,  H01L2224/13 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electroplating bump in which solder is coated and a flip chip bonding method using the same are provided to directly bond bumps by using a liquid diffusion bonding method, thereby reducing a manufacturing cost and improving bonding strength and signal transmission capability. A conductive thin film(18) is formed on a substrate(10). A photoresist or a dry film is formed at an upper part of the conductive thin film as excluding a location in which a bump(14) will be formed. By using electroplating or electroless plating or sputtering or evaporation, the bump is formed on the conductive thin film. A solder less than 0.5 micro meter is formed on the bump by using the electroplating or electroless plating or sputtering or the evaporation. The height of the photoresist or dry film is greater than the height of the bump. The solder is made of tin or tin alloy in which a melting point is 450°C or less.

Abstract translation: 提供其中涂覆焊料的电镀凸块和使用其的倒装芯片接合方法，通过使用液体扩散接合方法直接接合凸块，从而降低制造成本并提高接合强度和信号传输能力。 导电薄膜（18）形成在基板（10）上。 除了形成凸点（14）的位置之外，在导电薄膜的上部形成光致抗蚀剂或干膜。 通过使用电镀或化学镀或溅射或蒸发，在导电薄膜上形成凸块。 通过使用电镀或无电镀或溅射或蒸发在凸块上形成小于0.5微米的焊料。 光致抗蚀剂或干膜的高度大于凸点的高度。 焊料由锡或锡合金制成，其熔点为450℃以下。

公开(公告)号：KR100795309B1

公开(公告)日：2008-01-15

申请号：KR1020060113223

申请日：2006-11-16

Applicant: 성균관대학교산학협력단

Inventor： 남재도 ,  이준호 ,  김동욱 ,  정승부

IPC: C08K3/04 ,  C08J7/06 ,  C08J7/04 ,  B82Y30/00

CPC classification number: H01B1/04 ,  B82Y30/00 ,  C08J5/2218 ,  C08J7/065 ,  C08J7/14 ,  C08K3/04 ,  C08K7/24 ,  C08K9/04 ,  C08L25/06

Abstract: A method for preparing conductive balls is provided to improve electroconductivity of conductive balls and to form an ion-bonded multilayer by a self assembled monolayer, thereby preventing crack of a conductive layer causable by a characteristic difference between a polymer and metal. A method for preparing conductive balls includes the steps of: (1) subjecting the surfaces of polymer beads to direct sulfonation to change the surfaces of the polymer beads into sulfone groups; (2) mixing the modified polymer beads(A) with a mixture of a cationic electrolyte solution and a solvent to form a cationic layer(B) on the surface of the modified polymer bead; (3) mixing the cation-stacked polymer beads with a mixture of an anionic electrolyte solution and a solvent to form an anionic layer(C) on the surface of the cation-stacked polymer bead; (4) to form a desired layer, alternately coupling anionic/cationic layers through a repetitive self assembled monolayer comprising the step 2 and step 3, thereby forming a multilayer having a finally cationic layer on the surface of the bead; and (5) mixing the modified polymer beads of the step (4) with surface-modified carbon nanotubes dispersed in a solvent to form polymer beads coated with carbon nanotubes(D).

Abstract translation: 提供一种制备导电球的方法，以改善导电球的导电性并通过自组装单层形成离子键多层，从而防止由聚合物与金属之间的特征差导致的导电层的裂纹。 制备导电球的方法包括以下步骤：（1）使聚合物珠的表面经受直接磺化以将聚合物珠的表面改变成砜基; （2）将改性聚合物珠（A）与阳离子电解质溶液和溶剂的混合物混合，以在改性聚合物珠粒的表面上形成阳离子层（B）; （3）将阳离子堆积的聚合物珠与阴离子电解质溶液和溶剂的混合物混合，以在阳离子堆积的聚合物珠粒的表面上形成阴离子层（C）; （4）以形成期望的层，通过包含步骤2和步骤3的重复自组装单层交替耦合阴离子/阳离子层，从而在珠粒的表面上形成具有最终阳离子层的多层; 和（5）将步骤（4）的改性聚合物珠与分散在溶剂中的表面改性的碳纳米管混合以形成涂覆有碳纳米管（D）的聚合物珠。