公开(公告)号：DE102005056569A1

公开(公告)日：2007-06-06

申请号：DE102005056569

申请日：2005-11-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： IRSIGLER ROLAND ,  HEDLER HARRY ,  GOLLER BERND ,  OFNER GERALD

IPC: H01L23/50 ,  H01L23/498

Abstract: An electronic component includes a substrate having contacts and a chip having contacts and a passivation layer disposed on an active side of the chip. The active side of the chip is mounted on a first surface of the substrate by flip chip technology such that the contacts of the chip are electrically connected to the contacts of the substrate by means of connecting elements. Elastic elevations are disposed between the contacts of the chip and the contacts of the substrate and an underfiller is disposed in an intermediate space between the chip and the substrate and between the elastic elevations. The underfiller and the elastic elevations have substantially the same modulus of elasticity.

公开(公告)号：DE10243947B4

公开(公告)日：2007-02-01

申请号：DE10243947

申请日：2002-09-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  THUMBS JOSEF ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/31 ,  H01L23/49

Abstract: The electronic component (2) comprises a flat chip carrier (6) assigned to a semiconductor chip (4). The contact areas (43) on active chip surface (41) and the contact terminal areas (63) on an upper side (61) of the chip carrier, are formed by elastic strips (81) of material that can undergo microstructuring. The strips are provided with an electrically conductive coating. An Independent claim is also included for electronic component manufacturing method.

公开(公告)号：DE10352349B4

公开(公告)日：2006-11-16

申请号：DE10352349

申请日：2003-11-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  TAN AI MIN ,  TEO MARY

IPC: H01L23/50 ,  H01L21/50 ,  H01L21/56 ,  H01L23/28 ,  H01L23/485 ,  H01L23/498

Abstract: A semiconductor chip includes flip chip contacts that are arranged on contact surfaces of an active top side of the semiconductor chip. The contact surfaces are surrounded by a passivation layer that covers the active top side while leaving exposed the contact surfaces. The passivation layer includes thickened portions that surround the contact surfaces. The semiconductor chip formed with thickened portions around the contact surfaces is protected from delamination during packaging of the semiconductor chip to form a semiconductor device.

公开(公告)号：DE10065896B4

公开(公告)日：2006-04-13

申请号：DE10065896

申请日：2000-11-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  HAGEN ROBERT-CHRISTIAN

IPC: H01L23/66 ,  H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L23/50 ,  H01L23/522 ,  H01L23/552 ,  H05K1/02 ,  H05K3/34 ,  H05K9/00

公开(公告)号：DE10320337A1

公开(公告)日：2004-08-26

申请号：DE10320337

申请日：2003-05-06

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  VILSMEIER HERMANN

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/12 ,  H05K3/34 ,  H01L21/58 ,  H01L23/50

Abstract: The method involves applying a stencil with openings to the semiconductor wafer so that the openings are aligned with contact surfaces (3) of integrated circuits. A first remelt of a first solder paste in the apertures of the stencil is performed to form columnar lands (7) on the contact surfaces. A second solder paste of lower melting point is applied to the platforms, and a second remelt is performed to form extensions (9) to the lands. The stencil is then removed.

公开(公告)号：DE10240460A1

公开(公告)日：2004-03-11

申请号：DE10240460

申请日：2002-08-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOLLER BERND ,  HAGEN ROBERT-CHRISTIAN ,  OFNER GERALD ,  STUEMPFL CHRISTIAN ,  WEIN STEFAN ,  WOERNER HOLGER

IPC: H01L21/56 ,  H01L23/31 ,  H01L21/58 ,  H01L21/60 ,  H01L25/065

公开(公告)号：DE10133791A1

公开(公告)日：2003-02-06

申请号：DE10133791

申请日：2001-07-16

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GROENINGER HORST ,  OFNER GERALD ,  STUEMPFL CHRISTIAN

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/34 ,  H01L23/50 ,  H01L21/60

Abstract: The invention relates to electronic components provided with wiring plate (2) for connection to other components. To form the contact pads required the invention proposes that connection pads in the form of solder balls (12) be offered up to the wiring plate in a jig (8) for soldering to the connection tracks.

公开(公告)号：DE10065895C1

公开(公告)日：2002-05-23

申请号：DE10065895

申请日：2000-11-17

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  HAGEN ROBERT-CHRISTIAN

IPC: H01L23/52 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/822 ,  H01L23/48 ,  H01L23/552 ,  H01L27/04 ,  H05K1/02 ,  H05K3/34 ,  H01L23/60 ,  H01L23/50 ,  H01L23/535 ,  H05K9/00

Abstract: Electronic component comprises a screen (2) for electromagnetic scattering; and a semiconductor chip (3) made from a semiconductor substrate (4) having an active front surface and a passive rear surface. An electrically conducting trenched layer (7) is formed in the component and has a surface size corresponding to the size of the surface of the rear side. The trenched layer is arranged within the substrate in the region of the rear side and is connected to an outer potential via a line (10) having a contact surface (8) on the front surface of the substrate. An Independent claim is also included for a process for the production of an electronic component. Preferred Features: The trenched layer is made from a doped semiconductor material having an impurity site concentration of more than 1 x 10 cm . The substrate is made from monocrystalline silicon.