Abstract:
Semiconductor manufacturing processes include providing a first substrate having a first passivation layer disposed above a patterned top-level metal layer, and further having a second passivation layer disposed over the first passivation layer; the second passivation layer has a top surface. The processes further include forming an opening in a first portion of the second passivation layer, and the opening exposes a portion of a surface of the first passivation layer. The processes further include patterning the second and first passivation layers to expose portions of the patterned top-level metal layer and bonding a second substrate and the first substrate to each other. The bonding occurs within a temperature range in which at least the exposed portion of the first passivation layer undergoes outgassing.
Abstract:
An angular velocity sensor including a drive extension mode. In one aspect, an angular rate sensor includes a base and at least three masses disposed substantially in a plane parallel to the base, the masses having a center of mass. At least one actuator drives the masses in an extension mode, such that in the extension mode the masses move in the plane simultaneously away or simultaneously towards the center of mass. At least one transducer senses at least one Coriolis force resulting from motion of the masses and angular velocity about at least one input axis of the sensor. Additional embodiments can include a linkage that constrains the masses to move in the extension mode.
Abstract:
A magnetic field sensor includes a driving element through which an electric current circumnavigates the driving element. A Lorentz force acts on the driving element resulting in a torque about a first axis in response to a magnetic field along a second axis substantially parallel to a plane of a substrate. The driving element is coiled-shaped. A sensing element of the magnetic field sensor is configured to rotate about the first axis substantially parallel to the plane of the substrate in response to the magnetic field and a coupling element mechanically couples the driving element to the sensing element. The driving element, the sensing element, and the coupling element are disposed in the plane, substantially parallel to the substrate. At least two anchors are configured to connect the driving element, the sensing element, and the coupling element to the substrate.
Abstract:
A MEMS sensor is disclosed. The MEMS sensor includes a MEMS structure and a substrate coupled to the MEMS structure. The substrate includes a layer of metal and a layer of dielectric material. The MEMS structure moves in response to an excitation. A first over-travel stop is formed on the substrate at a first distance from the MEMS structure. A second over-travel stop on the substrate at a second distance from the MEMS structure. At least one electrode on the substrate at a third distance from the MEMS structure. The first, second and third distances are all different.
Abstract:
A system and/or method for utilizing MEMS switching technology to operate MEMS sensors. As a non-limiting example, a MEMS switch may be utilized to control DC and/or AC bias applied to MEMS sensor structures. Also for example, one or more MEMS switches may be utilized to provide drive signals to MEMS sensors (e.g., to provide a drive signal to a MEMS gyroscope).
Abstract:
A magnetic field sensor includes a driving element through which an electric current circumnavigates the driving element. A Lorentz force acts on the driving element resulting in a torque about a first axis in response to a magnetic field along a second axis substantially parallel to a plane of a substrate. The driving element is coiled-shaped. A sensing element of the magnetic field sensor is configured to rotate about the first axis substantially parallel to the plane of the substrate in response to the magnetic field and a coupling element mechanically couples the driving element to the sensing element. The driving element, the sensing element, and the coupling element are disposed in the plane, substantially parallel to the substrate. At least two anchors are configured to connect the driving element, the sensing element, and the coupling element to the substrate.
Abstract:
A self-test method by rotating the proof mass at a high frequency enables testing the functionality of both the drive and sense systems at the same time. In this method, the proof mass is rotated at a drive frequency. An input force which is substantially two times the drive frequency is applied to the actuation structures to rotate the proof mass of the gyroscope around the sensitive axis orthogonal to the drive axis. An output response of the gyroscope at the drive frequency is detected by a circuitry and a self-test response is obtained.
Abstract:
A MEMS device incorporates a first sensor and a second sensor to receive an external excitation and respectively output signals to processing circuitry. The processing circuitry combines the first and second signals to create a third signal, which includes an output from the first sensor when the external excitation is between a first and second frequency relatively close to DC and an output from the second sensor when the external excitation is between a third and fourth frequency at a higher frequency range.
Abstract:
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
Abstract:
Applying positive and negative feedback voltages to an electromechanical sensor of a microphone utilizing a voltage-to-voltage converter to facilitate an improvement in sensitivity and reduction in distortion of the microphone is presented herein. A microphone comprises an electromechanical sensor comprising a capacitive sense element comprising a first sense node and a second sense node; and a voltage-to-voltage converter comprising an input, a first output, and a second output. The voltage-to-voltage converter forms, via a first capacitive coupling to the second sense node, a negative feedback loop between the first output of the voltage-to-voltage converter and the input of the voltage-to-voltage converter. The first sense node is electrically coupled to the input of the voltage-to-voltage converter, and the voltage-to-voltage converter forms, via a second capacitive coupling to the first sense node, a positive feedback loop between the second output of the voltage-to-voltage converter and the input of the voltage-to-voltage converter.