Abstract:
An electrical connector assembly includes a housing fabricated of a first metal material and having at least one integral pin projecting from a face thereof. A flat flexible circuit is mounted against the face of the housing and includes a ground plane on a side thereof facing the housing. The circuit has a hole for receiving the integral pin of the housing. The ground plane is of a second metal material different from that of the housing. An omni-directional conductive adhesive is deposited on the ground plane over the area of the hole to expand the conductive interface between the metal housing and the metal ground plane. Preferably, the conductive adhesive includes abrasive grain-like particles.
Abstract:
Electrically conductive elements on two substrates can be electrically interconnected by an adhesive tape containing electrically conductive equiax particles that are individually positioned in the adhesive layer in a predetermined pattern. Each particle is harder than the elements it is to interconnect, so that hand pressure causes the particles to penetrate into the elements, thus creating a reliable electrical connection. Particularly useful particles are glass beads having a metallic coating that is from 0.1 to 2 .mu.m thick.
Abstract:
An electronic element is connected to a base plate provided with a metallic pattern and a conductive resist layer superposed thereon by a thermal compression process with an adhesive layer sandwiched between the element and the base plate. The adhesive layer contains many metallic particles which are larger than the layer thickness of the resist such that these metallic particles penetrate the resist layer and invade the metallic pattern by the thermal compression process.
Abstract:
The disclosed invention relates to materials and processes for creating particle-enhanced bumps on electrical contact surfaces through stencil or screen printing processes. The materials are mixtures of conductive ink, conductive paste, or conductive adhesive and conductive hard particles (104). The process involves depositing the mixture (108) onto electrical contact surfaces by stencil printing, screen printing, or other dispensing techniques (110). In another embodiment, the ink, paste, or adhesive deposit. Once cured (114), the deposition provides a hard, electrical contact bump on the contact surface with a rough, conductive, sandpaper-like surface that can be easily connected to an opposing contact surface without any further surface preparation of either surface.
Abstract:
A semiconductor device characterized in that the semiconductor device comprises a semiconductor chip provided on a major surface with a first wiring, a protective film covering an area other than a part of the first wiring, a soft layer formed on the protective film, and a second wiring a first part of which is connected to a part of the first wiring and a second part of which is led out on the soft layer, a wiring board having a third wiring on one major surface, and adhesive of an insulating resin containing a number of conductive particles, and in that the semiconductor chip is so adhered to the wiring board that the major surface faces to the major surface of the wiring board, and the second part of the second wiring is electrically connected to the third wiring via a part of the conductive particles.