Abstract:
A single in-line package adapted for surface mounting to a printed circuit board comprises an electronic component, a plurality of leads and a specially configured housing that encloses and protects the electronic component. The outer ends of the leads extend adjacent a tapered lower edge of the housing. The housing further has projections for engaging the upper surface of a printed circuit board to maintain the housing in a stable upright orientation with the outer ends of the leads in physical contact with corresponding solder pads on the printed circuit board during solder re-flow. The tapered edge of the housing is configured to permit subsequent inspection of a plurality of resulting solder joints for acceptable whetting.
Abstract:
A single in line type semiconductor device is disclosed which has a plurality of lead-in wires extending from a package. In this semiconductor device, a heat sink is embedded in one surface of the package and an appropriate number of lead-in wires are bent on the other surface side of the package, to provide an offset array of the lead-in wires arranged in two rows. A projection is formed on the above appropriate number of lead-in wires on one surface side of the package, such that it extends in a direction perpendicular to that in which the lead-in wires extend. In this semi-conductor device, when the external lead-in wires are inserted into, and joined by means of soldering to a printed circuit board, the package is prevented from being inclined toward the heat sink side by the projection of the external lead-in wire, so that it may be set upright relative to the printed circuit board.
Abstract:
Disclosed herewith is a single in-line type semiconductor device having external leads drawn out from a package in staggered fashion. According to the single in-line type semiconductor device of this invention, a narrow portion to be fitted in an opening formed in a printed circuit board is provided at each of first and second external leads, with the remaining portion of each external lead constituting a wide portion. The first and second external leads are each provided with a positioning portion defined by the narrow and wide portions. The linear distance between one edge portion of the package and the positioning portion of each first external lead is equal to the linear distance between the edge portion of the package and the positioning portion of each second external lead.
Abstract:
Pin terminals projecting from a side of a switch housing are led out upon being arranged in one direction and in a plane parallel to the side of the switch housing, and distal end portions of the pin terminals are secured to a printed circuit board. This reduces the space needed for mounting the switch, facilitates the mounting of the switch on the printed circuit board and mounts the switch more reliably.
Abstract:
A fastener for temporarily holding a SIP in place as it is soldered into a printed circuit board comprises a planar piece of unsolderable material having a body with a slot which is adapted to slip over and hold the SIP; the planar piece of material also has a leg which extends from the body; and the leg has an end section which is parallel to the slot and is adapted to press fit into an unplated anchor hole that goes perpendicular through the board to orient the slot and SIP perpendicular to the board.
Abstract:
A mounting arrangement is provided whereby an electronic display device with contact pins accessible on one side is mounted on a printed circuit board by means of a plurality of elongated pin extender elements connected between individual ones of the contact pins and points of contact on associated ones of the conductive leads on the printed circuit board, the elements having pin receiving means for receiving the pins and being oriented at an off-orthogonal angle with respect to said printed circuit board and the pin extender elements form a triangulated structural support for the display device.
Abstract:
Two flat packages (110, 111) are arranged to achieve a mirrored footprint by employing guides (100), which are positioned within a mounting aperture a printed circuit board. The flat packages include leads (120,121) which extend from the edge of the flat package. A semiconductor chip is encapsulated by the flat packages.
Abstract:
There is a trend in the electronics industry towards a preference for components that can be surface mounted on a carrier, such as a circuit board. By using surface mountable leads on a component together with a "Single-In-Line" technique it is possible to surface mount a component (5) upstanding on a circuit board (7) with the component leads surface mounted on the board. The leads (8) may be bent at their bottom extremities and provided with feet (10) for effective contact with the board. Guide and support pins may be used to hold the component in position during mounting and connecting the component and to brace the leads on the component when mounted on the board.