公开(公告)号：AU2003234566A1

公开(公告)日：2003-12-22

申请号：AU2003234566

申请日：2003-05-13

Applicant: KIONIX INC

Inventor： ZHOU PENG ,  PINNISI MICHAEL D ,  MARUSAK RONALD E ,  MOON JAMES E ,  YOUNG LINCOLN C

IPC: B01D11/04 ,  B01F5/00 ,  B01F13/00 ,  B01J19/00 ,  B01L3/00 ,  G01N1/34 ,  G01N30/00 ,  G01N30/38 ,  G01N30/40 ,  G01N30/42 ,  G01N30/52 ,  G01N30/60

Abstract: Devices for performing liquid extraction of one or more constituents from one fluid to another fluid are provided. In operation, the fluids are separated by channel structures that stabilize the interfacial boundary between the fluids allowing, for example, countercurrent flow and exchange or other flow conditions incompatible with unassisted maintenance of laminar flow. Also provided are channel structures which aid in mixing the fluids. Thin membranes may be formed using liquid extraction devices according to the invention. A process for manufacturing such devices using DRIE is described.

公开(公告)号：CA2467503A1

公开(公告)日：2003-05-01

申请号：CA2467503

申请日：2002-10-16

Applicant: KIONIX INC

Inventor： MILLER SCOTT A ,  JOHNSON WENDY JO H ,  ADAMS SCOTT G

IPC: G01P9/04 ,  G01P15/125 ,  H01L29/00 ,  G01P15/08

Abstract: An accelerometer (100) comprising a silicon wafer is etched to form a fixed portion (400), a movable portion (300), and a resilient coupling (120) between, the fixed and movable portions generally arranged in the plane of t he wafer, the mass of the movable portion being concentrated on one side of the resilient coupling. One of the fixed and moveable portions of the silicon structure includes a first electrode. The other of the fixed and moveable portions includes a second electrode oriented parallel to the axis of acceleration, and an electrically-conductive layer electrically connected as a third electrode coplanar and mechanically coupled with the second electrode. The second and third electrodes are arranged in capacitive opposition to the first electrode, the capacitance between the first electrode and third electrode increasing as the movable portion moves in a direction along the axis of acceleration relative to the fixed portion and decreasing as the movable portion moves in an opposite direction. A resilient coupling retains the first and third electrodes in capacitive opposition to each other across a capacitance gap while allowing motion of the first electrode relative to the second and third electrodes in response to acceleration along an axis of acceleration perpendicular to the plane of the wafer, and resiliently restor es the first electrode to an equilibrium position when the acceleration ceases. The second electrode is in opposition to a majority of the surface area of t he first electrode when the electrodes are in the equilibrium position. Capacitance between the first and third electrodes is measured to obtain a measurement of acceleration along the axis.

公开(公告)号：CA2343055A1

公开(公告)日：2000-03-23

申请号：CA2343055

申请日：1999-09-01

Applicant: ADVANCED BIOANALYTICAL SERVICE ,  KIONIX INC

Inventor： LOWES STEPHEN ,  CORSO THOMAS N ,  DAVIS TIMOTHY J ,  MOON JAMES E ,  SCHULTZ GARY A ,  GALVIN GREGORY J

IPC: G01N27/62 ,  B01D15/08 ,  G01N30/60 ,  G01N30/72 ,  G01N37/00 ,  H01J49/04

Abstract: An electrospray device (100), a liquid chromatography device and an electrospray-liquid chromatography system are disclosed. The electrospray device (100) includes a substrate (102) defining a channel (104) between an entrance orifice (106) on an injection surface (108) and an exit orifice on an ejection surface (112), a nozzle (110) defined by a portion recessed (114) from the ejection surface (112) surrounding the exit orifice, and an electro de for application of an electric potential to the substrate (102) to optimize and generate an electrospray. The exit orifice of the liquid chromatography device may be homogeneously interfaced with the entrance orifice (106) of th e electrospray device (100) to form an integrated single system.

公开(公告)号：US20220252439A1

公开(公告)日：2022-08-11

申请号：US17591086

申请日：2022-02-02

Applicant: Kionix, Inc.

Inventor： Jonah DEWALL

IPC: G01D18/00 ,  G01R29/26 ,  H03F3/45 ,  H03H11/12

Abstract: A sensor apparatus includes a resonator, a transducer, a damping resistor, a first switch, a filter stage, a second switch, and a noise rejection stage. The transducer is configured to detect a position of the resonator. The damping resistor is configured to electrostatically actuate the transducer and convert a thermomechanical noise of the resonator to an electromechanical noise. The first switch is configured to receive a first signal from the transducer. The filter stage is configured to receive the first signal and adjust a phase and a gain of the first signal and output a filtered first signal. The second switch is configured to receive a second signal from the transducer. The noise rejection stage is configured to receive the filtered first signal and the second signal and reduce the filtered first signal from an output signal.

公开(公告)号：US10793427B2

公开(公告)日：2020-10-06

申请号：US15677994

申请日：2017-08-15

Applicant: Kionix, Inc.

Inventor： Martin Heller ,  Toma Fujita

IPC: B81C1/00 ,  B32B15/04 ,  B32B15/20 ,  H01L23/02 ,  B81B7/00 ,  H01L23/00

Abstract: A MEMS device formed in a first semiconductor substrate is sealed using a second semiconductor substrate. To achieve this, an Aluminum Germanium structure is formed above the first substrate, and a polysilicon layer is formed above the second substrate. The first substrate is covered with the second substrate so as to cause the polysilicon layer to contact the Aluminum Germanium structure. Thereafter, eutectic bonding is performed between the first and second substrates so as to cause the Aluminum Germanium structure to melt and form an AlGeSi sealant thereby to seal the MEMS device. Optionally, the Germanium Aluminum structure includes, in part, a layer of Germanium overlaying a layer of Aluminum.

公开(公告)号：US10393605B2

公开(公告)日：2019-08-27

申请号：US15371913

申请日：2016-12-07

Applicant: Kionix, Inc.

Inventor： Scott G. Adams ,  Charles W. Blackmer ,  Kristin J. Lynch

IPC: G01L9/00 ,  G01L13/00 ,  B81C1/00 ,  H01L21/00 ,  G01P15/08 ,  G01P15/00 ,  B81B3/00 ,  G01L13/02

Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.

公开(公告)号：US10167191B2

公开(公告)日：2019-01-01

申请号：US15685957

申请日：2017-08-24

Applicant: Kionix, Inc.

Inventor： Martin Heller ,  Jonah deWall ,  Andrew Hocking ,  Kristin Lynch ,  Sangtae Park

IPC: B81C1/00

Abstract: A method of fabricating a semiconductor device, includes, in part, growing a first layer of oxide on a surface of a first semiconductor substrate, forming a layer of insulating material on the oxide layer, patterning and etching the insulating material and the first oxide layer to form a multitude of oxide-insulator structures and further to expose the surface of the semiconductor substrate, growing a second layer of oxide in the exposed surface of the semiconductor substrate, and removing the second layer of oxide thereby to form a cavity in which a MEMS device is formed. The process of growing oxide in the exposed surface of the cavity and removing this oxide may be repeated until the cavity depth reaches a predefined value. Optionally, a multitude of bump stops is formed in the cavity.

公开(公告)号：US20180222746A1

公开(公告)日：2018-08-09

申请号：US15941465

申请日：2018-03-30

Applicant: Kionix, Inc.

Inventor： Scott G. Adams ,  Charles W. Blackmer

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/532 ,  H01L21/768 ,  H01L21/306 ,  H01L23/48

CPC classification number: B81B7/007 ,  B81B2207/096 ,  B81C1/00301 ,  B81C2201/013 ,  H01L21/30604 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/5329

Abstract: Disclosed is a method of forming an interconnect in a substrate having a first surface and a second surface. The method includes forming an insulating structure abutting the first surface and defining a closed loop around a via in the substrate and forming an insulating region abutting the second surface such that the insulating region contacts the insulating structure and separates the via from a bulk region of the substrate. Forming the insulating structure includes etching the substrate beginning from the first surface to form a trench, filling the trench to form a seam portion, and converting a first portion of the substrate to a first solid portion to form the closed loop.

公开(公告)号：US09751757B2

公开(公告)日：2017-09-05

申请号：US13783606

申请日：2013-03-04

Applicant: Kionix, Inc.

Inventor： Nathan L. Stirling ,  Luke E. DeWalt ,  James E. Strait ,  Scott G. Adams

IPC: G01B21/00 ,  B81C99/00

CPC classification number: B81C99/005

Abstract: A calibration unit, system, and method for calibrating a device under test are provided. The calibration unit, system, and method use a single axis rotational unit to calibrate devices under test on a test head. The single axis rotation unit is configured to extend at an angle from a known axis. The test head can be designed in the shape of a frustum with multiple sides. The calibration unit, system, and method can use combinations of gravitational excitation, Helmholtz coil excitation, and rotational rate excitation for calibrating the device under test. The calibration unit, system, and method can calibrate a 3 degree for freedom or higher MEMS devices.

公开(公告)号：US09541462B2

公开(公告)日：2017-01-10

申请号：US14474059

申请日：2014-08-29

Applicant: Kionix, Inc.

Inventor： Scott G. Adams ,  Charles W. Blackmer ,  Kristin J. Lynch

IPC: G01L9/00 ,  B81C1/00 ,  G01L13/00 ,  H01L21/00

CPC classification number: G01L9/003 ,  B81B3/0072 ,  B81B2201/0264 ,  B81C1/00 ,  B81C1/00666 ,  B81C2201/0167 ,  G01L9/0027 ,  G01L9/0055 ,  G01L9/0073 ,  G01L9/008 ,  G01L9/0082 ,  G01L13/00 ,  G01L13/02 ,  G01P15/006 ,  G01P15/08 ,  H01L21/00

Abstract: Techniques are described herein that perform pressure sensing using pressure sensor(s) that include deformable pressure vessel(s). A pressure vessel is an object that has a cross section that defines a void. A deformable pressure vessel is a pressure vessel that has at least one curved portion that is configured to structurally deform (e.g., bend, shear, elongate, etc.) based on a pressure difference between a cavity pressure in a cavity in which at least a portion of the pressure vessel is suspended and a vessel pressure in the pressure vessel.

Abstract translation: 本文描述了使用包括可变形压力容器的压力传感器进行压力感测的技术。 压力容器是具有限定空隙的横截面的物体。 可变形压力容器是具有至少一个弯曲部分的压力容器，该弯曲部分构造成基于空腔中的腔体压力之间的压力差而在结构上变形（例如弯曲，剪切，细长等），其中至少一个 压力容器的一部分被悬浮并且在压力容器中存在容器压力。