Abstract:
A method for forming a ZnO nano-crystal directly on a silicon substrate is provided to omit additional processes when forming a silicon substrate based photoelectric cell by forming the amorphous ZnO-nano crystal within a Zn-Si-O complex thin film directly. In a method for forming a ZnO nano-crystal directly on a silicon substrate, a Zn-Si-O complex thin film is formed on a semiconductor substrate, and the Zn-Si-O complex thin film is annealed. Wherein, the ZnO nano crystal is formed within an amorphous Zn-Si-O complex thin film on a silicon substrate, and the Zn-Si-O complex thin film is formed by using a sputtering method.
Abstract:
본 발명은 상변화 물질의 접촉면적을 최대한 줄임으로써 저전력 및 고집적 특성을 갖는 상변화 물질을 이용한 상변화 메모리 및 그 제조방법에 관한 것이다. 이를 위해, 본 발명은 절연막/하부전극/기판에 상변화 물질을 증착하고 건식 식각을 통해 수직으로 에칭하여 절연막/하부전극의 벽면을 따라 상변화 물질의 스페이서가 형성되도록 하여 하부전극의 두께로 상변화 물질의 접촉면적이 결정될 수 있도록 한다. 또한, 트렌치 구조의 내부에 하부전극을 형성하고 상변화 물질을 증착한 후 건식 식각을 통해 수직으로 에칭하여 절연막의 벽면을 따라 상변화 물질의 스페이서가 형성되도록 하여 상변화 물질의 두께로 상변화 물질의 접촉면적이 결정될 수 있도록 한다.
Abstract:
PURPOSE: A method for growing quantum wires with various sizes on one substrate is provided by growing a triangular epitaxial layer with various sizes through a selective epitaxial growing method. CONSTITUTION: An oxide layer is deposited on a substrate. The oxide layer is etched so as to have a various sized area without an oxide layer. A triangular structure of the various sized area without the oxide layer is grown by a selective epitaxial growing method. The growing characteristic and surface characteristic in an epitaxial layer of the triangular structure is improved by controlling the rate of epitaxial growth. The rate of epitaxial growth is 0.52μm/hour in case of AlGaAs, and 0.7μm/hour in case of GaAs or InGaAs.
Abstract:
PURPOSE: A connecting method of a ferroelectric memory cell and a ferroelectric memory thereby are provided to perform a reading process and a writing process on a selected cell alone without interference between cells by connecting upper electrodes and sources of FETs(Field Effect Transistors) in columns and lower electrodes and drains of the FETs in rows using bit lines and word lines. CONSTITUTION: A ferroelectric memory cell array includes a plurality of ferroelectric memory cells. Each cell(1) includes a FET. The FET includes an upper electrode(2) and a lower electrode(3) of a gate with a metal-ferroelectric-metal-insulator-silicon structure, a source(4) and a drain(5). The upper electrode is connected to a write bit line(6) in column. The lower electrode is connected to a write word line(7) in row. The source is connected to a read bit line(9) in column. The drain is connected to a read word line(8) in row.
Abstract:
PURPOSE: A method of manufacturing a ferroelectric gate is provided to improve characteristics of the gate by using oxygen plasma RTA(Rapid Thermal Annealing). CONSTITUTION: Oxygen plasma RTA is performed for a ferroelectric thin film under a predetermined pressure. The ferroelectric thin film is used as a gate oxide layer. The temperature of RTA is in the range of 600 to 700 °C. The RTA period is in the range of 5 to 10 minutes. The power of 30 to 50 Watt is applied in order to generate oxygen plasma. The predetermined pressure of the RTA is 10¬-1 to 10¬-2 Torr. Oxygen concentration of the ferroelectric thin film is increased due to the oxygen plasma RTA.
Abstract:
PURPOSE: A write signal error protection circuit of a non destructive readout ferroelectric random access memory and a method for preventing the same are provided to effectively remove the write errors caused by a bitline charged by the write operation before the write operation by using the change of the address signal. CONSTITUTION: A write signal error protection circuit of a non destructive readout ferroelectric random access memory(NDRO-FRAM) includes a switch(30) for outputting a plurality of voltages by receiving an address signal, wherein each of the voltages has a different value each other, and a discharging nMOSFET(31) for discharging the electrical charges in the write bit line in response to the voltage.
Abstract:
본 발명은 선택성장법에 의한 고밀도 양자점 어레이 형성방법에 관한 것으로, 종래에는 갈륨비소기판에 전자선 또는 엑스선을 주사하여 V자형의 홈을 형성함으로써 그 갈륨비소기판에 손상을 주며, 그 V자형 홈의 가장 깊은 부분에 형성한 양자점을 사용하는 광전소자의 출력이 약해 사용효율이 감소하는 문제점이 있었다. 이와 같은 문제점을 감안한 본 발명은 습식식각으로 V자형 홈을 형성하고, 2차원적인 반복구조를 갖는 양자점을 유기금속 화학증착법을 사용하여 용이하게 형성함으로써, 그 양자점을 사용하는 광전소자의 출력을 증대시켜 광전소자의 광변환효율을 증대시키는 효과가 있다.
Abstract:
반도체표면에 CeO 2 /SrBi 2 Ta 2 O 9 이중막을 형성시키고 이중막의 강유전체인 SrBi 2 Ta 2 O 9 막상에 백금전극을 부착하며, 상기 CeO 2 /SrBi 2 Ta 2 O 9 /Pt의 삼중층 주위에 산화방지막을 도포하여 형성되는 게이트를, 전계효과트랜지스터의 게이트로 이용하므로서 커패시터가 필요없는 강유전체게이트를 가지는 전계효과트랜지스터(FET)기억소자를 제공한다.