Abstract:
PURPOSE: A producing method of graphene, the graphene, a thin conductive film, a transparent electrode, and a heat generating or radiating device including the graphene are provided to rapidly separate the graphene from a graphene member. CONSTITUTION: A producing method of graphene comprises the following steps: preparing a graphene member containing a base member(110), a hydrophilic oxidized layer(120) formed on the base member, a hydrophobic metal catalyst layer(130), formed on the hydrophilic oxidized layer, and the graphene(140) formed on the metal catalyst layer; pouring water to the graphene member; dividing the portion in between the hydrophilic oxidized layer and the hydrophobic metal catalyst layer; and removing the metal catalyst layer by etching.
Abstract:
The present invention provides an organic solar cell which includes a substrate; an inorganic material layer which is formed on the substrate and has a two-dimensional structure; an anode located on the inorganic material layer; a cathode; and an active layer located between the anode and the cathode. Moreover, the present invention also provides a method of manufacturing a multi-layered structure containing a carbon material layer and an inorganic material layer, which includes the steps of vaporizing a precursor compound of an inorganic material under a reducing atmosphere; forming the inorganic material layer on a metal electrode of an electric furnace after the vaporized precursor compound of the inorganic material is transferred into the electric furnace; vaporizing a precursor compound of a carbon material; and forming the carbon material layer on the inorganic material layer after the vaporized precursor compound of the carbon material is transferred into the electric furnace.
Abstract:
The present invention relates to a graphene field effect transistor with dielectrics and gate electrodes having stable behaviors despite high strains and a method for manufacturing the same. According to an embodiment of the present invention, the method of manufacturing a graphene field effect transistor with dielectrics and gate electrodes having stable behaviors despite high strains includes a step of preparing a monolithically patterned graphene layer; a step of forming an insulating layer; and a step of forming a gate electrode. [Reference numerals] (AA) Patterned graphene; (BB) Rubber; (CC) Aerosol jet printing; (DD) Nozzle; (EE) Ion gel printing; (FF) Ethanol; (GG,HH) Stretch(transformation); (II) PEDOT:PSS printing; (JJ) Hexane evaporation
Abstract:
본원은, 플렉서블 비휘발성 메모리 소자용 강유전체 캐패시터, 트랜지스터형 플렉서블 비휘발성 강유전체 메모리 소자, 1T-1R(1Transistor-1Resistor) 플렉서블 강유전체 메모리 소자 및 이들의 제조 방법에 관한 것으로서, 강유전체층과 반도체층 사이의 계면에 고분자 접착층을 형성함으로써 계면에서의 전기적 특성 및 물리화학적 특성을 향상시킬 수 있다.
Abstract:
PURPOSE: A flexible field effect transistor and a manufacturing method thereof are provided to manufacture low voltage operation graphene FET(Field Effect Transistor) array on a plastic substrate by using ionic gel for a gate insulator. CONSTITUTION: A semiconductor layer includes a carbon nano-structure which is arranged to form a channel region between a source electrode and a drain electrode. The carbon nano structure includes graphene. The graphene is formed on a metal catalytic layer by chemical vapor deposition. An ionic gel layer is formed between the semiconductor layer and the gate electrode including the carbon nano-structure. The ionic gel layer forms an insulator layer between the channel region and the gate electrode.
Abstract:
PURPOSE: A method for manufacturing a flexible oxide semiconductor device is provided to improve the electrical property of the device by implementing a thermal process at high temperature without the deformation of a substrate. CONSTITUTION: A sacrificial layer is formed on a substrate(S110). A buffer layer is formed on the sacrificial layer(S120). An oxide semiconductor device is formed on the buffer layer(S130). A crack preventive protection layer is formed on the oxide semiconductor device(S140). The oxide semiconductor device is thermally processed at high temperature(S150). The sacrificial layer is eliminated to separate the oxide semiconductor device from the substrate(S160). The separated oxide semiconductor device is transferred to a flexible substrate(S170).