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    Solderless electrical interconnection for electronic package
    51.
    发明公开
    Solderless electrical interconnection for electronic package 审中-公开
    Lötfreieelektrische VerbindungfüreinElektronikgehäuse

    公开(公告)号：EP1870964A2

    公开(公告)日：2007-12-26

    申请号：EP07075491.6

    申请日：2007-06-20

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A.

    IPC: H01R12/08

    CPC classification number: H01R12/714 ,  H01R12/62 ,  H01R13/24 ,  H01R13/405 ,  H01R13/5845

    Abstract: An electrical connector assembly (15) and method of connecting an electrical connector (21) to a substrate (12) are provided. The electrical connector assembly (15) includes a substrate (12) having first electrical circuitry (16) formed on a surface, an elastomer (30), and second electrical circuitry (20) disposed at least partially between the substrate (12) and the elastomer (30). Elements (20) of the second electrical circuitry are pressed into contact with contact pads (16) of the first electrical circuitry. The electrical connector assembly (15) also includes a holder securing the elastomer (30) in a compressed state to provide a pressure contact between the circuit elements (20) and the contact pads (16).

    Abstract translation: 提供一种电连接器组件（15）和将电连接器（21）连接到基板（12）的方法。 电连接器组件（15）包括具有形成在表面上的第一电路（16），弹性体（30）和至少部分地设置在基板（12）和第二电路 弹性体（30）。 第二电路的元件（20）被压入与第一电路的接触焊盘（16）接触。 电连接器组件（15）还包括固定弹性体（30）处于压缩状态以在电路元件（20）和接触垫（16）之间提供压力接触的保持器。

    Electronic assembly with backplate having at least one thermal insert
    52.
    发明公开
    Electronic assembly with backplate having at least one thermal insert 审中-公开
    Elektronische Anordnung mitRückplatte，die zumindest einenWärmeeinsatzaufweist

    公开(公告)号：EP1739741A2

    公开(公告)日：2007-01-03

    申请号：EP06076225.9

    申请日：2006-06-14

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A.

    IPC: H01L23/367 ,  H01L23/492

    CPC classification number: H01L23/3675 ,  H01L23/3677 ,  H01L23/492 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, an insert is inserted within the cavity. Then, a substrate, with a first side of an integrated circuit (IC) die mounted to a first side of the substrate, is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The first side of the substrate is positioned in contact with the first side of the backplate and a second side of the IC die is soldered to the second side of the IC die.

    Abstract translation: 一种用于制造电子组件的技术包括多个步骤。 首先，提供具有形成在背板（102A）的第一侧中的空腔（110）的背板（102A）。 接下来，插入件（106C）插入空腔（110）内。 然后，设置安装在基板（204）的第一侧上的集成电路（IC）管芯（208）的第一侧的基板（204）。 IC管芯（208）电连接到形成在衬底（204）的第一侧上的多个导电迹线中的一个或多个。 衬底（204）的第一侧被定位成与背板（102A）的第一侧接触，并且IC管芯（208）的第二侧被焊接到插入件（106C）上，用作散热器。

    Overmolded electronic package including circuit-carrying substrate
    55.
    发明公开
    Overmolded electronic package including circuit-carrying substrate 审中-公开
    包覆模制的电子组件，其包括设置有电路的基板

    公开(公告)号：EP1463104A2

    公开(公告)日：2004-09-29

    申请号：EP04075831.0

    申请日：2004-03-15

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Degenkolb, Thomas A. ,  Myers, Bruce A.

    IPC: H01L21/56 ,  H01L23/31

    CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01R13/504 ,  H01R13/665 ,  H01R43/24 ,  H05K3/0058 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

    Abstract: An overmolded electronic package (100, 200, 300, 400, 500) includes a circuit-carrying substrate (24) and a connector housing (14) or shroud (14') interconnected via a suitable interconnection arrangement (20, 32, 34; 20' 32, 320). Some embodiments may include a backplate (12) affixed to the substrate (24) and, in some cases, also to the connector housing (14) or shroud (14'). In some embodiments, the connector housing (14) or shroud (14') may be affixed to the substrate (12), and in any case the entire subassembly of components is overmolded with a rigidly formable molding compound (110) to bond together all components of the subassembly and form the overmolded electronic package (100, 200, 300, 400, 500). The subassembly of components with the exception of the backplate (12) may alternatively be overmolded with the molding compound (110), and a backplate (12) thereafter affixed to the subassembly via a compliant bonding medium (402).

    Abstract translation: 包覆成型的电子封装（100，200，300，400，500）包括一个电路承载基板（24）和一个连接器壳体（14）或通过合适的互连装置（20，32，34相互连接罩（14“）; 20 '32，320）。 一些实施例可包括固定到基板（24），并且在一些情况下，后板（12），即在连接器壳体（14）或护罩（14“）。 在一些实施例中，连接器壳体（14）或护罩（14“）可以固定到基板（12），并且在任何情况下，组件的整个子组件是包覆模制有一个刚性地成形模塑料（110）粘结在一起的所有 子组件和部件形成所述包覆成型的电子封装（100，200，300，400，500）。 与所述背板（12）的异常部件的子组件可替换地与模制化合物（110）和背板（12）之后经由柔性接合装置（402）附连到子组件包覆模制。

    Overmolded circuit board with underfilled surface-mount component and method therefor
    56.
    发明公开
    Overmolded circuit board with underfilled surface-mount component and method therefor 有权
    Umgossene Leiterplatte mitunterfülltemoberflächenmontiertenBauelement und Herstellungsverfahren

    公开(公告)号：EP1291912A2

    公开(公告)日：2003-03-12

    申请号：EP02078469.0

    申请日：2002-08-21

    Applicant: Delphi Technologies, Inc.

    Inventor： Myers, Bruce A. ,  Brandenburg, Scott D. ,  Tsai, Jeenhuei S.

    IPC: H01L23/31

    CPC classification number: H01L21/563 ,  H01L23/3107 ,  H01L24/28 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/15151

    Abstract: An overmolded circuit board assembly (30,50) and a method for forming the assembly (30,50). The assembly (30,50) and method entail overmolding both surfaces of a circuit board (12,42,62,82) and underfilling at least one surface-mount circuit device (14,44,64,84) attached to at least one surface of the board (12,42,62,82) with solder bump connections (18,48), with the result that the circuit device (14,44,64,84) is spaced above the surface of the circuit board (12,42,62,82) so as to define a gap (22,52,72,92) therebetween. The circuit board assembly (30,50) further comprises a cavity (20,50,70,90), such as a blind hole (30) or closed through-hole (50,70,90), defined in the surface of the circuit board (12,42,62,82) beneath the circuit device (14,44,64,84), such that the cavity (20,50,70,90) communicates with the gap (22,52,72,92) between the circuit board (12,42,62,82) and device (14,44,64,84), but is closed off from the opposite surface of the circuit board (12,42,62,82). As a result of the presence of the cavity (20,50,70,90), air that becomes trapped in the gap (22,52,72,92) by a molding material (16,46) during the overmolding/underfilling process is collected and compressed within the cavity (20,50,70,90), yielding a void-free underfill between the circuit board (12,42,62,82) and

    Abstract translation: 包覆成型的电路板组件（30,50）和用于形成组件（30,50）的方法。 组件（30,50）和方法包括模制电路板（12,42,62,82）的两个表面，并且底部填充至少一个附接到至少一个的表面安装电路装置（14,44,64,84） 具有焊料凸块连接（18,48）的板（12,42,62,82）的表面，结果电路器件（14,44,64,84）在电路板（12）的表面上方间隔开 ，42,42,82），以便在它们之间限定间隙（22,52,72,92）。 电路板组件（30,50）还包括空腔（20,50,70,90），例如盲孔（30）或闭合通孔（50,70,90），其限定在 在电路装置（14,44,64,84）下面的电路板（12,42,62,82），使得空腔（20,50,70,90）与间隙（22,52,72,92）连通 ）与电路板（12,42,62,82）之间的电路板（12,42,62,82）的相对表面封闭。 由于空腔（20,50,70,90）的存在，在包覆成型/底部填充过程期间被模制材料（16,46）捕获在间隙（22,52,72,92）中的空气 在腔（20,50,70,90）内收集和压缩，在电路板（12,42,62,82）和之间产生无空隙的底部填充物

    Thermoelectric generator to engine exhaust manifold assembly
    59.
    发明公开
    Thermoelectric generator to engine exhaust manifold assembly 有权
    热电发电机用于发动机排气歧管组件

    公开(公告)号：EP2789822A1

    公开(公告)日：2014-10-15

    申请号：EP14163084.8

    申请日：2014-04-01

    Applicant: Delphi Technologies, Inc.

    Inventor： Brandenburg, Scott D. ,  Eltom, Khalid M. ,  Myers, Bruce A. ,  Eesley, Gary L. ,  Moor, Bruce

    IPC: F01N5/02 ,  F01N13/16

    CPC classification number: H01L35/30 ,  F01N5/025 ,  F01N2240/02 ,  Y02T10/16

    Abstract: An assembly (10) for coupling thermally a thermoelectric generator (TEG (12)) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger (14) configured to couple thermally heat from exhaust gas (16) to an outer surface (22) of the first heat exchanger (14). The outer surface (22) is preferably formed of stainless steel. A first dielectric layer (24) is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger (14). A first conductor layer (26) is formed by firing a conductive thick-film onto the first dielectric layer (24). A first paste layer (32) of silver (Ag) based sintering paste is interposed between the first conductor layer (26) and a first contact (30) of the TEG (12). The first contact (30) is sintered to the first conductor layer (26) when the assembly (10) is suitably arranged and suitably heated.

    Abstract translation: 一种用于将热电发电机（TEG（12））热耦合至内燃机的排气歧管的组件（10）。 排气歧管形成第一热交换器（14），该第一热交换器构造成将来自排气（16）的热热量耦合到第一热交换器（14）的外表面（22）。 外表面（22）优选由不锈钢形成。 通过在第一热交换器（14）的不锈钢上烧制厚膜电介质材料来形成第一电介质层（24）。 通过在第一介电层（24）上烧制导电厚膜来形成第一导体层（26）。 在第一导体层（26）和TEG（12）的第一触点（30）之间插入银（Ag）基烧结浆料的第一浆料层（32）。 当组件（10）被合适地布置并适当地加热时，第一触点（30）被烧结到第一导体层（26）。

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