公开(公告)号：DE102008046407B4

公开(公告)日：2015-12-03

申请号：DE102008046407

申请日：2008-09-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： EWE HENRIK ,  MUELLER-HIPPER ANDREAS ,  PUESCHNER FRANK ,  STAMPKA PETER

IPC: G06K19/077 ,  H01Q1/36

Abstract: Datenträger 10 für kontaktlose Datenübertragung mit einem Substrat 20, einem Chip 30 mit wenigstens einer Anschlussfläche 35, wobei der Chip 30 mit seiner der Anschlussfläche 35 abgewandten Seite auf dem Substrat 20 angeordnet ist und eine erste kupferkaschierten Prepreg-Lage 40 auf dem Chip 30 und zumindest teilweise auf dem Substrat 20 angeordnet ist und eine Kontaktöffnung 45 zu der Anschlussfläche 35 aufweist. Eine Durchkontaktierung 50 befindet sich innerhalb der Kontaktöffnung 45 zur Herstellung einer elektrisch leitfähigen Verbindung zwischen der Anschlussfläche 35 des Chips 30 und der Kupferschicht der ersten kupferkaschierten Prepreg-Lage 40, wobei eine erste Antennenstruktur 48 in der Kupferschicht der ersten kupferkaschierten Prepreg-Lage 40 ausgebildet ist.

公开(公告)号：DE102013105729A1

公开(公告)日：2014-12-04

申请号：DE102013105729

申请日：2013-06-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HÖGERL JÜRGEN ,  PUESCHNER FRANK ,  STAMPKA PETER ,  MÜLLER-HIPPER ANDREAS ,  SCHINDLER WOLFGANG

IPC: G06K19/077

Abstract: Ein Chipkartenmodul zum Einsatz in einer Chipkarte kann einen Mikrochip und ein Kontaktfeld zur Kontaktierung des Mikrochips durch ein Lesegerät umfassen. Der Mikrochip kann von einer Ummantelung umschlossen sein, welche den Mikrochip vollständig von allen Seiten umschließen kann.

公开(公告)号：DE102011115164A1

公开(公告)日：2013-03-28

申请号：DE102011115164

申请日：2011-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BOTHE KRISTOF ,  HOEGERL JUERGEN ,  KARL ANDREAS ,  MUELLER-HIPPER ANDREAS ,  PUESCHNER FRANK ,  SCHERL PETER ,  STAMPKA PETER ,  WAGNER UWE

IPC: G06K19/077

Abstract: Die vorliegende Erfindung beschreibt ein Chipkarten-Moduls mit einer Basisschicht, einer zweiten Schicht, einem Chip, wobei der Chip zwischen der Basisschicht und der zweiten Schicht angeordnet ist und wobei der Chip ferner in einer Klebemasse angeordnet ist und wobei der Chip elektrische Kontakte aufweist und wobei die elektrischen Kontakte des Chip's mit elektrischen Kontakten der zweiten Schicht kontaktiert sind und wobei mittels der ausgehärteten Klebemasse eine dauerhafte elektrische Verbindung zwischen den elektrischen Kontakten des Chip's und den elektrischen Kontakten des Chipkarten-Moduls hergestellt ist.

公开(公告)号：AT454712T

公开(公告)日：2010-01-15

申请号：AT96937189

申请日：1996-09-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEITZER JOSEF ,  KIRSCHBAUER JOSEF ,  STAMPKA PETER

IPC: H01L21/60 ,  H01L21/607 ,  B23K20/00

Abstract: The invention concerns a method of electrically connecting a semiconductor chip (1) to at least one contact surface by means of a thin wire whose first end is welded to the at least one contact surface and whose second end is connected to a contact area of the semiconductor chip (1). In order to establish a good connection between the wire and the contact area of the semiconductor chip (1), the second end of the wire is welded to a wedge-shaped metal part (5) which is disposed on the contact area of the semiconductor chip (1) and is conductively connected thereto. The metal part (5) is formed by a nailhead contact (6) whose free end is guided in a loop and connected to the nailhead by a wedge contact.

公开(公告)号：DE102008011611A1

公开(公告)日：2009-09-03

申请号：DE102008011611

申请日：2008-02-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOUDEAU DETLEF ,  MEHLHAFF ANDREAS ,  PUESCHNER FRANK ,  STAMPKA PETER

IPC: G06K19/067 ,  B42D15/10

Abstract: The chip card comprises a card body comprising first (11), second (12) and third (13) layers, a semiconductor chip completely covered by the card body, and an antenna arranged in the map body. The third layer is arranged between the first and the second layers, consists of a material with a melting point of less than 150[deg] C and comprises a thickness of 3-10 mu m. The semiconductor chip is a part of a semiconductor module, which comprises a carrier and a housing for the semiconductor chip and has rounded edges with an edge radius of >= 0.1 mm. The chip card comprises a card body comprising first (11), second (12) and third (13) layers, a semiconductor chip completely covered by the card body, and an antenna arranged in the map body. The third layer is arranged between the first and the second layers, consists of a material with a melting point of less than 150[deg] C and comprises a thickness of 3-10 mu m. The semiconductor chip is a part of a semiconductor module, which comprises a carrier and a housing for the semiconductor chip and has rounded edges with an edge radius of >= 0.1 mm. The first or second layer is optically transparent. The third layer is a carrier for optical or electronic security features and is optically transparent in sub-areas. An independent claim is included for a method for manufacturing a card body for a smart card.

公开(公告)号：DE102004025911B4

公开(公告)日：2008-07-31

申请号：DE102004025911

申请日：2004-05-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUELLER JOCHEN ,  STAMPKA PETER ,  SCHINDLER WOLFGANG ,  PUESCHNER FRANK

IPC: G06K19/077 ,  G06K19/07 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544

Abstract: The chip card includes a support (2) on which a chip (3) is mounted opposite to contact surfaces (1) of the support and encapsulated. The contact surfaces have thickness larger than the thickness of the support. Terminals of the chip are connected to the contact surfaces by a jumper wire passing across openings (4) in the support. The Independent claims are also included for the following: (A) a method of manufacturing a contact chip card (B) utilization of the chip card in a wireless telephone.

公开(公告)号：DE102004011702A1

公开(公告)日：2005-10-06

申请号：DE102004011702

申请日：2004-03-10

Applicant: CIRCLE SMART CARD AG ,  INFINEON TECHNOLOGIES AG

Inventor： PUESCHNER FRANK ,  PROSKE REINHARD ,  MUELLER-HIPPER ANDREAS ,  STAMPKA PETER

IPC: B42D15/10 ,  B29C45/14 ,  G06K19/06 ,  G06K19/07 ,  G06K19/077 ,  H01L21/52

公开(公告)号：DE102004010715A1

公开(公告)日：2005-09-29

申请号：DE102004010715

申请日：2004-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KARL ANDREAS ,  PUESCHNER FRANK ,  SCHINDLER WOLFGANG ,  STAMPKA PETER

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077

Abstract: A chip module has an electroconductive coupling (4) between a carrier (1) and a semiconductor chip (2). The card main body (6) has a connection (5) exposing an antenna connected by an electroconductive component (7) to the semiconductor chip. A connection mediator (3) projects from the inner side of the electroconductive component and contacts the lower surface of the electroconductive coupling. An independent claim is also included for a chip card manufacturing method.

公开(公告)号：DE10329653A1

公开(公告)日：2005-02-10

申请号：DE10329653

申请日：2003-07-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KARL ANDREAS ,  PUESCHNER FRANK ,  SCHINDLER WOLFGANG ,  STAMPKA PETER

IPC: G06K19/077 ,  H05K1/18 ,  H05K3/32

Abstract: Contact hill e.g. stud bump (3), or chemical or galvanic electric conducting material, is formed on conductive connection (4) for later connection with card body (6) or connection location (5) of antenna. Size of stud bump is between 5 to 100 Microm height. Non-conductive hot melt adhesive (8) fills gaps between chip module and connection location when chip module and card body are brought together. Independent claims included for 1) procedure to manufacture chip card 2) chip module to use in chip card.

公开(公告)号：DE19515187C2

公开(公告)日：2003-07-10

申请号：DE19515187

申请日：1995-04-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ATZESDORFER ALEXANDRA ,  STAMPKA PETER ,  HOUDEAU DETLEF

IPC: H01L23/28 ,  H01L23/58 ,  H01L23/31 ,  H01L23/04 ,  G06K19/077 ,  H05K3/28 ,  B42D15/10

Abstract: The description relates to a chip cover (6, 11) to cover completely or partially electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8). The chip cover (6, 11) is characterized in that a pigmenting agent is added to the cover material. It is thus possible reliably to prevent unauthorised analyses and/or manipulations of the chip (1, 8).