Abstract:
An operating voltage selection circuit for non-volatile semiconductor memories, whose particularity resides in the fact that it comprises:
-- means (1) for reading at least one one-time programmable non-volatile memory cell (10), suitable to generate a signal (LV) which indicates the requested type of operating voltage of a non-volatile memory, which depends on the programmed or non-programmed state of the memory cell; -- memory enabling means (5), which comprise an inverter (30, 31) and are provided with means (32) for modifying the switching threshold of the inverter as a function of the signal that indicates the requested type of operating voltage; -- output means (2), which are connected to means for sensing data of the memory and to output terminals of the memory, comprising a CMOS inverter (20, 50) and means (23) for modifying the output current of the inverter as a function of the signal (LV) for indicating the requested type of operating voltage; and -- means (8) for the internal synchronization of the memory, which comprise pluralities of transistors (40, 41, 42) connected in a series/parallel configuration which is determined by the signal (LV) for indicating the requested type of operating voltage, in order to generate signals (CK1, CK2, CK3) for the internal synchronization of the memory.
Abstract:
The invention relates to a method for programming a non-volatile memory device of the multi-level type, comprising a plurality of transistor cells grouped into memory words and conventionally provided with gate and drain terminals. The method applies different drain voltage values at different threshold values. Such values are directly proportional to the threshold levels to be attained by the individual memory word bits, and effective to provide for a simultaneous attainment of the levels, in a seeking-to manner, of the levels at the end of a limited number of pulses. Advantageously, a constant gate voltage value is concurrently applied to the gate terminals of said cells, such that the cell programming time is unrelated to the threshold level sought.
Abstract:
Integrated circuit (106;106') capable of storing data in digital format, particularly for application in a memory card which can be associated for operation with an external acquisition system and an external processing system, comprising: input/output means (2',114',7',122) for receiving the data from the external acquisition system or from the external processing system, for sending the data to the external processing apparatus and for receiving a digital circuit-command signal from the said system and from the said apparatus; a non-volatile electrically programmable memory (101) for storing the said digital data, comprising a first terminal (133) for an electrical programming signal capable of enabling the storage of the data available on the said input/output means and a second terminal (131) for an electrical reading signal capable of enabling the output of the data from the memory to make them available on the input/output means; memory control means (111) connected to the said first and second terminals and to the said input/output means to generate the electrical memory-programming and memory-reading signals from the said command signal. The memory is of the type which can be erased by exposure to electromagnetic radiation, particularly ultraviolet radiation, to permit the non-electrical erasure of the stored data. The integrated circuit can be incorporated in a memory card whose outer casing is provided, at the position of the memory, with means (103) which are transparent to electromagnetic radiation.
Abstract:
The invention relates to a circuit structure (1) for programming data in reference cells (3) of an electrically programmable/erasable integrated non-volatile memory device, comprising a matrix of multi-level memory cells and at least one corresponding reference cell provided for comparison with a respective memory cell during the read phase. The reference cell (3) is incorporated, along with other cells of the same type, to a reference cell sub-matrix (4) which is structurally independent of the memory cell matrix and directly accessed from outside in the DMA mode. The bit lines of the sub-matrix (4) branch off to a series of switches (9) which are individually operated by respective control signals REF(i) issued from a logic circuit (8) with the purpose of selectively connecting the bit lines to a single external I/O terminal (10) through a single addressing line (11) of the access DMA mode.
Abstract:
The integrated device (100) comprises a PMOS transistor (101) and a voltage selector (1) having an output (6g) connected to the bulk terminal (101d) of the PMOS transistor (101). The voltage selector (1) comprises an input stage (2) supplying (2c) a supply voltage (Vdd) or a programming voltage (Vpp) according to whether the device (100) is in a reading step or in a programming step; a comparator (3) connected to the output (2c) of the input stage (2), receiving a boosted voltage (Vboost), and generating (3g) a first control signal (OC), the state whereof depends upon the comparison of the voltages at the inputs of the comparator (3); a logic circuit (4) connected to the output (3g) of the comparator (3) and generating a second control signal (VDDIS), the state whereof depends upon the state of the first control signal (OC) and of a third-level signal (VTL); and a switching circuit (6) controlled by the first control signal (OC), by the second control signal (VDDIS), and by the third-level signal (VTL) and supplying (6g) each time the highest among the supply voltage (Vdd), the boosted voltage (Vboost), and the programming voltage (Vpp).
Abstract:
The charge pump (1) comprises a phase-generator circuit (6) generating phase signals (A, B) and comprising an oscillator circuit (12.1-12.3) supplying a clock signal (CK), a current-limitation circuit (24.1-24.3) to limit the current flowing in the oscillator circuit, and a control circuit (26') supplying on an output (32a) a control signal (V REF ) supplied to the current-limitation circuit. The control circuit (26') comprises a first current mirror (60) connected to a ground line (22), a second current mirror (62) connected to a supply line (20), a cascode structure (64), arranged between the first and the second current mirrors (60, 62) and connected to the output (32a) of the control circuit (26') to compensate the effects on the control signal (V REF ) caused by sharp relative variations between the potential (V DD ) of the supply line and the potential (V GND ) of the ground line, and a compensation circuit (70) to compensate the effects on the control signal (V REF ) caused by sharp relative variations between the potential (V DD ) of the supply line and the potential (V GND ) of the ground line and by slow variations in temperature.
Abstract:
A multilevel memory device comprises an array of multilevel memory cells (M 1j - M kj , M 1z - M kz ) arranged in rows (WL 1 - WL k ) and columns (BL j , BL z ), each memory cell being capable of being programmed in m = 2 n ( n > 1) distinct programming states, and a sensing arrangement for sensing the memory cells, the sensing arrangement comprising at least ( m - 1) reference columns (BL ref,i , BL ref,h ) of memory cells. The reference columns comprises a number of memory cells substantially identical to the number of memory cells of each column of the array, a smaller number of memory cells (M ref,i , M, ref,h ) of each reference column being multilevel reference memory cells programmed in a respective reference programming state and activatable for sinking a respective reference current (I R,0 ,I R,1 ,I R,2 ), the remaining larger number of memory cells of each reference column being dummy non-conductive memory cells (M dumr,1i - M dumr,ki , M dumr,1h - M dumr,kh ) structurally identical to the reference memory cells and to the memory cells of the array.
Abstract:
An operating voltage selection circuit for non-volatile semiconductor memories, whose particularity resides in the fact that it comprises:
-- means (1) for reading at least one one-time programmable non-volatile memory cell (10), suitable to generate a signal (LV) which indicates the requested type of operating voltage of a non-volatile memory, which depends on the programmed or non-programmed state of the memory cell; -- memory enabling means (5), which comprise an inverter (30, 31) and are provided with means (32) for modifying the switching threshold of the inverter as a function of the signal that indicates the requested type of operating voltage; -- output means (2), which are connected to means for sensing data of the memory and to output terminals of the memory, comprising a CMOS inverter (20, 50) and means (23) for modifying the output current of the inverter as a function of the signal (LV) for indicating the requested type of operating voltage; and -- means (8) for the internal synchronization of the memory, which comprise pluralities of transistors (40, 41, 42) connected in a series/parallel configuration which is determined by the signal (LV) for indicating the requested type of operating voltage, in order to generate signals (CK1, CK2, CK3) for the internal synchronization of the memory.