Abstract:
A cold cathode (3) in the form of a solid thin film component is the basis for electron-optical terminal image devices. The thin-film structure consists of a base electrode (5), e.g. in the form of a bundle of parallel strips, an insulating film (6), a semiconductor film (7) and a covering electrode (8), e.g. also a bundle of parallel strips but running perpendicularly to the base electrode (5) bundle. This set of layers borne on a substrate plate (4), is in an evacuated casing (2) and is opposite a fluorescent screen (12) or a light emitter (15), the metallised coating (11) of which forms the counter-pole for the electron acceleration chamber (9). The main applications of such electron-optical terminal image devices are embodiments as matrix-addressed flat displays, image converters or write/read lines.
Abstract:
A higher performance dielectric device is provided. An electron emitter (10A) applying the dielectric device according to the present invention includes an emitter formed of a dielectric (12), and an upper electrode (14) and a lower electrode (16) to which a drive voltage is applied to cause electron emission. The emitter includes plural dielectric particles (12e), and plural dielectric particles of smaller particle size (12f) which are filled in spaces between the plural dielectric particles. The emitter having the aforesaid construction is formed by an aerosol deposition method or a sol impregnation method.
Abstract:
A dielectric-film-type electron emitter includes an emitter section (12), a first electrode (14), and a second electrode (16). The emitter section is formed of a thin layer of a polycrystalline dielectric material. The dielectric material constituting the emitter section is formed of a material having high mechanical quality factor (Qm). Specifically, the dielectric material has a Qm higher than that of a so-called low-Qm material (a material having a Qm of 100 or less). The Qm of the dielectric material is preferably 300 or more, more preferably 500 or more.
Abstract:
An electron source device comprising a porous layer (for example, a porous alumina layer), which is composed of an insulator and has many microholes extending in a direction perpendicular to the major surface, and first and second conductor layers disposed on both sides of the porous layer is characterized in that the current density (I/S) is 1 μA/cm2 or higher when a direct current voltage is applied between the second conductor layer and the first conductor layer while using the second conductor layer as an anode. In this case, S represents the overlapping area among the first conductor layer, the second conductor layer and the porous layer. Consequently, an electron source device having a high electron emission ability and a long life even when the degree of vacuum is low can be obtained at low cost. A display having a high luminous efficiency and high reliability can be realized by using this electron source device.
Abstract:
An emitter (50, 100) has an electron supply (10) and a porous cathode layer (14) having nanohole openings (22). The emitter also has a tunneling layer (20) disposed between the electron supply and the cathode layer.
Abstract:
A second interlayer insulation layer (15) is formed under an upper wiring electrode (16) serving as a power feed line to an upper electrode (13) in each thin-film type electron source array so as to prevent a failure of short-circuit. Further, an electron emission portion is limited by the second interlayer insulationlayer (15) so as to cover defects unevenly distributed in the border between an electron acceleration layer (12) and a first interlayer insulation layer (14). Thus, a failure of time dependent insulation breakdown is suppressed.
Abstract:
An electron emission device includes a number of first electrodes and a number of second electrodes intersected with each other to define a number of intersections. An electron emission unit is sandwiched between the first electrode and the second electrode at each of the number of intersections, wherein the electron emission unit includes a semiconductor layer and an insulating layer stacked together, the semiconductor layer defines a number of holes, the carbon nanotube layer covers the number of holes, and a portion of the carbon nanotube layer is suspended on the number of holes.