公开(公告)号：US09795030B2

公开(公告)日：2017-10-17

申请号：US15468333

申请日：2017-03-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09661749B2

公开(公告)日：2017-05-23

申请号：US14364914

申请日：2012-11-29

Applicant: Panasonic Corporation

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/00 ,  B32B7/02 ,  H05K1/03 ,  H05K3/02 ,  B32B5/02 ,  B32B15/12 ,  B32B15/14

CPC classification number: H05K1/036 ,  B32B5/022 ,  B32B5/024 ,  B32B7/02 ,  B32B15/12 ,  B32B15/14 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/10 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2457/08 ,  H05K1/00 ,  H05K3/022 ,  H05K3/025 ,  H05K2201/0212 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/24942

Abstract: A metal-clad laminate according to the present embodiment includes an insulating layer, and a metal layer present on at least one surface side of the insulating layer. The insulating layer is a laminate of at least three layers of a center layer, a first resin layer present on one surface side of the center layer, and a second resin layer present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a resin composition. Coefficients of thermal expansion of the cured products of the resin compositions contained in the first resin layer and the second resin layer are smaller than a coefficient of thermal expansion of the cured product of the resin composition contained in the center layer.

公开(公告)号：US09420685B2

公开(公告)日：2016-08-16

申请号：US14444583

申请日：2014-07-28

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K3/28 ,  H01L23/498 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L23/49844 ,  H01L23/562 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/16237 ,  H05K1/181 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/0275 ,  H05K2201/09909 ,  H05K2201/10007 ,  H05K2201/2009 ,  Y10T29/4913 ,  H01L2924/014

Abstract: A substrate board includes an electrical connection network on a face thereof. An integrated-circuit chip is mounted to the face of the substrate board in electrical contact with the electrical connection network. A local reinforcing or balancing layer made of a non-metallic material is mounted to the face of the substrate board in at least one local zone free of the face which is free of metal portions of the electrical connection network.

Abstract translation: 基板包括在其表面上的电连接网络。 集成电路芯片安装到与电连接网络电接触的基板的表面。 由非金属材料制成的局部增强或平衡层在至少一个不具有电连接网络的金属部分的表面的局部区域中安装到基板的表面上。

公开(公告)号：US20150271919A1

公开(公告)日：2015-09-24

申请号：US14732817

申请日：2015-06-08

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hiroshi Yamazaki ,  Yoshimi lgarashi

IPC: H05K1/03 ,  G03F7/09 ,  H05K3/06

CPC classification number: G06F3/041 ,  G03F7/0005 ,  G03F7/027 ,  G03F7/09 ,  G03F7/092 ,  G03F7/095 ,  G03F7/0952 ,  G03F7/0955 ,  G03F7/2022 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0275 ,  Y10T428/24802

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure ste

Abstract translation: 本发明的导电图案形成方法包括：第一曝光步骤，以图案化方式将有源光照射到设置在基板上的感光性树脂层的感光层和设置在感光性树脂层的表面上的导电膜上 一侧与基板相对; 至少在第一曝光步骤中，在存在氧气的情况下将活性光辐射到感光层的部分或全部未暴露的第二曝光步骤; 以及显影步骤，在第二次曝光之后显影感光层以形成导电图案

公开(公告)号：US20150091177A1

公开(公告)日：2015-04-02

申请号：US14142719

申请日：2013-12-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Seob Hong ,  Eun Jung Jo ,  Kyu Hwan Oh ,  Kang Hyun Lee

IPC: H01L23/482 ,  H01L23/00

CPC classification number: H01L23/482 ,  H01L23/295 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/29 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/81447 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19106 ,  H05K1/0366 ,  H05K1/141 ,  H05K3/181 ,  H05K2201/0275 ,  H05K2201/049 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material.

Abstract translation: 这里公开了一种外部连接端子部件，具有外部连接端子部件的半导体封装件及其制造方法。 根据本发明的优选实施例，外部连接端子部分包括形成在绝缘材料的两个表面上的绝缘材料和金属电镀图案。

公开(公告)号：US11787732B2

公开(公告)日：2023-10-17

申请号：US16600769

申请日：2019-10-14

Applicant: Electric Glass Fiber America, LLC

Inventor： Hong Li

IPC: C03C13/00 ,  C03C3/093 ,  C03C3/118 ,  C03C13/06 ,  C03C3/091 ,  H05K1/03

CPC classification number: C03C13/00 ,  C03C3/091 ,  C03C3/093 ,  C03C3/118 ,  C03C13/06 ,  H05K1/0306 ,  C03C2213/00 ,  H05K2201/0275

Abstract: New glass compositions and applications thereof are disclosed. A glass composition as described herein can include 50 to 55 weight percent SiO2, 17 to 26 weight percent B2O3, 13 to 19 weight percent Al2O3, 0 to 8.5 weight percent MgO, 0 to 7.5 weight percent ZnO, 0 to 6 weight percent CaO, 0 to 1.5 weight percent Li2O, 0 to 1.5 weight percent F2, 0 to 1 weight percent Na2O, 0 to 1 weight percent Fe2O3, 0 to 1 weight percent TiO2, and 0 to 8 weight percent of other constituents. Also described herein are glass fibers formed from such compositions, composites, and articles of manufacture comprising the glass compositions and/or glass fibers.

公开(公告)号：US20160246394A1

公开(公告)日：2016-08-25

申请号：US15144850

申请日：2016-05-03

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Hiroshi Yamazaki ,  Yoshimi Igarashi

IPC: G06F3/041 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: G06F3/041 ,  G03F7/0005 ,  G03F7/027 ,  G03F7/09 ,  G03F7/092 ,  G03F7/095 ,  G03F7/0952 ,  G03F7/0955 ,  G03F7/2022 ,  G06F3/044 ,  G06F2203/04112 ,  H05K1/0274 ,  H05K1/0313 ,  H05K1/036 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0275 ,  Y10T428/24802

Abstract: A conductive pattern formation method of the present invention includes a first exposure step of radiating active light in a patterned manner to a photosensitive layer including a photosensitive resin layer provided on a substrate and a conductive film provided on a surface of the photosensitive resin layer on a side opposite to the substrate; a second exposure step of radiating active light, in the presence of oxygen, to some or all of the portions of the photosensitive layer not exposed at least in the first exposure step; and a development step of developing the photosensitive layer to form a conductive pattern following the second exposure step.

Abstract translation: 本发明的导电图案形成方法包括：第一曝光步骤，以图案化方式将有源光照射到设置在基板上的感光性树脂层的感光层和设置在感光性树脂层的表面上的导电膜上 一侧与基板相对; 至少在第一曝光步骤中，在存在氧气的情况下将活性光辐射到感光层的部分或全部未暴露的第二曝光步骤; 以及在第二曝光步骤之后使感光层显影以形成导电图案的显影步骤。

公开(公告)号：US20160007453A1

公开(公告)日：2016-01-07

申请号：US14770143

申请日：2014-02-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kohichiro Kawate

IPC: H05K1/03 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0366 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0215 ,  H05K2201/0275 ,  H05K2201/029 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: Problem: To prepare a prepreg having high thermal conductivity and a low thermal expansion coefficient. Resolution Means: The prepreg of the present disclosure is composed of a composite layer including an alumina-containing cloth including ceramic fibers and a thermosetting resin composition impregnated into the alumina-containing cloth and having a thermal conductivity coefficient greater than or equal to 1.0 W/(mK).

Abstract translation: 问题：制备具有高热导率和低热膨胀系数的预浸料。 分解方法：本公开的预浸料由包含含有陶瓷纤维的含氧化铝布和浸渍在含氧化铝的布中的热固性树脂组合物的复合层构成，其导热系数大于或等于1.0W / （mK）。

公开(公告)号：US20150327355A1

公开(公告)日：2015-11-12

申请号：US14443231

申请日：2013-11-15

Applicant: JUMATECH GMBH

Inventor： Markus WÖLFEL

IPC: H05K1/02 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/0265 ,  H05K1/0278 ,  H05K1/111 ,  H05K3/0014 ,  H05K3/0017 ,  H05K3/202 ,  H05K2201/0275 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/057 ,  H05K2201/09027 ,  H05K2201/0969 ,  H05K2201/1028 ,  Y10T29/49156

Abstract: An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section.

Abstract translation: 一种角度可调的印刷电路板结构，其具有相对于彼此成角度地布置的两个印刷电路板部分。 印刷电路板结构包含至少一个导电元件，其至少主要嵌入在印刷电路板结构中，并且在两个接触焊盘之间延伸并且导电地连接到所述接触焊盘。 两个接触垫位于不同的印刷电路板部分上。 印刷电路板部分可相对于彼此具有角度可调节和/或成角度，同时维持接触焊盘和至少一个传导元件之间的连接，并且通过经印刷的弯曲边缘弯曲至少一个导电元件 电路板部分。 如横截面所示，导电元件沿着弯曲边缘比垂直方向具有更大的程度。

公开(公告)号：US20150307708A1

公开(公告)日：2015-10-29

申请号：US14435574

申请日：2013-10-18

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Tomo CHIBA ,  Hiroshi TAKAHASHI ,  Eisuke SHIGA ,  Takaaki OGASHIWA

IPC: C08L73/00 ,  C08J5/24 ,  H05K1/03 ,  C08L63/00

CPC classification number: C08L73/00 ,  B32B5/26 ,  B32B15/14 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2457/08 ,  C08G59/24 ,  C08G59/4246 ,  C08G59/621 ,  C08G77/18 ,  C08G77/52 ,  C08J5/24 ,  C08J2363/00 ,  C08J2373/00 ,  C08J2383/06 ,  C08J2463/00 ,  C08J2473/00 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  C08L63/06 ,  C08L83/06 ,  C08L83/14 ,  C08L2201/02 ,  C08L2203/206 ,  C08L2205/025 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0275 ,  H05K2201/029

Abstract: An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

Abstract translation: 本发明的目的是提供一种能够获得具有高阻燃性，高耐热性，小热膨胀系数和高钻孔加工性的固化产物的树脂组合物，具有树脂组合物，层压体和金属箔的预浸料 具有该预浸料的复合层压板和具有该树脂组合物的印刷电路板。 一种树脂组合物，其至少具有通过使具有羧基的线性聚硅氧烷（a）与具有环氧基的环状环氧化合物（b）反应制备的环氧硅氧烷树脂（A），使得环状环氧化合物的环氧基（ b）基于线性聚硅氧烷（a）的羧基，氰酸酯化合物（B）和/或酚醛树脂（C）和无机填料（D）为2〜10当量。