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51.发明申请公开(公告)号：US20160007477A1
公开(公告)日：2016-01-07
申请号：US14769574
申请日：2014-03-06
Applicant: DIS CORPORATION
Inventor： Sunao Yoshihara , Haruhiko Katsuta , Yoshinori Katayama , Jun Shirakami , Akira Murakawa , Wataru Fujikawa , Yukie Saitou
CPC classification number: H05K3/188 , C25D5/02 , C25D5/56 , C25D7/00 , H05K1/0313 , H05K1/097 , H05K3/12 , H05K3/207 , H05K3/246 , H05K2201/0203 , H05K2201/0224 , H05K2201/0257 , H05K2201/09218 , H05K2203/0108 , H05K2203/097
Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.
Abstract translation: 提供了一种形成导电超细纹图案的方法，其具有优异的图案横截面形状，其通过包括印刷工艺和电镀工艺的复合技术提供，此外，通过赋予层压体的每个界面优异的粘附性，包括 还提供了电镀芯图案，可优选用作高精度电路的导电超细图案及其制造方法。 该方法包括（1）在基板上涂布树脂组合物以形成接收层的步骤; （2）通过反胶印方法印刷含有电镀芯颗粒的油墨的步骤，以在接收层上形成电镀芯图案; 和（3）通过电解电镀法在步骤（2）中形成的镀覆芯图案上沉积金属的步骤。
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公开(公告)号：US09049787B2
公开(公告)日：2015-06-02
申请号：US13745352
申请日：2013-01-18
Applicant: Molex Incorporated
Inventor： Mark Alan Bugg
IPC: H05K1/09 , H05K1/02 , H01R9/03 , H01R13/6474
CPC classification number: H05K1/0216 , H01R9/032 , H01R12/57 , H01R12/62 , H01R12/775 , H01R13/6474 , H05K1/0296 , H05K1/111 , H05K1/112 , H05K1/117 , H05K3/3405 , H05K2201/09218 , H05K2201/09381 , H05K2201/09418 , H05K2201/09727 , H05K2201/10356
Abstract: A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.
Abstract translation: 公开的用于将电子设备连接在一起的桨卡结构。 桨卡采取电路板的形式，其具有成对地布置在其上的多个导电接触垫。 每对的接触垫彼此间隔开以提供一对点，电缆线自由端可以通过焊接方式终止于该点。 彼此分开的焊盘的间隔实际上减少到电路板上的电缆线端接区域中的电容量，从而降低了在该区域的高频下的阻抗和插入损耗。 每对的接触垫可以通过在接触垫之间纵向延伸的薄导电迹线进一步互连在一起。
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公开(公告)号：US20140202751A1
公开(公告)日：2014-07-24
申请号：US13745352
申请日：2013-01-18
Applicant: Molex Incorporated
Inventor： Mark Alan BUGG
CPC classification number: H05K1/0216 , H01R9/032 , H01R12/57 , H01R12/62 , H01R12/775 , H01R13/6474 , H05K1/0296 , H05K1/111 , H05K1/112 , H05K1/117 , H05K3/3405 , H05K2201/09218 , H05K2201/09381 , H05K2201/09418 , H05K2201/09727 , H05K2201/10356
Abstract: A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.
Abstract translation: 公开的用于将电子设备连接在一起的桨卡结构。 桨卡采取电路板的形式，其具有成对地布置在其上的多个导电接触垫。 每对的接触垫彼此间隔开以提供一对点，电缆线自由端可以通过焊接方式终止于该点。 彼此分开的焊盘的间隔实际上减少到电路板上的电缆线端接区域中的电容量，从而降低了在该区域的高频下的阻抗和插入损耗。 每对的接触垫可以通过在接触垫之间纵向延伸的薄导电迹线进一步互连在一起。
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公开(公告)号：JP6358132B2
公开(公告)日：2018-07-18
申请号：JP2015041719
申请日：2015-03-03
Applicant: オムロン株式会社
Inventor： 川井 若浩
CPC classification number: H05K1/0284 , H01L2224/20 , H01L2224/24195 , H05K1/185 , H05K2201/0209 , H05K2201/0215 , H05K2201/09118 , H05K2201/09218 , H05K2201/10636 , H05K2203/1469 , Y02P70/611
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公开(公告)号：JP2017224642A
公开(公告)日：2017-12-21
申请号：JP2016116956
申请日：2016-06-13
Applicant: 新光電気工業株式会社
CPC classification number: H01L23/49838 , H01L21/481 , H01L21/4853 , H01L23/145 , H01L23/49822 , H01L23/49866 , H05K1/0284 , H05K1/0296 , H05K1/111 , H05K1/0216 , H05K1/181 , H05K2201/09218
Abstract: 【課題】配線層の高密度化に伴う絶縁信頼性の低下を抑制可能な配線基板を提供する。 【解決手段】本配線基板は、一方の側に、凸部を備えた絶縁層と、前記凸部の上端面に形成された配線層と、を有し、前記配線層は、前記凸部の上端面の外周部を露出するように形成された第1金属層と、前記第1金属層の上面に形成され、下面の外周部が前記第1金属層の上面の外側に露出すると共に、前記凸部の上端面よりも幅広く設けた第2金属層と、前記第1金属層の側面、並びに、前記第2金属層の上面、側面、及び下面の外周部、を被覆すると共に、前記凸部の上端面と前記第2金属層の下面の外周部とが対向する領域を充填する第3金属層と、を有し、前記第2金属層と前記第3金属層は、異なる材料からなる。 【選択図】図1
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Patent Agency Ranking
公开(公告)号：KR20180017867A
公开(公告)日：2018-02-21
申请号：KR20160102364
申请日：2016-08-11
CPC classification number: H01P7/082 , H05K1/0227 , H05K1/0353 , H05K1/115 , H05K2201/09218 , H05K2201/09618
Abstract: 개시된발명의일 측면은인쇄회로기판에일 측면에분할공진기를개선하여전자파차폐효과를향상시키는분할공진기를제공하고, 인쇄회로기판의외곽으로발생하는방사필드(field)를흡수한다. 개시된발명의일 측면에따른인쇄회로기판은전자부품이실장되는기판; 및상기기판의일측에마련되는유전체기판; 상기유전체기판의내부에마련되어, 상기기판의두께방향으로상기기판과이격된거리에배치되고, 서로마주보며배열되는한 쌍의도전체; 및상기한 쌍의도전체를연결하고, 상기기판의두께와평행하게마련되는연결부;를포함한다.
Abstract translation: 公开了一种分裂谐振器和包括该分裂谐振器的印刷电路板（PCB）。 分裂谐振器安装在PCB的一侧以改善电磁屏蔽效应，并吸收辐射到PCB外壁的辐射场。 PCB包括：衬底，其上填充有一个或多个电子部件; 安装到所述衬底的一侧的电介质衬底; 一对设置在所述电介质基板上的导体，所述导体在所述基板的厚度方向上与所述基板隔开预定距离并且布置为彼此面对; 以及连接部分，其被构造为互连所述一对导体，并且与所述基板的厚度方向平行地布置。
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公开(公告)号：US20230380051A1
公开(公告)日：2023-11-23
申请号：US18246292
申请日：2021-06-29
Inventor： Liliang TIAN
CPC classification number: H05K1/0243 , H03B5/18 , H05K1/0215 , H05K2201/10075 , H05K2201/10287 , H05K2201/09218
Abstract: The present disclosure discloses a crystal oscillator circuit on a PCB. The crystal oscillator circuit includes a crystal oscillator including an input end, an output end, a first grounding end and a second grounding end; a first capacitor with one end connected to the input end; and a second capacitor with one end connected to the output end, wherein the first grounding end is connected to a first grounding hole, the second grounding end is connected to a second grounding hole, the other end of the first capacitor is connected to a third grounding hole, the other end of the second capacitor is connected to a fourth grounding hole. The present disclosure further discloses the PCB and a server.
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公开(公告)号：US20230300546A1
公开(公告)日：2023-09-21
申请号：US18186319
申请日：2023-03-20
Applicant: Sivantos Pte. Ltd.
Inventor： Keh Hoe Low
CPC classification number: H04R25/602 , H05K1/181 , H04R2225/51 , H04R2225/021 , H05K2201/09218
Abstract: A hearing device has a printed circuit board on which a battery module is fastened. The battery module has a battery cell with a case, an antenna being integrated into the case. The hearing device further has a printed circuit board, on which a battery module is fastened. In particular, the printed circuit board is configured to be rigid, and is manufactured from a glass fiber-reinforced epoxy resin.
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公开(公告)号：US11690166B1
公开(公告)日：2023-06-27
申请号：US17374379
申请日：2021-07-13
Applicant: Dark Wolf Ventures LLC
Inventor： Phil Kirmuss , Glenn Williams , Brian E. Wilkerson
CPC classification number: H05K1/0237 , H05K1/181 , H05K2201/09218
Abstract: Broadly, embodiments of the inventive concepts disclosed herein are directed to a PCB data board that allows for either a single configuration or to be deployed in conjunction with another configuration such as being able to control a radio and sending PLI (Positional Location Information) data. The PCB data board and associated code can accommodate multiple different configurations. The PCB data board may facilitate multiple radio connectivity, enhanced configuration utilities, and additional functions.
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公开(公告)号：US10079417B2
公开(公告)日：2018-09-18
申请号：US15614640
申请日：2017-06-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Satoshi Ishino , Jun Sasaki , Kuniaki Yosui , Takahiro Baba , Nobuo Ikemoto
IPC: H05K7/00 , H01P3/08 , H01P3/02 , H05K1/02 , H05K1/14 , H01P5/00 , H05K5/00 , H05K1/18 , H01P5/12 , H01P5/02 , H05K3/36 , H01P3/00
CPC classification number: H01P3/02 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/082 , H01P3/085 , H01P5/00 , H01P5/028 , H05K1/0218 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/025 , H05K1/028 , H05K1/0296 , H05K1/14 , H05K1/148 , H05K1/186 , H05K3/361 , H05K2201/0707 , H05K2201/09218
Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.
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