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    WIRING BOARD
    52.
    发明公开
    WIRING BOARD 审中-公开

    公开(公告)号：US20230300987A1

    公开(公告)日：2023-09-21

    申请号：US18175898

    申请日：2023-02-28

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Masahiro KYOZUKA

    IPC: H05K3/00 ,  H05K1/05

    CPC classification number: H05K3/0011 ,  H05K1/05 ,  H05K2201/10204 ,  H05K2201/093 ,  H05K2201/09372

    Abstract: A wiring board includes a first insulating layer, a pad formed on one surface of the first insulating layer, a second insulating layer, formed on the one surface of the first insulating layer, and including an opening exposing the pad, and a reinforcing metal layer formed in contact with the first insulating layer, and provided around the pad so as to be separated from the pad in a plan view. The pad is disposed inside the opening without making contact with the second insulating layer. An end, on a side of the first insulating layer, in a portion of an inner side surface of the opening of the second insulating layer makes contact with the reinforcing metal layer, and an end in another portion of the inner side surface of the opening of the second insulating layer makes contact with the one surface of the first insulating layer.

    Circuit Board and Card
    53.
    发明申请
    Circuit Board and Card 审中-公开

    公开(公告)号：US20190207327A1

    公开(公告)日：2019-07-04

    申请号：US16233310

    申请日：2018-12-27

    Applicant: Tyco Electronics (Shanghai) Co. Ltd. ,  TE Connectivity Corporation

    Inventor： Liang Huang ,  Bruce Allen Champion

    IPC: H01R4/02 ,  H01R12/52 ,  H01R12/70 ,  H05K1/11 ,  H05K3/34 ,  H01R13/50 ,  H01R13/502

    CPC classification number: H01R4/02 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/50 ,  H01R13/502 ,  H05K1/11 ,  H05K3/34 ,  H05K2201/09372

    Abstract: A circuit board comprises a row of solder pads adapted to be soldered to a row of contacts of a connector, a plurality of first conductive vias, and a plurality of second conductive vias. The contacts include a plurality of ground contacts and a plurality of signal contacts. The solder pads include a plurality of ground solder pads each soldered to a solder foot of one of the ground contacts and a plurality of signal solder pads each soldered to a solder foot of one of the signal contacts. The first conductive vias correspond to and are electrically connected to the ground solder pads and are electrically connected to each other by a first connection bar. The second conductive vias correspond to and are electrically connected to the ground solder pads and are electrically connected to each other by a second connection bar. The solder foot of each of the ground contacts is disposed between one of the first conductive vias and one of the second conductive vias.

    ELECTRONIC DEVICE
    58.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240196538A1

    公开(公告)日：2024-06-13

    申请号：US18522664

    申请日：2023-11-29

    Applicant: TDK Corporation

    Inventor： Akihiro MASUDA ,  Katsuya MIURA ,  Natsuki KUMAGAI

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/183 ,  H05K1/0203 ,  H05K2201/09372 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003

    Abstract: An electronic device comprises chip components aligned along a predetermined first direction and including respective terminal electrodes, and a metal block including an electrode-opposing surface and a mounting surface. The electrode-opposing surface is opposed and connected to the respective terminal electrodes of the chip components continuously along the first direction. The mounting surface is substantially perpendicular to the electrode-opposing surface and is substantially parallel to the first direction to oppose a land pattern when the electronic device is mounted on the land pattern.

    Electronic Control Device
    59.
    发明公开
    Electronic Control Device 审中-公开

    公开(公告)号：US20230380068A1

    公开(公告)日：2023-11-23

    申请号：US18029945

    申请日：2021-09-24

    Applicant: Hitachi Astemo, Ltd.

    Inventor： Takeshi IGARASHI ,  Katsuya OYAMA

    IPC: H05K1/18 ,  H01L23/12 ,  H01L23/31 ,  H05K3/34

    CPC classification number: H05K1/181 ,  H01L23/12 ,  H01L23/3107 ,  H05K3/3431 ,  H05K2201/09372

    Abstract: An object of the present invention is to provide an electronic control device capable of improving the connection life and reliability of solder connecting a printed circuit board and a QFN type semiconductor package. For this purpose, a printed circuit board 106 includes a first land 109 connected to a first metal terminal 104 via a solder 107, a second land 110 connected to a second metal terminal 105 via a solder 108, a third land 112 disposed on the outer peripheral side of a semiconductor package 101 with respect to the first land 109, and a resist 113 formed on the third land 112 so as to be in contact with the lower surface of a molding resin 103.

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