Abstract:
본 발명은 생체 모방 계산 시스템 구현에 핵심 소자로 사용되는 반도체 소자 및 그 동작방법에 관한 것으로, 주변과 전기적으로 고립되어 단기기억 수단으로 형성된 반도체 소자의 플로팅 바디에 소스, 드레인 및 게이트가 형성되지 않은 일측으로 장기기억 수단을 구비함으로써, 충격이온화에 따른 생체 신경계의 단기기억은 물론, 단-장기기억 전환 특성과 시냅스 전, 후 뉴런의 신호 시간차에 의한 생체의 인과관계 추론 특성을 모두 모방할 수 있는 저전력 시냅스 모방 반도체 소자 및 그 동작방법을 제공한다.
Abstract:
A semiconductor device and a fabricating method thereof are provided. The method of fabricating the semiconductor device includes forming a first mask on a substrate, firstly etching the substrate using the first mask to form a first sidewall of a fin, forming a second mask which is different from the first mask on the substrate, secondly etching the substrate using the second mask to form a second sidewall of the fin.
Abstract:
PURPOSE: An electroluminescence device using an indirect band-gap semiconductor is provided to integrally form an optical device and a circuit device by using the indirect band-gap semiconductor as a light emitting layer at room temperature. CONSTITUTION: An indirect band-gap semiconductor layer(110) includes a Γ-valley having the local minimum value of a Γ-point conduction band in an E-k diagram. A direct band-gap semiconductor layer(120) is formed by the heterojunction of the indirect band-gap semiconductor layer. The direct band-gap semiconductor layer supplies electrons to the Γ-valley of the indirect band-gap semiconductor layer. The indirect band-gap semiconductor layer is used as a light emitting layer for recombination of the electrons. The direct band-gap semiconductor layer is doped with an n-type impurity.
Abstract:
PURPOSE: A method for manufacturing a semiconductor device is provided to simplify an asymmetric device forming process by removing a barrier layer forming process. CONSTITUTION: A conductive pattern is formed on the upper side of a semiconductor substrate. A first junction region is formed on the semiconductor substrate by implanting impurity ions using the conductive pattern as a mask. The conductive pattern and a first insulation layer(125) are formed on the upper side of the first junction region. The first insulation layer is planarized. The sidewall of the first insulation layer is exposed by etching the upper side of the conductive pattern. A spacer(130) is formed on the sidewall of the first insulation layer on the upper side of the conductive pattern. A gate pattern(115c) is formed by etching the conductive pattern using the spacer as an etch mask. A second junction region is formed on the semiconductor substrate by using the gate pattern as the mask.