公开(公告)号：DE112011102577T5

公开(公告)日：2013-05-08

申请号：DE112011102577

申请日：2011-08-04

Applicant: IBM

Inventor： MICHEL BRUNO ,  RUCH PATRICK ,  BRUNSCHWILER THOMAS J

IPC: H01L23/58

Abstract: Die Erfindung bezieht sich insbesondere auf ein integriertes Schaltungsmodul (10c). Das Modul weist eine Schichtstruktur auf, bei der ICs und Elektroden (17) in elektrischer Verbindung mit einer Schicht (16) der Schichtstruktur angeordnet sind. Das Modul weist des Weiteren einen oder mehrere Flüssigkeitskreislaufabschnitte (19) auf, die jeweils dazu bestimmt sind, eine jeweilige Elektrolytlösung (oder zwei verschiedene Lösungen, siehe den unten beschriebenen Doppelstrom-Redoxmodus) aufzunehmen. Jede verwendete Lösung weist lösliche elektroaktive Spezies auf. Ein Flüssigkeitsabschnitt ist dazu konzipiert, eine Elektrolytlösung aufzunehmen und ihr zu ermöglichen, mit entsprechenden Elektroden in Kontakt zu treten, um die ICs im Betrieb mit Leistung zu versorgen. Da Elektroden in das Modul integriert sind, kann elektrische Leistung in die Nähe der ICs geführt werden, wodurch der Wirkungsgrad der Leistungsversorgung erhöht wird. Da eine Flüssigkeit in-situ verwendet wird, kann schließlich eine geeignete Wärmeableitung in Betracht gezogen werden, wobei darauf hingewiesen wird, dass eine elektrische Leistungsversorgung und eine Wärmeableitung einander entsprechen.

公开(公告)号：DE602004014002D1

公开(公告)日：2008-07-03

申请号：DE602004014002

申请日：2004-12-10

Applicant: ESSILOR INT ,  IBM

Inventor： SCHMID HEINZ ,  MICHEL BRUNO ,  KLOTER URS ,  KELLER GERHARD ,  CANO JEAN-PAUL

IPC: B41F17/00 ,  B29C33/30 ,  B29C33/42 ,  B29C39/02 ,  B29C39/10 ,  B41F17/30

Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

公开(公告)号：DE60024046T2

公开(公告)日：2006-07-27

申请号：DE60024046

申请日：2000-06-15

Applicant: IBM

Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  KIND HANNES ,  MICHEL BRUNO

IPC: C23C18/16 ,  C23C18/18 ,  H05K3/18

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

公开(公告)号：DE60024046D1

公开(公告)日：2005-12-22

申请号：DE60024046

申请日：2000-06-15

Applicant: IBM

Inventor： BIEBUYCK HANS ,  DELAMARCHE EMMANUEL ,  GEISSLER MATTHIAS ,  KIND HANNES ,  MICHEL BRUNO

IPC: C23C18/18 ,  C23C18/16 ,  H05K3/18

Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.

公开(公告)号：AU2003278515A1

公开(公告)日：2004-07-14

申请号：AU2003278515

申请日：2003-11-13

Applicant: IBM

Inventor： DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  AMONTOV SERGEY

IPC: B01J19/00 ,  C12Q1/68 ,  G01N33/53 ,  G01N33/543

公开(公告)号：AU2003256008A1

公开(公告)日：2004-03-29

申请号：AU2003256008

申请日：2003-08-28

Applicant: IBM

Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  SCHMID HEINZ ,  WOLF HEIKO

IPC: B01J19/00 ,  B01L99/00 ,  B41K1/30 ,  B41M3/00 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/10 ,  H05K3/12

Abstract: A stamp for transferring a pattern to a substrate in the presence of a third medium, includes a permeable hydrophilic matrix for guiding excess third medium away from the surface of the stamp.

公开(公告)号：DE69522934D1

公开(公告)日：2001-10-31

申请号：DE69522934

申请日：1995-02-07

Applicant: IBM

Inventor： BOURGOIN MARIE ,  JOHNSON BRUCE ,  MICHEL BRUNO

IPC: G01B21/30 ,  G01B7/34 ,  G01L1/04 ,  G01N27/00 ,  G01N37/00 ,  G01Q10/06 ,  G01Q20/00 ,  G01Q30/00 ,  G01Q60/04 ,  G01Q60/26 ,  G01Q60/30 ,  G01Q60/32 ,  G01Q60/34 ,  H01J37/28 ,  H01L21/66

Abstract: PCT No. PCT/EP95/00431 Sec. 371 Date Oct. 3, 1996 Sec. 102(e) Date Oct. 3, 1996 PCT Filed Feb. 7, 1995 PCT Pub. No. WO96/24819 PCT Pub. Date Aug. 15, 1996A new method and an apparatus for measuring the deflection of or the force exerted upon a cantilever-type micromechanical element is presented which is based on detecting radiation emitted from the gap between the cantilever (220) and a second surface (230, 231). The radiation, while occurring spontaneously at high frequencies when appropriately biasing the cantilever and the second surface by a voltage, can be enlarged by using external energy sources. The new method and apparatus is also applied to surface investigation, particularly to dopant profiling.

公开(公告)号：DE69516528T2

公开(公告)日：2000-11-23

申请号：DE69516528

申请日：1995-08-04

Applicant: IBM

Inventor： BIEBUYCK ANDRE ,  MICHEL BRUNO

IPC: B41K1/02 ,  B41F31/18 ,  B41K1/00 ,  C23F1/00 ,  G03F7/00 ,  H01L21/306 ,  H01L21/768 ,  B41C1/02

Abstract: A process for producing lithographic features in a substrate layer is is described, comprising the steps of lowering a stamp (15) carrying an reactant (14) onto a substrate (10), confining the subsequent reaction to the desired pattern, lifting said stamp and removing the debris of the reaction from the substrate. Preferably, the stamp carries the pattern to be etched or depressions corresponding to such a pattern. Using the described methods, patterns with submicron features can be generated. The method allows a general solution to parallel handling and transfer of materials in a variety of technical fields.