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公开(公告)号:DE60115272T2
公开(公告)日:2006-08-10
申请号:DE60115272
申请日:2001-09-13
Applicant: IBM
Inventor: BINNIG K , HAEBERLE WALTER , VETTIGER PETER
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公开(公告)号:DE60203055T2
公开(公告)日:2006-05-11
申请号:DE60203055
申请日:2002-07-19
Applicant: IBM
Inventor: BAECHTOLD PETER , BINNIG K , CHERUBINI GIOVANNI , DHOLAKIA AJAY , DUERIG T , ELEFTHERIOU S , LOELIGER W , VETTIGER PETER
Abstract: Apparatus for detecting data in a sensor signal generated by a read sensor in a local probe data storage device comprises a differentiation for subtracting a value of the sensor signal from the succeeding value of the sensor signal to generate a ternary difference signal; and a convertor connected to the differentiator for converting the difference signal into a binary output signal indicative of the detected data. A local probe data storage device comprising such apparatus is also described.
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公开(公告)号:AT318442T
公开(公告)日:2006-03-15
申请号:AT02707044
申请日:2002-03-15
Applicant: IBM
Inventor: BINNIG GERD K , HAEBERLE WALTER , VETTIGER PETER
Abstract: A method for writing data to and/or reading data from locations on a surface via a tip comprises moving the tip between the locations on the surface. At each location, energy is selectively applied to the surface via the tip and the tip and the surface are selectively forced together in synchronization with the application of energy.
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公开(公告)号:AU2003301975A1
公开(公告)日:2004-06-03
申请号:AU2003301975
申请日:2003-11-07
Applicant: IBM
Inventor: POGGE BERNHARD , DESPONT MICHEL , DRECHSLER UTE , PRASAD CHANDRIKA , VETTIGER PETER , YU ROY
IPC: B81C3/00 , H01L21/768
Abstract: A vertically integrated structure includes a micro-electromechanical system (MEMS) and a chip for delivering signals to the MEMS. The structure includes a metal stud connecting a surface of the chip and the MEMS; the MEMS has an anchor portion having a conducting pad on an underside thereof contacting the metal stud. The MEMS is spaced from the chip by a distance corresponding to a height of the metal stud, and the MEMS includes a doped region in contact with the conducting pad. In particular, the MEMS may include a cantilever structure, with the end portion including a tip extending in the vertical direction. A support structure (e.g. of polyimide) may surround the metal stud and contact both the underside of the MEMS and the surface of the chip. A temporary carrier plate is used to facilitate handling of the MEMS and alignment to the chip.
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公开(公告)号:DE69522721T2
公开(公告)日:2002-07-04
申请号:DE69522721
申请日:1995-09-29
Applicant: IBM
Inventor: BINNIG KARL , GUERET LEOPOLD , ROHRER HEINRICH , VETTIGER PETER
Abstract: PCT No. PCT/IB95/00817 Sec. 371 Date Mar. 10, 1998 Sec. 102(e) Date Mar. 10, 1998 PCT Filed Sep. 29, 1995 PCT Pub. No. WO97/13127 PCT Pub. Date Apr. 10, 1997The present invention concerns mechanical signal processing comprising a mechanical adder as a basic building block. Such a mechanical adder (40), which is a basic element of the present invention, comprises a first micromechanical member (40.1) being sensitive to a first frequency (f1) and a second micromechanical member (40.2) being sensitive to a second frequency (f2). The two micromechanical members (40.1, 40.2) are coupled via a linear coupling (41) to provide a superposition (sum) of the two frequencies (f1 and f2). Based on the adder, AND-gates and OR-gates can be realized by adding further micromechanical members and appropriate linear and non-linear coupling elements.
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公开(公告)号:DE3886751D1
公开(公告)日:1994-02-10
申请号:DE3886751
申请日:1988-09-12
Applicant: IBM
Inventor: BUCHMANN PETER DR , DIETRICH HANS-PETER , VETTIGER PETER
IPC: H01L21/302 , G03F7/00 , H01L21/3065 , H01L21/308 , H01S3/08 , H01S5/00 , H01S5/02 , H01S5/028 , H01S5/10 , H01L21/306 , G03F7/004 , H01L21/00
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公开(公告)号:CA2043173C
公开(公告)日:1993-09-21
申请号:CA2043173
申请日:1991-05-24
Applicant: IBM
Inventor: BROOM RONALD F , GASSER MARCEL , HARDER CHRISTOPH S , LATTA ERNST E , OOSENBRUG ALBERTUS , RICHARD HEINZ , VETTIGER PETER
IPC: B28D5/00 , H01L21/301 , H01S5/00 , H01S5/02 , H01L21/304
Abstract: A method for cleaving semiconductor wafers, or segments thereof, which comprises placing the wafer (11), provided with scribe lines (15) defining the planes where cleaving is to take place, inbetween a pair of flexible transport bands (12, 13) and guiding it around a curved, large radius surface (21) therebyapplying a bending moment. With a moment of sufficient magnitude, individual bars (22) are broken off the wafer as this is advanced, the bars having frontand rear-end facets. On cleaving, each bar, while still pressed against the curved surface, is automatically separated whereby mutual damage of the facets of neighbouring bars is prevented. For further handling, e.g. for the transport of the bars to an evaporation station for passivation layer deposition, provisions are made to keep the bars separated. Cleaving and the subsequent passivation coating can be carried out in-situ in a vacuum system to prevent facet contamination prior to applying the passivation.
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公开(公告)号:CA2017303A1
公开(公告)日:1990-12-16
申请号:CA2017303
申请日:1990-05-22
Applicant: IBM
Inventor: BUCHMANN PETER L , VETTIGER PETER , VOEGELI OTTO , WEBB DAVID J
IPC: H01L21/302 , G02B6/122 , H01L21/3065 , H01L27/15 , H01S5/00 , H01S5/02 , H01S5/028 , H01S5/16 , H01S5/22
Abstract: A method, and devices produced therewith, for improving the flatness of etched mirror facets (18) of integrated optic structures with non-planar stripe waveguides (17) such as ridge or groove diode lasers or passive devices like modulators and switches. The curvature in the mirror facet surface, occurring at the edges of the waveguide due to topographical, lithographical and etch process effects, that causes detrimental phase distortions, is avoided by widening the waveguide end (23) near the mirror surface (18) thereby shifting the curved facet regions away from the light mode region (24) to surface regions (29) where curvature is not critical.
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69.
公开(公告)号:CH637510A5
公开(公告)日:1983-07-29
申请号:CH1111578
申请日:1978-10-27
Applicant: IBM
Inventor: SCHINDLER HANS RUDOLF DR , VETTIGER PETER
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公开(公告)号:CH599731A5
公开(公告)日:1978-05-31
申请号:CH254876
申请日:1976-03-02
Applicant: IBM
Inventor: SCHINDLER HANS-RUDOLF DR , VETTIGER PETER
Abstract: This invention comprises a telephone hybrid circuit having two opto-coupler arrangements for transferring voice signals from the two-wire line to a port of the switching system on one hand and from a port of the switching system to the two-wire line on the other hand. In addition, a pair of feeder circuits in the form of current sources comprising active elements are provided for feeding a constant positive direct current to one wire of the two-wire line and a negative direct current of equal magnitude to the other wire of the two-wire line. Each of the current sources includes control circuitry for maintaining a constant ratio between the current furnished by the current source and a control current common to both current sources. A control current path is connected to the output of one of the opto-coupler arrangements for generating a common control current in response to a dc signal and a superimposed voice signal received from a port of the switching system. The other opto-coupler arrangement couples the signals from the two-wire line to a port of the switching system.
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