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    Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced
    62.
    发明公开
    Process for manufacturing high-sensitivity accelerometric and gyroscopic integrated sensors, and sensor thus produced 失效
    一种用于制造其以这样的方式制造高灵敏度的积分的加速度计和陀螺仪传感器和传感器的方法

    公开(公告)号：EP0895090A1

    公开(公告)日：1999-02-03

    申请号：EP97830407.9

    申请日：1997-07-31

    Applicant: STMicroelectronics S.r.l.

    Inventor： Ferrari, Paolo ,  Vigna, Benedetto ,  Montanini, Pietro ,  Ferrera, Marco

    IPC: G01P15/08 ,  G01P15/125

    CPC classification number: H01L21/764 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00246 ,  B81C2201/0109 ,  B81C2201/0177 ,  B81C2203/0735 ,  B81C2203/0778 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  H01L21/76202

    Abstract: To increase the sensitivity of the sensor, the movable mass (40) forming the seismic mass is formed starting from the epitaxial layer (13) and is covered by a weighting region of tungsten (26c) which has high density. To manufacture it, buried conductive regions (2) are formed in the substrate (1); then, at the same time, a sacrificial region is formed in the zone where the movable mass is to be formed and oxide insulating regions (9a-9d) are formed on the buried conductive regions (2) so as to cover them partially; the epitaxial layer (13) is then grown, using a nucleus region; a tungsten layer (26) is deposited and defined and, using a silicon carbide layer (31) as mask, the suspended structure (40) is defined; finally the sacrificial region is removed, forming an air gap (38).

    Abstract translation: 为了提高传感器的灵敏度，在形成振动质量运动质量块（40）形成由具有高密度的外延层（13）和由钨（26C）的加权区域覆盖开始。 为了制造它，掩埋的导电区域（2）在基片（1）形成; 然后，在在Sametime，牺牲区域在可动质量将要形成与氧化物绝缘区域（图9A-9D）是在掩埋的导电区域形成的区域（2）形成，以覆盖它们的部分; 然后在外延层（13）上生长，使用核区; 钨层（26）沉积和定义，并使用碳化硅层（31）作为掩模，对悬挂结构（40）所定义; 最后牺牲区域被移除，在空气间隙（38）形成。

    Optical-type two-dimensional position sensor, in particular for automotive applications
    63.
    发明公开
    Optical-type two-dimensional position sensor, in particular for automotive applications 失效
    Optischer zweidimensionaler Positionsgeber，insbesonderefürAnwendungen in Kraftfahrzeugen

    公开(公告)号：EP0881470A1

    公开(公告)日：1998-12-02

    申请号：EP97830255.2

    申请日：1997-05-28

    Applicant: STMicroelectronics S.r.l.

    Inventor： Villa, Flavio Francesco ,  Vigna, Benedetto ,  Ferrari, Paolo

    IPC: G01D5/34

    CPC classification number: G01D5/34

    Abstract: The optical two-dimensional position sensor (1) comprises a selective optical unit (9) which faces, and is displaceable relative to an integrated device (2). The selective optical unit (9) is formed by a polarised light source (4,5) and a filter with four quadrants (3) which permits passage of the light onto two quadrants only. The selective optical unit (9) is attached to a control lever (6) such as to translate in a plane along a first direction (X) and a second direction (Y), and to pivot around a third direction (W) which is orthogonal to the preceding directions. In a transparent package, the integrated device (2) comprises a first group of sensor elements (10 1 -10 3 ) which are spaced along the first direction (X), a second group of sensor elements (10 4 -10 7 ) which are spaced along the second direction (Y) and a third group of sensor elements (10 8 -10 9 ) which detect the angular position of the selective optical sensor. Electronics which is integrated with the sensor elements generates a code which is associated with each position which is assumed by the selective optical unit (9) and a control signal (S) which corresponds to the function required.

    Abstract translation: 光学二维位置传感器（1）包括相对于集成器件（2）面向并可移位的选择性光学单元（9）。 选择性光学单元（9）由偏振光源（4,5）和具有四个象限（3）的滤光片形成，其允许仅将光通过两个象限。 选择性光学单元（9）附接到控制杆（6），以沿着第一方向（X）和第二方向（Y）在平面内平移，并且绕第三方向（W）枢转，第三方向 与前述方向正交。 在透明封装中，集成器件（2）包括沿着第一方向（X）间隔的第一组传感器元件（101-103），第二组传感器元件（104-107），沿着 第二方向（Y）和检测选择性光学传感器的角度位置的第三组传感器元件（108-109）。 与传感器元件集成的电子产生与由选择光学单元（9）假设的每个位置相关联的代码和对应于所需功能的控制信号（S）。

    A method of manufacturing pressure microsensors
    64.
    发明公开
    A method of manufacturing pressure microsensors 失效
    Methode zur Herstellung von mikromechanischen Drucksensoren

    公开(公告)号：EP0863392A1

    公开(公告)日：1998-09-09

    申请号：EP97830093.7

    申请日：1997-03-04

    Applicant: STMicroelectronics S.r.l.

    Inventor： Vigna, Benedetto ,  Ferrari, Paolo ,  Montanini, Pietro ,  Ferrera, Marco

    IPC: G01L9/00

    CPC classification number: G01L9/0054 ,  G01L9/0055

    Abstract: The method described provides for the formation of a region of silicon dioxide on a substrate (11) of monocrystalline silicon, the epitaxial growth of a silicon layer, the opening of holes (14') in the silicon layer above the silicon dioxide region, and the removal of the silicon dioxide which constitutes the region by means of chemical attack through the holes (14') until a silicon diaphragm (12'), attached to the substrate (11) along the edges and separated therefrom by a space (15), is produced. In order to form an absolute pressure microsensor, the space has to be sealed. To do this, the method provides for the holes (14') to have diameters smaller than the thickness of the diaphragm (12') and to be closed by the formation of a silicon dioxide layer (16) by vapour-phase deposition at atmospheric pressure.

    Abstract translation: 所述方法提供了在单晶硅的衬底（11）上形成二氧化硅区域，硅层的外延生长，在二氧化硅区域上方的硅层中的孔（14'）的开口，以及 通过所述孔（14'）的化学侵蚀去除构成所述区域的二氧化硅，直到沿着所述边缘附着到所述基板（11）并通过空间（15）分离的硅隔膜（12'）， ，被生产。 为了形成绝对压力微传感器，必须密封空间。 为此，该方法提供孔（14'）具有小于隔膜（12'）的厚度的直径并且通过在大气中气相沉积形成二氧化硅层（16）来封闭 压力。

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