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    COATING COMPOSITION AND PRODUCTION THEREOF
    61.
    发明专利
    COATING COMPOSITION AND PRODUCTION THEREOF 失效

    公开(公告)号：JPH073171A

    公开(公告)日：1995-01-06

    申请号：JP8323594

    申请日：1994-04-21

    Applicant: TORAY INDUSTRIES

    Inventor： KAMI MAKI ,  HENMI MASAHIRO ,  FUKUDA TADANORI

    IPC: C08F2/38 ,  C08F20/18 ,  C08F220/10 ,  C08L101/00 ,  C08L101/10 ,  C09D133/00 ,  C09D133/04 ,  C09D201/02 ,  C09D201/10

    Abstract: PURPOSE:To obtain a coating compsn. improved in stability by polymerizing a radical-polymerizable monomer in the presence of a chain transfer agent having a specific hydrolyzable silyl group. CONSTITUTION:A coating compsn. contg. a stably dispersed acryl-silicone resin having hydrolyzable silyl groups of formula II at molecular ends is obtd. by putting a suitable amt. of water into a reactor, adding dropwise a mixture comprising radical-polymerizable unsatd. monomers, such as methyl methacrylate and n-butyl acrylate, and a chain transfer agent having a hydrolyzable silyl group of formula I (wherein R is an org. group; R is a hydrolyzable group; R is H, alkyl, or aryl; and n is 1-3) (e.g. 3-mercaptopropyltrimethoxysilane) in an amt. of the agent of 50mol% or lower of the total amt. of the monomers to water under stirring, adding dropwise a water soln. of a radical-polymn. initiator, such as ammonium persulfate, when about 10% of the above-mentioned mixture is added, adding the rest of the mixture while keeping the temp. of the reaction system at 80-90 deg.C, continuing stirring for a certain time, and cooling the system.

    ADHESIVE FOR BUILDING MATERIAL
    62.
    发明专利
    ADHESIVE FOR BUILDING MATERIAL 失效

    公开(公告)号：JPH06264044A

    公开(公告)日：1994-09-20

    申请号：JP5706493

    申请日：1993-03-17

    Applicant: TORAY INDUSTRIES

    Inventor： HIRATA NAMI ,  FUKUDA TADANORI ,  MATSUNAGA TADAYOSHI

    IPC: B32B7/12 ,  B32B13/06 ,  C09J163/00

    Abstract: PURPOSE:To provide the subject adhesive which at least contains an epoxy resin, a modified silicone, and an inorg. filler, solidifies and functions as an adhesive by the actions of two curatives, one for the resin and the other for the silicone, and can be used as an elastic adhesive for bonding metal to tile, i.e., for bonding adherends having greatly different thermal expansion coefficients. CONSTITUTION:This adhesive at least contains an epoxy resin and its curative, a modified silicone and its curative, and 60-80wt.% inorg. filler.

    LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND ITS PRODUCTION
    64.
    发明专利
    LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND ITS PRODUCTION 失效

    公开(公告)号：JPH06179736A

    公开(公告)日：1994-06-28

    申请号：JP33161492

    申请日：1992-12-11

    Applicant: TORAY INDUSTRIES

    Inventor： ISHITOBI TERUO ,  SAWAMURA TAIJI ,  FUKUDA TADANORI

    IPC: C08G59/24 ,  C08G59/20 ,  C08G59/62 ,  H01L23/29 ,  H01L23/31

    Abstract: PURPOSE:To obtain a composition for sealing a semiconductor, comprising a specific epoxy resin, a specified curing agent, a specific filler, a specified silane coupling agent and a specific solvent in a specified proportion, capable of preventing solids from settling and excellent in reliability of moist heat and temperature cycle resistance and opeability. CONSTITUTION:The composition comprises (A) an epoxy resin consisting essentially of a biphenyl type epoxy resin of formula I (R and R are H, halogen or 1-4C lower alkyl), (B) a curing agent consisting essentially of a biphenolic compound of formula II (R to R are H or 1-4C lower alkyl), (C) a filler such as spherical fused silica, (D) a silane coupling agent such as gamma- anilinopropyltrimethoxysilane and (E) a solvent such as methyl cellosolve. The component (E) accounts for 5-30wt.% of the whole composition and the residual components account for 70-95wt.% thereof. Furthermore, the ratio of the component (C) is 75-95wt.% based on the residual components and the ratio of the component (D) is 0.3-3.0wt.% based on the residual components.

    RESIN COMPOSITION
    67.
    发明专利
    RESIN COMPOSITION 失效

    公开(公告)号：JPH0376749A

    公开(公告)日：1991-04-02

    申请号：JP21215389

    申请日：1989-08-17

    Applicant: TORAY INDUSTRIES

    Inventor： ADACHI MASAYA ,  OHASHI MASAYASU ,  FUKUDA TADANORI

    IPC: C08L25/04 ,  C08L67/00 ,  C08L67/02

    Abstract: PURPOSE:To prepare a resin compsn. excellent in the transparency, heat resistance, and mechanical properties by compounding a specific arom. polyester and a vinyl arom. polymer as the main components. CONSTITUTION:An arom. polyester of the formula (wherein n is the degree of polymn.) and a vinyl arom. polymer (e.g. styrene resin) are compounded as the main components.

    SULFUR-CONTAINING POLYESTER RESIN
    69.
    发明专利
    SULFUR-CONTAINING POLYESTER RESIN 失效

    公开(公告)号：JPH0343415A

    公开(公告)日：1991-02-25

    申请号：JP17993289

    申请日：1989-07-12

    Applicant: TORAY INDUSTRIES

    Inventor： OHASHI MASAYASU ,  FUKUDA TADANORI

    IPC: C08G63/688 ,  C08G75/00 ,  C08G75/26

    Abstract: PURPOSE:To obtain a sulfur-containing polyester resin having excellent heat resistance, moldability, mechanical strength and light resistance and high refractive index comprising respectively specific reaction-construction units of a dicarboxylic acid component and a dithiol component, and reaction-constructing unit of a dicarboxylic acid component and a diol component. CONSTITUTION:Dicarboxylic acid component containing a compound expressed by formula I (R1 and R2 are halogen or 1-4C alkoxy, etc.) as principal ingredient is polymerized with a dithiol component containing a compound expressed by formula II (R3 and R4 are H or acetyl, etc.; Y is 2-12C aliphatic organic group, etc.) as principal ingredient and a diol component containing a compound expressed by formula III (R5 and R6 are H or acetyl; X is O or S; X1 and X2 are halogen or 1-4C hydrocarbon group; (m) and (n) are 0-4) as principal ingredient in a fraction of the component II so as to be 20-80mol% of total of the dithiol component and the diol component to afford the objective sulfur- containing polyester resin comprising reaction-construction unit of carboxylic acid component and dithiol component and reaction-construction unit of carboxylic acid component and diol component.

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