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    METHOD AND APPARATUS FOR FORMING GROOVES IN THE SURFACE OF A POLYMER LAYER
    67.
    发明申请
    METHOD AND APPARATUS FOR FORMING GROOVES IN THE SURFACE OF A POLYMER LAYER 审中-公开
    在聚合物层表面形成沟槽的方法和装置

    公开(公告)号：WO2010076547A1

    公开(公告)日：2010-07-08

    申请号：PCT/GB2009/001232

    申请日：2009-05-14

    Applicant: M-SOIV LIMITED ,  RUMSBY1 Philip Thomas

    Inventor： RUMSBY1 Philip Thomas

    IPC: B23K26/06 ,  B23K26/073 ,  B23K26/40 ,  B23K26/08 ,  H05K3/08

    CPC classification number: H05K3/0032 ,  B23K26/06 ,  B23K26/073 ,  B23K26/0732 ,  B23K26/082 ,  B23K2203/42 ,  B23K2203/50 ,  H05K1/0373 ,  H05K3/107 ,  H05K2201/0112 ,  H05K2201/09036

    Abstract: A method for the formation of grooves (74, 85) in the surface of a polymer layer substrate (36, 46, 51, 65, 73, 83) by a direct write laser vaporization process, the polymer being selected, or modified by the addition of organic or inorganic material, so that it strongly absorbs wavelengths in the range 525nm to 535nm, the method comprising the steps: providing a laser beam (32, 42) with a wavelength in the range 525nm to 535nm that has diffraction limited or substantially diffraction limited beam quality and operates either continuously, quasi-continuously or Q- switched, using an optical system (35,45, 64, 72, 82) to focus the laser beam to a focal spot on the surface of the substrate, using a scanner (44, 63) to move the focal spot relative to an area on the substrate so the substrate surface is vaporized where it is exposed to the beam so as to form a groove with a depth that is less than the thickness of the polymer layer, controlling the scanner so as to change the position of the focal spot on the substrate whereby grooves having straight and curved portions along their length are written on the surface of the substrate, and regulating the power of the laser beam reaching the surface of the substrate so that the writing process is started and stopped whereby grooves of desired lengths are formed.

    Abstract translation: 通过直接写入激光蒸发法在聚合物层基板（36,46,51,65,73,83）的表面中形成凹槽（74,85）的方法，所述聚合物被选择或由 添加有机或无机材料，使得其强烈吸收525nm至535nm范围内的波长，该方法包括以下步骤：提供波长为525nm至535nm的波长的激光束（32,42），其具有衍射限制或基本上 衍射限制光束质量，并使用光学系统（35,45,64,72,82）连续，准连续或Q切换操作，以将激光束聚焦到衬底表面上的焦点，使用 扫描器（44,63）相对于衬底上的区域移动焦点，使得衬底表面在其暴露于光束的同时蒸发，以形成深度小于聚合物层厚度的凹槽 ，控制扫描仪以改变位置 在基板上具有焦点，由此沿着其长度的直线和弯曲部分的凹槽被写在基板的表面上，并且调节到达基板表面的激光束的功率，使得写入过程开始和停止，由此凹槽 形成期望的长度。

    A METHOD FOR FABRICATING BLACKENED CONDUCTIVE PATTERNS
    68.
    发明申请
    A METHOD FOR FABRICATING BLACKENED CONDUCTIVE PATTERNS 审中-公开
    一种用于制作盲目导电图案的方法

    公开(公告)号：WO2009075520A1

    公开(公告)日：2009-06-18

    申请号：PCT/KR2008/007307

    申请日：2008-12-10

    Applicant: INKTEC CO., LTD. ,  CHUNG, Kwang Choon ,  YOO, Ji Hoon ,  KIM, Byung Hun ,  KIM, Su Han

    Inventor： CHUNG, Kwang Choon ,  YOO, Ji Hoon ,  KIM, Byung Hun ,  KIM, Su Han

    IPC: H05K3/02

    CPC classification number: H05K3/1258 ,  C23C18/165 ,  C23C18/1868 ,  C23C18/204 ,  H05K1/092 ,  H05K1/097 ,  H05K3/0026 ,  H05K3/107 ,  H05K3/245 ,  H05K2201/0112 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/0568 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1126

    Abstract: The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non- conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non -conductive substrate. The method for blackening conductive patterns according to the present invention has, unlike a conventional method using chemical etching, advantages that productivity is enhanced as the process steps is simplified, environmental problem such as disposal of an etching solution is not generated as chemical etching is not used, and high resolution patterns with and superior conductivity and blackened degree can be fabricated.

    Abstract translation: 本发明涉及一种制造黑化导电图案的方法，其包括（i）在非导电基底上形成抗蚀剂层; （ii）使用激光束在抗蚀剂层中形成精细图案凹槽; （iii）在精细图案槽中形成含有导电材料和变黑材料的混合层; 和（iv）除去残留在非导电基底上的抗蚀剂层。 根据本发明的黑化导电图案的方法与使用化学蚀刻的常规方法不同，随着工艺步骤的简化，提高生产率的优点，因为化学蚀刻不会产生诸如处理蚀刻溶液的环境问题 使用，并且可以制造具有优异的导电性和变黑度的高分辨率图案。

    METHOD FOR REFLOW SOLDERING
    70.
    发明申请
    METHOD FOR REFLOW SOLDERING 审中-公开
    方法回流焊

    公开(公告)号：WO2005101932B1

    公开(公告)日：2006-01-19

    申请号：PCT/EP2005003611

    申请日：2005-04-06

    Applicant: SEHO SYSTEMTECHNIK GMBH ,  LETTNER HORST ,  DIEHM ROLF

    Inventor： LETTNER HORST ,  DIEHM ROLF

    IPC: B23K1/005 ,  H05K3/34

    CPC classification number: H05K3/3494 ,  B23K1/0056 ,  B23K2201/42 ,  H05K3/3484 ,  H05K2201/0112 ,  H05K2203/111

    Abstract: The invention relates to a method and device for reflow soldering strip conductors to components and to modules (4), which are attached to a printed circuit board (1) by means of a soldering paste. According to the invention, an absorption material is heated by radiating an electromagnetic wave during which the material absorbs this radiation, and this heating is transferred to the soldering paste for melting a solder contained in the soldering paste. The soldering paste is mixed with the absorption material to form a mixed material (3), and the mixed material is applied to the soldering points of the strip conductors (2).

    Abstract translation: 本发明涉及一种用于与组件和模块导体轨迹的回流焊接的方法和装置（4），其上通过焊料膏的装置施加的印刷电路板（1），其中通过电磁波的辐射和该加热的放射线接收吸收材料 加热被转印到焊膏熔化包含在焊料膏的焊料。 焊膏与吸收材料混合以形成混合材料（3）和混合材料被施加到导体轨道（2）的焊点。

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