公开(公告)号：EP1363811B1

公开(公告)日：2004-12-22

申请号：EP02732446.6

申请日：2002-02-22

Applicant: Leoni AG

Inventor： ZAHRADNIK, Franz ,  HARTMANN, Uli ,  GÖTZ, Knuth ,  REICHINGER, Gerhard

IPC: B60R16/02 ,  H05K3/10

CPC classification number: H05K3/1266 ,  B60R16/0207 ,  H05K1/0284 ,  H05K1/118 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/102 ,  H05K3/14 ,  H05K3/3468 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/467 ,  H05K2201/09109 ,  H05K2203/0517 ,  H05K2203/107 ,  H05K2203/1344 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: The invention relates to a method for producing a moulded component (2A-2G) comprising an integrated conductor strip (10), wherein a conductor strip (10) is produced on a carrier component (4) particularly by flame injection or cold gas injection. The surface of the carrier component (4) is treated in a selective manner corresponding to a predetermined path of the conductor strip (10) so that the surface areas thereof have different adhesions. A germ layer is applied to the path of the conductor strip (10), whereupon the conductor strip (10) is subsequently placed thereon. It is therefore possible to produce a moulded component (2A-2G) comprising an integrated conductive strip mould in a very flexible and economical manner. In automobile industries, special requests from the clients can be met in a fast and efficient manner by altering the layout of the conductor strip.

公开(公告)号：EP1080977A3

公开(公告)日：2004-03-24

申请号：EP00115615.7

申请日：2000-07-20

Applicant: Siemens Aktiengesellschaft

Inventor： Kronenberg, Hartmut ,  Simon, Ernst-Ulrich

IPC: B60K37/02

CPC classification number: H05K1/028 ,  B60K37/02 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/4691 ,  H05K2201/09109

Abstract: Ein Kombiinstrument hat einen Grundkörper (9), welcher in Anzeigefelder aufgeteilt ist, die mit unterschiedlichen Winkeln zueinander ausgerichtet sind. Auf der Vorderseite des Grundkörpers (9) ist eine sich über mehrere Anzeigefelder erstreckende zusätzliche Leiterplatte (1) angeordnet. Diese besteht aus starren Leiterplattenteilen (2, 3, 4), welche im Übergangsbereich der Anzeigefelder flexible Verbindungsbereiche (5, 6) mit Leiterbahnen aufweisen.

Abstract translation: 组合仪器具有基体（9），分为与基体不同的角度排列的显示区域和基体背面的刚性主电路板。 基体前部的附加电路板在多个显示区域上延伸，并由具有柔性连接区域（5,6）的刚性电路板部件（1-4）组成，其中在显示器场转换区域中具有导电轨迹。

公开(公告)号：EP1238444A1

公开(公告)日：2002-09-11

申请号：EP00988675.5

申请日：2000-12-01

Applicant: ROBERT BOSCH GMBH

Inventor： JAKOB, Gert ,  GENTNER, Herbert ,  SELIG, Rainer ,  LIEGL, Erwin ,  RYSY, Stefan ,  ENZNER, Juergen ,  LUNZ, Udo ,  MAIER, Hermann ,  HAUG, Ralf

IPC: H01R12/12

CPC classification number: H01R12/62 ,  H05K1/118 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09109 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1572

Abstract: The invention relates to an undetachable electrical and mechanical connection (4) between a contact element (7) having contacts (31) and a counter-contact element (8) having counter-contacts (27) with a flexible section (39) of the contact element (7) in at least a part of the contacts (31). The invention is further characterized in that the contact element (7) has at least one first and second layer (21, 22) that define an intermediate space (23) between them in the zone of the flexible section (39) in which intermediate space the counter-contact element (8) is disposed. The first and the second layer (21, 22) is provided with one contact (31) each on the layer inner sides (40) facing one another. The counter-contact element (8) has at least one counter-contact (27) on each of its upper and lower side (25, 26).

公开(公告)号：EP1063872A2

公开(公告)日：2000-12-27

申请号：EP00305088.7

申请日：2000-06-15

Applicant: ROVER GROUP LIMITED

Inventor： Greenwood, Jeremy John ,  Talbot, Kevin Trevor

IPC: H05K1/18 ,  H01M2/10

CPC classification number: H05K1/0271 ,  H01M2/1044 ,  H05K1/183 ,  H05K3/3421 ,  H05K2201/09109

Abstract: An electrical circuit is disclosed which is suitable for use in a portable electrical appliance 10, such as might be used as a remote transponder for a vehicle security system. The circuit includes a coin-cell battery 16 which is connected to a printed circuit board (PCB) 12 by soldered weld-tags 18, 20. A support layer 24 is laminated to one face of the PCB 12 and has a recess 26 defined in it. The battery 16 sits in the recess 26, which provides lateral support to the battery 16 so that the likelihood of displacement of the battery 16 substantially along the plane of the support layer 24 in the event of shock is reduced.

公开(公告)号：EP0990201A1

公开(公告)日：2000-04-05

申请号：EP98932790.3

申请日：1998-06-19

Applicant: ViA, Inc.

Inventor： CARROLL, David, W. ,  TRAVIS, Terry, L.

IPC: G06F1/00 ,  H05K1/14 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K2201/0133 ,  H05K2201/09109 ,  H05K2201/10204 ,  H05K2201/10598 ,  H05K2201/2027

Abstract: An assembly (5) and method for extending the durability and life span of flexible circuitry by limiting the bend radius of the flexible circuitry and distributing the flexure point about an extended portion of the circuitry. An assembly (5) comprises one or more flex limiting members (10, 20, 30, 40) associated with and integrated between the layers of flexible circuitry laminate. A fastener (60) is affixed to the flexible circuitry laminate, operatively coupling the one or more flex-limiting members (10, 20, 30, 40) in position adjacent the flexible circuitry laminate. The flex-limiting member (10, 20, 30, 40) limits flexure of the circuitry, during each individual bend, to or below a predetermined angle, thereby decreasing the rate of failure in the circuitry, for example via short circuit, as a result of repeated or excessive bending.

公开(公告)号：EP0615679A4

公开(公告)日：1995-01-04

申请号：EP92915709

申请日：1992-03-24

Applicant: MOTOROLA INC

Inventor： MENY KEITH A ,  MCGOVERN PATRICK A ,  COTTINGHAM DAVID ,  KAZAK FRANK E

IPC: H01R13/46 ,  B60R16/02 ,  B60R16/023 ,  H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00 ,  H05K5/00 ,  H05K7/14 ,  H05K7/20

CPC classification number: B60R16/0239 ,  H05K1/028 ,  H05K1/05 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A method of forming an electronic module assembly is disclosed, plus two such assemblies formed thereby. One module assembly (50) has a bendable base plate (52) upon which circuit components (76) are mounted. A module enclosure device (56) mates with the base plate and has an integrally formed, non-removable support arm (96). During assembly, the base plate (52) is bent around the support arm (96) in a 'C' shape. Thus formed, the base plate (52) and the module enclosure device (56) form an internal cavity that holds the circuit components (76).

公开(公告)号：EP0615679A1

公开(公告)日：1994-09-21

申请号：EP92915709.0

申请日：1992-03-24

Applicant: MOTOROLA, INC.

Inventor： MENY, Keith, A. ,  McGOVERN, Patrick, A. ,  COTTINGHAM, David ,  KAZAK, Frank, E.

IPC: H01R13 ,  B60R16 ,  H05K1 ,  H05K5 ,  H05K7 ,  H05K3

CPC classification number: B60R16/0239 ,  H05K1/028 ,  H05K1/05 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: L'invention concerne un procédé de production d'un ensemble pour modules électroniques et deux de ces ensembles produits. Un ensemble de modules (50) comporte une plaque de base (52) pouvant se plier sur laquelle sont montés les composants (76) du circuit. Un dispositif de protection (56) des modules est accouplé à la plaque de base et possède un bras support (96) intégré, non-amovible. Lors de l'assemblage, la plaque de base (52) se plie autour du bras support (96) en forme de "C". Ainsi configurés, la plaque de base (52) et le dispositif de protection (56) des modules forment une cavité interne qui renferme les composants (76) du circuit.

公开(公告)号：EP0226276A3

公开(公告)日：1987-08-26

申请号：EP86307296

申请日：1986-09-23

Applicant: MOLEX INCORPORATED

Inventor： Stipanuk, John M. ,  Yun, John M.

IPC: H01R09/07 ,  H01R23/70 ,  H01R23/72 ,  H01R23/66

CPC classification number: H01R12/62 ,  H01R4/04 ,  H01R12/523 ,  H05K1/118 ,  H05K1/141 ,  H05K1/16 ,  H05K3/0058 ,  H05K3/361 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: The assembly comprises one or more flat flexible cables (52, 54) connected to a standard and widely used printed circuit board edge connector (22). The connection includes a substantially rigid flexible circuit structure having a carrier (50) of flat planar configuration with opposed surfaces (58, 60) (see Figure 4). A flexible circuit such as (52) is adhesively bonded to at least one surface (58, 60) with conductive traces (82) of the circuit exposed (as seen in Figure 2). Electrical connections are made to the traces (82) by inserting the carrier (50) with attached flexible circuits (52, 54) into connector (22) having a housing (24) supporting a plurality of terminals (26) with contact portions in a linear array engageable with the exposed conductive traces (82) of the flexible circuit(s).

公开(公告)号：EP0044247B1

公开(公告)日：1985-10-30

申请号：EP81401089.8

申请日：1981-07-07

Applicant: SOCAPEX

Inventor： Mariotte, Jean-Marie ,  Hamaide, Pierre

IPC: H05K3/40

CPC classification number: H05K3/3442 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/0058 ,  H05K3/386 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09109 ,  H05K2201/10727 ,  H05K2201/2045 ,  Y02P70/613

公开(公告)号：TW200725844A

公开(公告)日：2007-07-01

申请号：TW094145832

申请日：2005-12-22

Applicant: 巨擘科技股份有限公司 PRINCO CORP.

Inventor： 楊之光 YANG, CHIH KUANG

IPC: H01L

CPC classification number: H05K3/0058 ,  H01L21/4857 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81001 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K3/0067 ,  H05K2201/09109 ,  H05K2203/178 ,  Y02P70/613

Abstract: 本發明提供一種包含多層內連線結構之載板,其包含一載板以及位在該載板上的一多層內連線結構,其中該多層內連線結構與該載板間僅在部分區域實質附著;本發明也提供上述包含多層內連線結構之載板之製造方法、回收方法以及使用其之封裝方法與多層內連線裝置之製造方法。

Abstract in simplified Chinese: 本发明提供一种包含多层内连接结构之载板,其包含一载板以及位在该载板上的一多层内连接结构,其中该多层内连接结构与该载板间仅在部分区域实质附着;本发明也提供上述包含多层内连接结构之载板之制造方法、回收方法以及使用其之封装方法与多层内连接设备之制造方法。