公开(公告)号：WO2006101145A1

公开(公告)日：2006-09-28

申请号：PCT/JP2006/305745

申请日：2006-03-22

Applicant: 日本電気株式会社 ,  成田 薫 ,  クシュタ タラス

Inventor： 成田 薫 ,  クシュタ タラス

IPC: G01R27/26

CPC classification number: H05K1/0268 ,  G01R27/2617 ,  G01R31/2805 ,  H05K1/16 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/10068

Abstract: 　導体層が夫々誘電体層を間に挟むようにして相互に平行に配置されたプリント基板における導体層に設けられた開口部の周囲に、導電体層に接続する複数のスルーホールビアを相互に間隔をおいて配置する。また、導体層の開口部並びにこれらの開口部に整合する誘電体層の領域に、導体層に非接触で励振用のスルーホールビアを配置する。そして、複素誘電率を測定する際は、スルーホールビアに高周波電力を印加し、Ｓパラメータ法によりスルーホールビアと導電体層との間の電力損失を測定する。これにより、数ＧＨｚ乃至２０ＧＨｚの周波数範囲において、複素誘電率及びその周波数依存性を精度よく測定することができ、基板に搭載しても他の部品との電気的な干渉がない。

Abstract translation: 印刷电路板包括彼此平行布置以便夹着电介质层的导电层。 连接到导电层的多个通孔连接在布置在导电层中的开口周围以一定间隔布置。 此外，在导电层的开口区域和与开口对准的电介质层的区域中，用于激发的通孔布置成与导电层非接触。 当测量复合介电常数时，将高频功率施加到通孔，并测量通孔和导电层之间的功率损耗间隔S参数法。 因此，可以精确地测量复数介电常数及其对几GHz至20GHz的频率范围内的频率的依赖性。 即使这样的谐振器安装在基板上，也不会产生与其它部件的电气干扰。

公开(公告)号：WO1996013965A1

公开(公告)日：1996-05-09

申请号：PCT/US1995010769

申请日：1995-08-25

Applicant: BAIER & BAIER, INC. doing business as LARK ENGINEERING

Inventor： BAIER & BAIER, INC. doing business as LARK ENGINEERING ,  BREE, Daniel, R. ,  LEM, Rafael

IPC: H05K01/00

CPC classification number: H05K1/0243 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613

Abstract: The method of surface mounting radio frequency components includes using at least one radio frequency component (300, 810, 850) having a pair of input/output contact points (330, 332, 830, 832, 870, 872) or areas at corners on the underside of the component, wherein each of the input/output contact points or areas abuts the adjoining edges of the corners. The component is positioned relative to a pair of traces (846, 856, 858, 860) on a circuit for enabling an electrical connection thereto in a range of angular dispositions. By using a single non-customized component, adjacent components can be configured with a signal flow path of a range between about 0 degree (a chain configuration) and about 180 degrees (a "U" turn).

Abstract translation: 表面安装射频分量的方法包括使用至少一个具有一对输入/输出接触点（330,332,830,832,870,872）的射频分量（300,810,850）或在 组件的下侧，其中每个输入/输出接触点或区域邻接角部的相邻边缘。 组件相对于电路上的一对迹线（846,856,858,860）定位，以使得能够在一定角度配置范围内与其电连接。 通过使用单个非定制组件，可以使用约0度（链式配置）和约180度（“U”转）之间的范围的信号流路径配置相邻组件。

公开(公告)号：KR1020100051862A

公开(公告)日：2010-05-18

申请号：KR1020107006199

申请日：2008-08-22

Applicant: 시티에스 코포레이션

Inventor： 맥락켄제프리

IPC: H03B5/04 ,  H03L1/02 ,  H03L1/04

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：KR1020040036926A

公开(公告)日：2004-05-03

申请号：KR1020047003103

申请日：2002-09-12

Applicant: 엔이씨 쇼트 컴포넌츠 가부시키가이샤

Inventor： 후쿠시마다이스케

IPC: H01L23/04

CPC classification number: H03H9/1021 ,  H01L23/04 ,  H01L23/045 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00

Abstract: 표면 실장형 패키지는 스루홀을 갖는 하부면을 구비하는 금속 베이스(1), 스루홀에 삽입되도록 배치된 금속 리드(2), 금속 베이스(1)에 의해 정의되는 내부 스페이스에 채워지는 절연재(3), 뚜껑으로서 금속 베이스(1)를 피복하는 캡(30), 및 금속 리드(2)의 내부 스페이스측 상의 표면(2i)에 배치된 전자 부품 소자를 포함한다. 내부 스페이스는 기밀 분위기에서 지지된다. 금속 베이스(1)는 금속 리드(2) 또는 절연재(3)의 하부면과 동일한 평면상에 위치하는 하부면을 가지며, 동일한 평면(P)은 장착 보드에 부착되는 평면을 형성한다.

Abstract translation: 一种表面安装封装，包括：具有通孔的下表面的金属底座;布置成插入到通孔中的金属引线;填充在由金属底座限定的内部空间中的绝缘材料;盖住金属底座的盖， 盖子和布置在金属引线的内部空间侧的表面上的电子部件组件。 内部空间保持在气密的环境中。 金属基底具有位于与金属引线或绝缘材料的下表面相同的平面上的下表面，该下表面形成待附接到安装板的平面。

公开(公告)号：US11973486B2

公开(公告)日：2024-04-30

申请号：US17442702

申请日：2020-03-09

Applicant: KYOCERA Corporation

Inventor： Sinichiro Kitanishi ,  Akira Oikawa

IPC: H05K1/18 ,  H01L23/08 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H05K3/28 ,  H05K3/34

CPC classification number: H03H9/059 ,  H01L23/08 ,  H03H3/08 ,  H03H9/1064 ,  H03H9/25 ,  H05K1/185 ,  H05K3/284 ,  H05K3/341 ,  H05K2201/10068

Abstract: An electronic component includes an insulating surrounding member surrounding the electronic element while allowing a first surface of the electronic element to be exposed from a second surface of the surrounding member. A wiring board faces a third surface comprising the first and second surfaces. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump, located between the third surface and the wiring board, electrically connects the electronic element and the wiring board. The joining member has a first through hole that overlaps a vibration region in the first surface in perspective plan view. The joining member has a second through hole that accommodates the bump. At least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.

公开(公告)号：US20190246500A1

公开(公告)日：2019-08-08

申请号：US16389598

申请日：2019-04-19

Applicant: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.

Inventor： Atsushi Takano ,  Mitsuhiro Furukawa ,  Ichiro Kameyama ,  Tetsuya Uebayashi

IPC: H05K1/18 ,  H01L23/31 ,  H03H9/05 ,  H03H9/25 ,  H05K1/11 ,  H03H9/10 ,  H03H9/17 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/17 ,  H03H9/25 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/10068 ,  H01L2924/00012

Abstract: A method of manufacturing an electronic device includes preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed. The first resin layer has a first surface facing the main surface of the first substrate, a second surface opposed to the first surface, a cavity on the first surface enclosing the functional unit, and a portion defining a wall of the cavity. The first resin layer defines a recess provided with a solder layer on the second surface. The method further includes preparing a second substrate having an electrode pad formed on a main surface, aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer, and forming the electronic component and the second substrate into the electronic device.

公开(公告)号：US20180062611A1

公开(公告)日：2018-03-01

申请号：US15681153

申请日：2017-08-18

Applicant: WISOL CO., LTD.

Inventor： Jong Soo HA ,  Eun Tae PARK ,  Bong Soo KIM ,  Jung Hoon HAN ,  Chang Dug KIM

IPC: H03H9/02 ,  H05K1/18 ,  H03H3/02 ,  H05K3/32

CPC classification number: H03H9/02992 ,  H03H3/02 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/181 ,  H05K3/28 ,  H05K3/32 ,  H05K2201/032 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10568 ,  H05K2201/10674 ,  H05K2201/2036

Abstract: Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.

公开(公告)号：US09838766B2

公开(公告)日：2017-12-05

申请号：US15004669

申请日：2016-01-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Il Nam Kim ,  Won Sang Park ,  Yi Joon Ahn ,  Byeong-Hee Won

IPC: H04R1/00 ,  H04R1/02 ,  G02B5/30 ,  H05K1/14

CPC classification number: H04R1/028 ,  G02B5/3033 ,  H04R1/025 ,  H04R2201/029 ,  H04R2499/15 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.

公开(公告)号：US20170290160A1

公开(公告)日：2017-10-05

申请号：US15472453

申请日：2017-03-29

Applicant: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.

Inventor： Atsushi Takano ,  Mitsuhiro Furukawa ,  Ichiro Kameyama ,  Tetsuya Uebayashi

IPC: H05K1/18 ,  H03H9/25 ,  H03H9/17 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/17 ,  H03H9/25 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/10068 ,  H01L2924/00012

Abstract: An electronic component may include a substrate having a functional unit formed on a main surface of the substrate and a first resin layer formed on the main surface, the first resin layer having a first surface facing the main surface and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, and a solder layer being formed in the recess so as not to exceed the second surface in a thickness direction. The functional unit may include a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. The substrate may be formed of dielectric material.

公开(公告)号：US09769934B2

公开(公告)日：2017-09-19

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro Miyao ,  Hideki Ishigami ,  Yukihiko Shiohara ,  Tetsuya Otsuki ,  Hidefumi Nakamura

IPC: B32B3/10 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.