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公开(公告)号:JP2009182022A
公开(公告)日:2009-08-13
申请号:JP2008017650
申请日:2008-01-29
Applicant: Renesas Technology Corp , 株式会社ルネサステクノロジ
Inventor: SHIMIZU KAZUO , KONO KENYA , ASHIDA YOSHIAKI , MACHIDA YUICHI
CPC classification number: H05K7/04 , H01L23/49537 , H01L23/49541 , H01L23/49548 , H01L23/49575 , H01L23/49589 , H01L24/28 , H01L24/29 , H01L24/36 , H01L24/39 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/05554 , H01L2224/0603 , H01L2224/40245 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/73221 , H01L2224/83801 , H01L2224/83855 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/351 , H05K3/202 , H05K3/321 , H05K3/3442 , H05K2201/0397 , H05K2201/09663 , H05K2201/0969 , H05K2201/09745 , H05K2201/1003 , H05K2201/10484 , H05K2201/10636 , H05K2201/10924 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: PROBLEM TO BE SOLVED: To increase reliability of a semiconductor device by improving connection reliability of a passive component. SOLUTION: A first through-hole 6c is formed in the first electrode part 6b of a first plate-like lead 6, and a second through-hole 7c is formed in the second electrode part 7b of a second plate-like lead 7. As a result, at the first electrode part 6b of the first plate-like lead 6, one external terminal 5b of the passive component 5 can be connected to the first electrode parts 6b on both sides of the first through-hole 6c while striding over the first through-hole 6c. Also, at the second electrode part 7b of the second plate-like lead 7, the other external terminal 5b of the passive component 5 can be connected to the second electrode parts 7b on both sides of the second through-hole 7c while striding over the second through-hole 7c. Accordingly, at a central portions both in the longitudinal and width directions of the passive component 5, the passive component 5 is surrounded by sealing members 12. As a result, thermal stress applied to bonding materials 13 such as solder can be reduced, and the reliability of the semiconductor device (semiconductor package 1) is improved. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题:通过提高无源部件的连接可靠性来提高半导体器件的可靠性。 解决方案:第一通孔6c形成在第一板状引线6的第一电极部分6b中,第二通孔7c形成在第二板状引线的第二电极部分7b中 结果,在第一板状引线6的第一电极部分6b处,无源部件5的一个外部端子5b可以连接到第一通孔6c两侧的第一电极部分6b,而 跨过第一通孔6c。 此外,在第二板状引线7的第二电极部分7b处,无源部件5的另一个外部端子5b可以连接到第二通孔7c的两侧的第二电极部分7b,同时跨过第二通孔 第二通孔7c。 因此,在无源部件5的纵向和宽度方向上的中心部分,无源部件5被密封部件12包围。结果,可以减少施加到诸如焊料的接合材料13的热应力,并且 改善了半导体器件(半导体封装1)的可靠性。 版权所有(C)2009,JPO&INPIT
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公开(公告)号:JP2004047256A
公开(公告)日:2004-02-12
申请号:JP2002202575
申请日:2002-07-11
Applicant: Honda Motor Co Ltd , 本田技研工業株式会社
Inventor: TODAKA SHINICHI , YOSHIOKA ISAMU
IPC: F21S8/10 , B60Q1/26 , B60R1/12 , F21W101/12 , F21Y101/02 , H05K3/30
CPC classification number: B60Q1/2665 , B60R1/1207 , H05K3/301 , H05K2201/10106 , H05K2201/10409 , H05K2201/10484
Abstract: PROBLEM TO BE SOLVED: To provide a lighting device wherein a light axis of an LED is directed in a required direction without molding a substrate in a complicated shape.
SOLUTION: With the lighting device equipped with an LED 1, and a substrate 2 which the LED 1 is mounted on, the LED 1 is mounted on the substrate 2 through a conductive pedestal 3.
COPYRIGHT: (C)2004,JPO-
公开(公告)号:KR1020160138024A
公开(公告)日:2016-12-02
申请号:KR1020167025825
申请日:2015-02-27
Applicant: 소니 세미컨덕터 솔루션즈 가부시키가이샤
Inventor: 와타나베토시히코
CPC classification number: H05K1/116 , H01L21/486 , H01L23/49827 , H01L33/48 , H01L2224/16227 , H01L2224/16238 , H01L2924/1531 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H05K1/0306 , H05K1/112 , H05K1/115 , H05K3/0094 , H05K3/3436 , H05K3/3447 , H05K3/3489 , H05K3/4007 , H05K3/42 , H05K2201/09154 , H05K2201/0959 , H05K2201/09863 , H05K2201/10106 , H05K2201/10484 , H05K2203/1383 , H05K2203/1394 , Y02P70/613
Abstract: 실장용기판은, 기판(10)에형성된관통구멍(13), 제1의랜드부(21), 제2의랜드부(31), 제1의부품부착부(22), 제2의부품부착부(32), 도통층(14), 및, 관통구멍(13)의일부분에충전된충전부재(15)를구비하고있고, 제1의랜드부(21)측의충전부재(15)의정상면의상방에위치하는관통구멍(15)의부분의체적(V), 제1의부품부착부(22)에실장하여야할 부품(51)의길이(L), 제1의부품부착부(22)에실장하여야할 부품(51)의기판(10)의제1면(11)에대한경사의최대허용치에의거하여제1의랜드부(21)의중심부터부품(51)까지의최단거리허용치(L)가결정된다.
Abstract translation: 安装基板包括形成在基板10中的通孔13,第一接地部21,第二接地部31,第一部件安装部22,第二部件安装部32,导电层14和填充部件 15被填充到通孔13的一部分中。从第一陆部21的中心到部件51的最短距离允许值L0基于定位的通孔15的一部分的体积Vh来确定 在第一接地部21侧的填充部件15的上表面上,要安装到第一部件安装部22的部件51的长度L1和部件51的倾斜度的最大允许值为 相对于基板10的第一表面11安装到第一部件安装部22。
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公开(公告)号:KR1020100105401A
公开(公告)日:2010-09-29
申请号:KR1020100021782
申请日:2010-03-11
Applicant: 후지쯔 가부시끼가이샤
Inventor: 기타가와다카히로
IPC: H05K3/34
CPC classification number: H05K3/341 , H05K3/3442 , H05K3/3463 , H05K3/3478 , H05K3/3484 , H05K2201/10469 , H05K2201/10484 , H05K2201/10969 , H05K2203/0415 , H05K2203/1178 , Y02P70/613
Abstract: PURPOSE: An electronic element and a method of soldering the same are provided to discharge a fused soldering chip outside the electronic element by extending the size of a substrate electrode facing the soldering chip. CONSTITUTION: Soldering(56a-56c) are provided on substrate electrodes(36a-36c) of a print board(30). One side of an electronic component(10) is installed on a substrate electrode and is supported by a soldering chip. Both side of the electronic component are supported by the printed circuit board. The electronic component is loaded in the printed circuit board. The soldering and the soldering chip are heated.
Abstract translation: 目的:提供一种电子元件及其焊接方法,通过延伸面向焊接芯片的基板电极的尺寸,将熔融焊接芯片排出电子元件外部。 构成:在印刷板(30)的基板电极(36a-36c)上设置焊接(56a-56c)。 电子部件(10)的一侧安装在基板电极上并由焊接芯片支撑。 电子部件的两侧由印刷电路板支撑。 电子部件装载在印刷电路板中。 焊接和焊接芯片被加热。
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公开(公告)号:KR1020080059319A
公开(公告)日:2008-06-26
申请号:KR1020087012183
申请日:2006-10-13
Applicant: 코닌클리케 필립스 엔.브이.
Inventor: 도너스,모리스,아.,하.
IPC: H05K3/30
CPC classification number: H05K3/301 , H05K3/3442 , H05K2201/10106 , H05K2201/10325 , H05K2201/10484 , H05K2201/10636 , H05K2201/10651 , Y02P70/611 , Y10T29/4913
Abstract: A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.
Abstract translation: 适于安装在基板(11)上并用作表面安装装置(15)的支撑件的支撑部件(1)包括具有适于安装在基板上的第一表面(3)的主体(2) (11),以及适于支撑所述表面安装装置(15)的第二表面(4)。 第二表面(4)相对于第一表面(3)倾斜。 支撑部件(1)还包括适于在基板(11)的第一基板导体(12)和表面安装装置(15)的第一电极(16)之间形成电接触的第一支撑部件导体(6) )。 在将表面安装的装置(15)以倾斜的方式安装在基板(11)上的方法中,支撑部件(1)安装在基板(11)上,表面安装装置(15)位于其上。
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公开(公告)号:WO2013075437A1
公开(公告)日:2013-05-30
申请号:PCT/CN2012/072972
申请日:2012-03-23
Applicant: 中兴通讯股份有限公司 , 戴载星 , 杨涛 , 杨世林 , 王卫周
IPC: H05K7/14
CPC classification number: H05K3/301 , G02B6/3897 , G02B6/4261 , G02B6/4277 , H05K2201/10121 , H05K2201/10446 , H05K2201/10484
Abstract: 本发明提供了一种光模块斜出头架及通信设备,其中,上述头架包括:安装基座(401),设置为与设备的面板连接安装;光模块导轨出口(403),斜穿过并固定于出口支撑结构(405)和所述安装基座(401),设置为沿光模块导轨的斜置方向贯穿推入所述光模块导轨;所述出口支撑结构(405),围绕所述光模块导轨出口(403)设置,并与所述安装基座(401)贴合连接;所述出口支撑结构(405)与所述安装基座(401)平行设置。采用本发明提供的上述技术方案,解决了相关技术中在PCB中,直出器件与斜出光模块两者的安装方向不一致而导致难以安装等问题,从而达到了避免直出器件对光模块斜出安装的影响的效果。
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公开(公告)号:WO2010087996A1
公开(公告)日:2010-08-05
申请号:PCT/US2010/000277
申请日:2010-02-01
Applicant: TYCO ELECTRONICS CORPORATION , SMEJTEK, Dalibor, J.
Inventor: SMEJTEK, Dalibor, J.
IPC: H05K3/36
CPC classification number: H05K3/366 , H05K1/117 , H05K3/3405 , H05K2201/048 , H05K2201/09036 , H05K2201/09809 , H05K2201/10356 , H05K2201/10484
Abstract: A printed circuit assembly (10) includes a base printed circuit (12) having a printed circuit receiving area (29) and a plurality of electrical contacts provided on the printed circuit receiving area (30). The printed circuit assembly also includes a secondary printed circuit (14) having a secondary substrate (54) including a mating edge (46) and a plurality of secondary contacts (70) provided along the mating edge. The secondary printed circuit is mounted on the base printed circuit such that the mating edge of the secondary printed circuit is directly engaged with the base printed circuit at the printed circuit receiving area. Each of the secondary contacts is electrically connected to a corresponding one of the electrical contacts of the base printed circuit.
Abstract translation: 印刷电路组件(10)包括具有印刷电路接收区域(29)的底部印刷电路(12)和设置在印刷电路接收区域(30)上的多个电触头。 印刷电路组件还包括具有辅助衬底(54)的次级印刷电路(14),该辅助衬底包括配合边缘(46)和沿着配合边缘设置的多个辅助触点(70)。 二次印刷电路安装在基板印刷电路上,使得二次印刷电路的配合边缘与印刷电路接收区域的基本印刷电路直接接合。 每个次级触点电连接到基本印刷电路的相应的一个电触点。
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公开(公告)号:WO2009141927A1
公开(公告)日:2009-11-26
申请号:PCT/JP2008/073343
申请日:2008-12-22
Inventor: 高橋 通昌
IPC: H05K3/46
CPC classification number: H05K1/183 , H01L2224/45144 , H01L2224/48091 , H05K1/141 , H05K1/142 , H05K1/185 , H05K3/4602 , H05K3/4694 , H05K2201/10484 , H05K2203/049 , Y10T29/49126 , H01L2924/00014 , H01L2924/00
Abstract: プリント配線板として、導体を有する第1の基板(10)と、導体を有し、第1の基板(10)よりも導体の存在密度が高い第2の基板(20)と、を備える。そして、第1の基板(10)の導体と第2の基板(20)の導体とが電気的に接続され、第1の基板(10)の表面に窪み(100a)が設けられ、その窪み(100a)に、第2の基板(20)が配置されている。こうして、第2の基板(20)の主面の少なくとも一部が、第1の基板(10)の表面に露出するように、第2の基板(20)が第1の基板(10)に嵌入されている。
Abstract translation: 印刷电路板设置有具有导体的第一基板(10)和具有比第一基板(10)高的导体和导体存在密度的第二基板(20)。 第一基板(10)的导体和第二基板(20)的导体彼此电连接,在第一基板(10)的表面上形成凹部(100a),并且第二基板(20) )设置在凹部(100a)中。 第二基板(20)装配在第一基板(10)中,使得第二基板(20)的主表面的至少一部分从第一基板(10)的表面露出。
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公开(公告)号:WO2009090717A1
公开(公告)日:2009-07-23
申请号:PCT/JP2008/003897
申请日:2008-12-22
Inventor: 城所仁志
CPC classification number: H05K1/18 , H05K2201/10454 , H05K2201/10484 , H05K2201/10522 , H05K2201/1053 , H05K2201/10651 , Y10T29/4913
Abstract: U字フォーミングされたアキシャルリード形状の電子部品をプリント基板に立てて実装する場合に、2つのU字フォーミングされたアキシャルリード形状の電子部品を、互いに同一直線上にないように配置し、それぞれの湾曲した側のリード線の電位が同電位となるように配線パターンを設け、その湾曲した側のリード線を接近させるように各電子部品を傾けておくことで、傾けた方向への電子部品の倒れを、湾曲させた側のリード線でお互いを支え合うことにより、電子部品や基板の放熱性を損なうことなく、また基板の組立性を大きく悪化させること無く、電子部品の倒れを防止することができる。
Abstract translation: 在将U字形成型的轴向引线型电子部件安装在印刷电路板上的情况下,经受U字形成的两个轴向引线型电子部件被布置成不位于同一条线上,并且布线图案 被设置为使得弯曲侧的引线具有相同的电位。 由于每个电子部件被倾斜使得弯曲侧的引线彼此靠近,所以电子部件由弯曲侧的引线彼此支撑。 因此,可以防止电子部件塌陷而不破坏电子部件和基板的散热特性,并且不会使基板的组装性大大降低。
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公开(公告)号:WO2005054745A1
公开(公告)日:2005-06-16
申请号:PCT/AU2004/001710
申请日:2004-12-03
Applicant: AUTO CONCEPTS AUSTRALIA PTY LTD , FLAWS, Ely , PAPAX, Andrew
Inventor: FLAWS, Ely , PAPAX, Andrew
IPC: F21S8/10
CPC classification number: H05K3/301 , B60Q1/32 , F21S43/14 , F21Y2107/50 , F21Y2115/10 , H05K2201/10106 , H05K2201/10484 , H05K2201/10606
Abstract: A lamp assembly (2) including a base portion 4 having a substantially flat printed circuit board (8), and a mounting device (6) providing at least three mounting portions (14, 16, 18), at least three light-emitting diodes (20, 22, 24) connected to the circuit board (8) and a curved optical lens portion (12) for transmitting light radiated by the light-emitting diodes. The base of each light-emitting diode is flush mounted to a respective surface of a mounting portion (14, 16, 18) such that a first of said light-emitting diodes (22) is orientated at an angle (26) with respect to a second of the light-emitting diodes (20), and a third of the light-emitting diodes (24) is orientated at an angle (28) with respect to the first light-emitting diode. The configuration of the light-emitting diodes (20, 22, 24) within the assembly is such as to distribute the light generally uniformly over the lens (12).
Abstract translation: 一种灯组件(2),包括具有基本上平坦的印刷电路板(8)的基座部分4和提供至少三个安装部分(14,16,18)的安装装置(6),至少三个发光二极管 (20,22,24),以及用于透射由所述发光二极管照射的光的弯曲光学透镜部(12)。 每个发光二极管的基底齐平地安装到安装部分(14,16,18)的相应表面上,使得第一个所述发光二极管(22)相对于 发光二极管(20)中的第二个,并且发光二极管(24)中的第三个以相对于第一发光二极管的角度(28)取向。 组件内的发光二极管(20,22,24)的配置使得将光大致均匀地分布在透镜(12)上。
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