公开(公告)号：US10064288B2

公开(公告)日：2018-08-28

申请号：US15326635

申请日：2014-08-12

Applicant: Advanced Bionics AG

Inventor： Lin Li ,  Jian Xie ,  Jeryle Walter

IPC: H01R43/04 ,  H05K3/32 ,  A61N1/36 ,  A61N1/375 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

公开(公告)号：US20160043028A1

公开(公告)日：2016-02-11

申请号：US14819755

申请日：2015-08-06

Applicant: ROHM CO., LTD.

Inventor： Hirotoshi USUI

IPC: H01L23/498 ,  H01L23/495 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/49861 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/467 ,  H01L23/49555 ,  H01L23/498 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09845 ,  H05K2201/10469 ,  H05K2201/10757 ,  H05K2201/10795 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package-in-substrate includes an exposed pad having a surface that is capable of contacting the outside; a semiconductor chip arranged on a surface opposite to the surface of the exposed pad; a molding resin for molding the semiconductor chip; and a lead frame extending from a side surface of the molding resin and having a leading end portion with a machined shape. The leading end portion of the lead frame is cut to have a cutting angel that is an acute angle formed by an extended straight line of the lead frame with respect to a top surface of a package.

Abstract translation: 封装在衬底中的衬底包括具有能够接触外部的表面的裸露焊盘; 布置在与所述裸露焊盘的表面相对的表面上的半导体芯片; 用于模制半导体芯片的模塑树脂; 以及从模制树脂的侧表面延伸并具有加工形状的前端部的引线框架。 引线框架的前端部被切割成具有相对于封装的顶表面由引线框架的延伸的直线形成的锐角的切割角。

公开(公告)号：US09155200B2

公开(公告)日：2015-10-06

申请号：US13926069

申请日：2013-06-25

Applicant: Interplex Industries, Inc.

Inventor： Jack Seidler

IPC: H01R9/00 ,  H05K3/00 ,  B23K35/02 ,  H01R43/02 ,  H05K3/34 ,  H01R12/57 ,  H01R12/70

CPC classification number: H05K3/00 ,  B23K35/0244 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0235 ,  H05K3/3426 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2201/0311 ,  H05K2201/10704 ,  H05K2201/10795 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2201/10984 ,  H05K2203/0405 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

Abstract translation: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带，每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后，细长可回流构件被切割成多个单独的可回流元件，每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。

公开(公告)号：US20150077940A1

公开(公告)日：2015-03-19

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/70 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20130342986A1

公开(公告)日：2013-12-26

申请号：US13533681

申请日：2012-06-26

Applicant: Tsung-Yu Chen ,  Rebecca Shia

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H05K1/11 ,  H05K3/10 ,  H01L23/48

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.

Abstract translation: 示出了引脚连接，电子设备和方法的实施例，其包括引脚配置以减少引脚连接操作期间的空隙和引脚倾斜以及其它问题，诸如附接到芯片封装引脚网格阵列。 引脚头被显示为包括诸如凸表面，多个腿和销头表面中的通道的特征。

公开(公告)号：US08338927B2

公开(公告)日：2012-12-25

申请号：US13225788

申请日：2011-09-06

Applicant: Hiroyuki Nakamura ,  Atsushi Nishikizawa ,  Nobuya Koike

Inventor： Hiroyuki Nakamura ,  Atsushi Nishikizawa ,  Nobuya Koike

IPC: H01L21/44

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The semiconductor device includes a semiconductor chip, a chip mounting portion, a suspension lead, and a plurality of leads. Each of the plurality of leads has a first part and a second part, and the suspension lead has a first part and a second part. The first part of each of the plurality of leads and the suspension lead project from the plurality of side surfaces of the sealing body, respectively. Parts of the side surfaces of the plurality of leads and the suspension lead are exposed from the plurality of side surfaces of the sealing body, respectively. An area of the obverse surface of the first part of the suspension lead is larger than an area of the obverse surface of the first part of each of the plurality of leads in a plan view.

Abstract translation: 半导体器件包括半导体芯片，芯片安装部分，悬挂引线和多个引线。 多个引线中的每一个具有第一部分和第二部分，并且悬架引线具有第一部分和第二部分。 多个引线中的每一个的第一部分和悬挂引线分别从密封体的多个侧表面伸出。 多个引线的侧面部分和悬挂引线分别从密封体的多个侧面露出。 在俯视图中，悬架引线的第一部分的正面的面积大于多根引线中的每一个的第一部分的正面的面积。

公开(公告)号：US20110299288A1

公开(公告)日：2011-12-08

申请号：US13210329

申请日：2011-08-15

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: F21V11/00 ,  H05K7/00

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that covers and is contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部位置上，并且每个这样的电子部件通过覆盖并与其接触的夹具保持就位 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US20090201680A1

公开(公告)日：2009-08-13

申请号：US12318348

申请日：2008-12-29

Applicant: Hsien-Ching Chang ,  Tzu-Sung Chen

Inventor： Hsien-Ching Chang ,  Tzu-Sung Chen

IPC: B60Q1/00

CPC classification number: H05K3/326 ,  F21V19/0025 ,  F21V21/002 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01R4/2404 ,  H01R13/6666 ,  H05K1/189 ,  H05K3/301 ,  H05K3/308 ,  H05K2201/0761 ,  H05K2201/09309 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10795 ,  H05K2203/1189 ,  H01L2924/00014

Abstract: An easy-to-assembly LED and substrate providing fast assembling, simple replacement and maintenance, exchangeable arrangement of LED (3) without wiring or welding process comprises: an assembling substrate (1) having sandwich-like structure, consists essentially of a plurality of conductive layers (10) and a plurality of non-conductive layers (11); a plurality of LED (3) having at least one lead partially insulated, all conductive sections and insulated sections of said LED (3) will correspond to the arrangement of conductive layers (10) and non-conductive layers (11) of said assembling substrate (1); and a power source (4).

Abstract translation: 一种易于组装的LED和基板，其提供快速组装，简单的更换和维护，LED（3）的可替换布置，无需布线或焊接工艺，包括：具有夹层结构的组装基板（1）基本上由多个 导电层（10）和多个非导电层（11）; 具有至少一个引线部分绝缘的多个LED（3），所述LED（3）的所有导电部分和绝缘部分将对应于所述组装衬底的导电层（10）和非导电层（11）的布置 （1）; 和电源（4）。

公开(公告)号：US20050285534A1

公开(公告)日：2005-12-29

申请号：US11114190

申请日：2005-04-26

Applicant: Kazuhiko Machida ,  Kesayuki Takeuchi ,  Chisato Emori

Inventor： Kazuhiko Machida ,  Kesayuki Takeuchi ,  Chisato Emori

IPC: H01T1/00 ,  H01T4/12 ,  H05K1/18 ,  H05K3/34 ,  H01T4/10 ,  H01J61/36

CPC classification number: H01T4/12 ,  H01T1/00 ,  H05K3/3426 ,  H05K2201/10795 ,  Y02P70/613

Abstract: A surface mounting discharge tube, comprise of a cylindrical ceramic envelope sealed at its two ends by side surfaces of electrodes, designed to be directly soldered on to a mounting board, where the electrodes at the two ends are rectangular, project outward radially at the ends of the ceramic envelope and are provided at peripheral edges at the side surfaces of the electrodes with soldering use tapers or step differences, whereby positional deviation at the time of soldering is suppressed and sufficient PCT properties are secured.

Abstract translation: 表面安装放电管包括圆柱形陶瓷外壳，其两端由电极的侧表面密封，设计成直接焊接到安装板上，其中两端的电极为矩形，在端部径向向外突出 并且在电极的侧面的周边处设置有焊接使用锥度或阶差，由此抑制了焊接时的位置偏差并确保了足够的PCT性能。

公开(公告)号：US20160286642A1

公开(公告)日：2016-09-29

申请号：US15005589

申请日：2016-01-25

Applicant: Intel Corporation

Inventor： Tsung-Yu Chen ,  Rebecca Shia

IPC: H05K1/11 ,  H01L23/498 ,  H01L23/373 ,  H05K3/40

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L21/4885 ,  H01L23/373 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01R13/04 ,  H05K3/103 ,  H05K3/3426 ,  H05K3/4015 ,  H05K5/0069 ,  H05K2201/10318 ,  H05K2201/10704 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081 ,  H05K2203/1178 ,  H01L2924/014 ,  H01L2924/00

Abstract: Embodiments pin connections, electronic devices, and methods are shown that include pin configurations to reduce voids and pin tilting and other concerns during pin attach operations, such as attachment to a chip package pin grid array. Pin head are shown that include features such as convex surfaces, a number of legs, and channels in pin head surfaces.