公开(公告)号：SG11201401430RA

公开(公告)日：2014-09-26

申请号：SG11201401430R

申请日：2012-10-10

Applicant: BREWER SCIENCE INC

Inventor： KRISHNAMURTHY VANDANA ,  SULLIVAN DANIEL M ,  WANG YUBAO ,  LIN QIN ,  SIMMONS SEAN

IPC: H01L21/20 ,  H01L21/027 ,  H01L21/205

公开(公告)号：SG177039A1

公开(公告)日：2012-01-30

申请号：SG2010051159

申请日：2010-07-14

Applicant: BREWER SCIENCE INC

Inventor： JEREMY W MCCUTCHEON ,  ROBERT D BROWN

Abstract: New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed froth those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate thathave only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.Figure 5a

公开(公告)号：DE60334980D1

公开(公告)日：2010-12-30

申请号：DE60334980

申请日：2003-04-11

Applicant: BREWER SCIENCE INC

Inventor： SABNIS RAM W ,  SHIH WU-SHENG

IPC: G03F7/30

公开(公告)号：DE112009000140T5

公开(公告)日：2010-11-18

申请号：DE112009000140

申请日：2009-01-23

Applicant: BREWER SCIENCE INC

Inventor： FLAIM TONY D ,  MCCUTCHEON JEREMY W

IPC: H01L23/12 ,  H01L23/48

公开(公告)号：AT479131T

公开(公告)日：2010-09-15

申请号：AT08015849

申请日：2002-02-11

Applicant: BREWER SCIENCE INC

Inventor： ENOMOTO TOMOYUKI ,  MIZUSAWA KEN-ICHI ,  ARASE SHIN-YA ,  PULIGADDA RAMA

IPC: G03F7/004 ,  G03F7/11 ,  C08F18/00 ,  C08F18/16 ,  C08F220/12 ,  C08F220/22 ,  C08F220/28 ,  C09D133/16 ,  G03F7/038 ,  G03F7/09 ,  G03F7/26 ,  G03F7/40 ,  H01L21/027

Abstract: Anti-reflective coatings formed from polymers and having high etch rates are provided. Broadly, the coatings are formed from a polymer binder and a light attenuating compound. The polymer binder has halogen atoms bonded thereto, preferably to functional groups on the polymer binder rather than to the polymer backbone. Preferred polymer binders comprise acrylic polymers while it is preferred that the halogenated functional groups of the polymer binders be dihalogenated, and more preferably trihalogenated, with chlorine, fluorine, or bromine atoms.

公开(公告)号：CA2711266A1

公开(公告)日：2009-07-30

申请号：CA2711266

申请日：2009-01-23

Applicant: BREWER SCIENCE INC

Inventor： FLAIM TONY D ,  MCCUTCHEON JEREMY

IPC: H01L23/12 ,  H01L23/48

Abstract: New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

公开(公告)号：DE60320292D1

公开(公告)日：2008-05-21

申请号：DE60320292

申请日：2003-09-19

Applicant: BREWER SCIENCE INC

Inventor： ENOMOTO TOMOYUKI ,  NAKAYAMA KEISUKE ,  PULIGADDA RAMA

IPC: H01L23/29 ,  B32B27/32 ,  G03F20060101 ,  G03F7/004 ,  G03F7/09 ,  H01L21/44

Abstract: The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or an alkoxymethyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.

公开(公告)号：DE69828630T2

公开(公告)日：2005-06-16

申请号：DE69828630

申请日：1998-09-28

Applicant: BREWER SCIENCE INC

Inventor： MEADOR D ,  GUERRERO J ,  SHAO XIE ,  KRISHNAMURTHY VANDANA

IPC: G03F7/11 ,  C08F8/00 ,  C08F220/32 ,  C08F283/10 ,  C09D133/06 ,  G03F7/09 ,  G03C1/492 ,  G03C1/815 ,  C12N15/00 ,  C10M137/04

Abstract: Anti-reflective coating compositions having improved etch rate, inter alia, are prepared from certain high molecular weight polymers and copolymers, particularly glycidyl methacrylate with grafted dyes.

公开(公告)号：AT287098T

公开(公告)日：2005-01-15

申请号：AT98952017

申请日：1998-09-28

Applicant: BREWER SCIENCE INC

Inventor： MEADOR JIM D ,  GUERRERO DOUGLAS J ,  SHAO XIE ,  KRISHNAMURTHY VANDANA

IPC: G03F7/11 ,  C08F8/00 ,  C08F220/32 ,  C08F283/10 ,  C09D133/06 ,  G03F7/09 ,  G03C1/492 ,  G03C1/815

Abstract: Anti-reflective coating compositions having improved etch rate, inter alia, are prepared from certain high molecular weight polymers and copolymers, particularly glycidyl methacrylate with grafted dyes.

公开(公告)号：AU2003294563A1

公开(公告)日：2004-06-23

申请号：AU2003294563

申请日：2003-12-02

Applicant: BREWER SCIENCE INC

Inventor： PULIGADDA RAMA ,  LAMB JAMES E ,  FLAIM TONY D

IPC: H01L21/312 ,  B05D3/02 ,  B32B17/10 ,  C08F20/26 ,  C08F20/32 ,  C08F220/28 ,  C08G59/32 ,  C08J7/04 ,  C09D163/00 ,  G03F7/09 ,  G03F7/11 ,  H01L20060101 ,  H01L21/027 ,  H01L21/311

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted ring members. In another embodiment, the polymers further comprise recurring monomers comprising ring members reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.