公开(公告)号：US11410940B2

公开(公告)日：2022-08-09

申请号：US17170736

申请日：2021-02-08

Applicant: Unimicron Technology Corp.

Inventor： Pu-Ju Lin ,  Cheng-Ta Ko ,  Yu-Hua Chen ,  Tzyy-Jang Tseng ,  Ra-Min Tain

IPC: H01L23/16 ,  H01L23/66 ,  H01L23/00 ,  H01L23/31

Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.

公开(公告)号：US20220240367A1

公开(公告)日：2022-07-28

申请号：US17198287

申请日：2021-03-11

Applicant: Unimicron Technology Corp.

Inventor： Ming-Hao WU ,  Kuo-Wei LI

IPC: H05K1/02 ,  H05K3/28 ,  B01J13/18 ,  B01J13/20 ,  C09D11/10

Abstract: A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.

公开(公告)号：US20220238471A1

公开(公告)日：2022-07-28

申请号：US17200922

申请日：2021-03-15

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang Tseng ,  Ming-Ru Chen ,  Cheng-Chung Lo ,  Chin-Sheng Wang ,  Wen-Sen Tang

IPC: H01L23/00 ,  H01L25/075 ,  H01L27/12 ,  H01L33/62

Abstract: A manufacturing method of a metal bump structure is provided. A driving base is provided. At least one pad and an insulating layer are formed on the driving base. The pad is formed on an arrangement surface of the driving base and has an upper surface. The insulating layer covers the arrangement surface of the driving base and the pad, and exposes a part of the upper surface of the pad. A patterned metal layer is formed on the upper surface of the pad exposed by the insulating layer, and extends to cover a part of the insulating layer. An electro-less plating process is performed to form at least one metal bump on the patterned metal layer. A first extension direction of the metal bump is perpendicular to a second extension direction of the driving base.

公开(公告)号：US20220217841A1

公开(公告)日：2022-07-07

申请号：US17185216

申请日：2021-02-25

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo Ching CHEN

IPC: H05K1/02 ,  H05K3/20

Abstract: A circuit board is manufactured by mounting a first circuit layer, mounting a conductive bump on the first circuit layer, covering the first circuit layer with a first dielectric layer which exposes the conductive bump, mounting a second dielectric layer on the first dielectric layer with a second dielectric layer opening that exposes the conductive bump, and finally, mounting a second circuit layer on the surface of the second dielectric layer and in the second dielectric layer opening. Since the surface roughness of the second dielectric layer and the second dielectric layer opening is low, it is unlikely to form nano voids between the second dielectric layer and the second circuit layer, and the second circuit layer may be attached to the second dielectric layer firmly, which is an advantage for fine line circuit disposal.

公开(公告)号：US20220199513A1

公开(公告)日：2022-06-23

申请号：US17654405

申请日：2022-03-11

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hao CHEN ,  Chia-Lung LIN ,  Chien-Hsiang CHOU ,  Yi-Lin CHIANG ,  Chien-Chen LIN

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/06

Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

公开(公告)号：US20220189923A1

公开(公告)日：2022-06-16

申请号：US17182258

申请日：2021-02-23

Applicant: Unimicron Technology Corp.

Inventor： Tzu-Hsuan WANG ,  Chen-Hsien LIU

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00 ,  H01L23/433 ,  H01L21/56 ,  H01L21/768

Abstract: A chip package structure includes a wiring board, a first chip, a second chip, a thermally conductive material, a molding compound and a heat dissipation part. The wiring board includes a plurality of circuit pads. The first chip is mounted on the wiring board and is electrically connected to at least one of the circuit pads. The first chip is located between the second chip and the wiring board. The thermally conductive material is located on the wiring board and penetrates the second chip and the first chip to extend to the wiring board. The molding compound is disposed on the wiring board, and the heat dissipation part is disposed on the molding material and thermally coupled to the thermally conductive material.

公开(公告)号：US11348869B2

公开(公告)日：2022-05-31

申请号：US17100932

申请日：2020-11-22

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chou Chen ,  Chun-Hsien Chien ,  Wen-Liang Yeh ,  Wei-Ti Lin

IPC: H01L23/04 ,  H01L23/522 ,  H01L23/00 ,  H01L21/50

Abstract: A chip packaging structure includes a circuit redistribution structure, a chip, a sealing layer, and an antenna pattern. The circuit redistribution structure includes a first and a second circuit layer, and a conductive pad. The second circuit layer is disposed on and electrically connected to the first circuit layer. The conductive pad is electrically connected to the second circuit layer. The chip is disposed on the circuit redistribution structure and electrically connected to the second circuit layer. The sealing layer having an opening and a groove covers the chip and the circuit redistribution structure. The opening exposes the conductive pad. A portion of the groove communicates with the opening. The antenna pattern includes a first and a second portion. The first portion covers sidewalls of the opening and is electrically connected to the conductive pad. The second portion is filled in the groove and electrically connected to the first portion.

公开(公告)号：US20220139886A1

公开(公告)日：2022-05-05

申请号：US17125981

申请日：2020-12-17

Applicant: Unimicron Technology Corp.

Inventor： Kai-Ming YANG ,  Chen-Hao LIN ,  Chia-Hao CHANG ,  Tzu-Nien LEE

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62

Abstract: A light-emitting package includes an encapsulating member, a plurality of light-emitting components disposed in the encapsulating member, a plurality of first electrode pads, a plurality of second electrode pads, and a plurality of conductive connection structures. The encapsulating member has a first surface and a second surface opposite to each other. Each light-emitting component has a light-emitting surface exposed on the first surface. Both the first electrode pads and the second electrode pads are exposed on the second surface. A first bonding surface of each first electrode pad and a second bonding surface of each second electrode pad are both flush with the second surface. The light-emitting components disposed on the first electrode pads are electrically connected to the first electrode pads. The conductive connection structures passing through the encapsulating member are electrically connected to the light-emitting components and the second electrode pads.

公开(公告)号：US20220129113A1

公开(公告)日：2022-04-28

申请号：US17113128

申请日：2020-12-07

Applicant: Unimicron Technology Corp.

Inventor： Shih-Yao Lin ,  Ansheng Lee ,  Ming-Yuan Hsu ,  Meng-Chia Chan

IPC: G06F3/044 ,  H01L25/04 ,  H01L25/065 ,  H01L25/075

Abstract: A touch display device includes a flexible substrate, a light emitting structure layer, and a flexible touch sensing layer. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting structure layer is disposed on the first surface of the flexible substrate. The flexible touch sensing layer is disposed on the second surface of the flexible substrate.

公开(公告)号：US11315865B2

公开(公告)日：2022-04-26

申请号：US17234826

申请日：2021-04-20

Applicant: Unimicron Technology Corp.

Inventor： Chien-Chen Lin

IPC: H05K3/06 ,  H01L23/498 ,  H01L21/48 ,  H05K1/11

Abstract: A method of manufacturing circuit board structure includes forming a sacrificial layer having first openings on a substrate; forming a metal layer on the sacrificial layer; forming a patterned photoresist layer having second openings over the sacrificial layer, in which the second openings are connected to the first openings and expose a portion of the metal layer; forming a first circuit layer filling the second openings and the first openings; forming a first dielectric layer over the sacrificial layer and covering the metal layer, in which the first dielectric layer has third openings exposing the first circuit layer; forming a second circuit layer filling the third openings and covering a portion of the first dielectric layer; removing the substrate to expose the sacrificial layer, a portion of the metal layer and a portion of the first circuit layer; and removing the sacrificial layer and the metal layer.