POLYSILOXANE
    71.
    发明专利

    公开(公告)号:JP2002220471A

    公开(公告)日:2002-08-09

    申请号:JP2001019834

    申请日:2001-01-29

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a new polysiloxane useful as a resin component for a resist material and the like, excellent in dry-etching resistance, and also excellent in basic properties as the resist such as transparency, sensibility, resolution and development to radiation. SOLUTION: The polysiloxane is composed of a structural unit (I) and/or the structural unit (II), expressed by the following general formula (1), wherein a weight-average molecular weight reduced to polystylene is 500-1,000,000. [Formula (1), each R denotes a hydrogen atom or a methyl group, independently each other, R' denotes a hydrogen atom, monovalent hydrocarbon group, monovalent hydrocarbon-halide group, halogen atom or primary to tertiary amino group, and n is an integer of 1-3].

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2002202604A

    公开(公告)日:2002-07-19

    申请号:JP2000401302

    申请日:2000-12-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation, excellent in sensitivity, resolution and pattern shape and less liable to a change in line width due to the increase and decrease of space width as a chemical amplification type resist sensitive particularly to far UV typified by ArF excimer laser beam (193 nm wavelength). SOLUTION: The radiation sensitive resin composition contains (A1) a resin containing norbornene repeating units each having a (substituted) carboxylic acid amide group typified by an N,N-dimethylnorbornene-5-carboxylic acid amide or an N,N-dimethyltetracyclo[4.4.0.12,5.17,10]dodeca-3-ene-8-carboxylic acid amide or (A2) a resin containing (substituted) (meth)acrylamide repeating units typified by N,N-dimethyl(meth)acrylamide and (B) a radiation sensitive acid generating agent.

    SULFUR ATOM-CONTAINING POLYMER AND METHOD FOR PRODUCING THE SAME

    公开(公告)号:JP2001261834A

    公开(公告)日:2001-09-26

    申请号:JP2000070553

    申请日:2000-03-14

    Abstract: PROBLEM TO BE SOLVED: To provide a sulfur atom-containing polymer which contains sulfur atoms in a high density and is composed of repeating units having many aromatic rings, and to provide a method for producing the same. SOLUTION: This polymer is composed of repeating units represented by formula (1) and is obtained by the thermal polymerization of a cyclic thioaryl ester represented by formula (2). A compound selected from among quaternary onium salts and crown ether compounds is used as a polymerization catalyst.

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001209181A

    公开(公告)日:2001-08-03

    申请号:JP2000277966

    申请日:2000-09-13

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having superior dry etching resistance and high transparency to radiation, excellent in basic physical properties as a resist such as sensitivity, resolution and pattern shape, excellent also in shelf stability as a composition and retaining satisfactory adhesiveness to a substrate. SOLUTION: The radiation sensitive resin composition contains (A) a resin having repeating units derived from a derivative substituted by an oxygen- containing polar group (e.g. a hydroxyl or hydroxymethyl group) or a nitrogen- containing polar group (e.g. a cyano group), e.g. bicyclo[2.2.1]hept-2-ene or tetracyclo[4.4.0.12,5.17,10]dodec-3-ene, repeating units derived from maleic anhydride and repeating units derived from an acid dissociable ester derivative of (meth)acrylic acid typified by formula 1, 2 or 3 and (B) a radiation sensitive acid generating gent.

    RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001188346A

    公开(公告)日:2001-07-10

    申请号:JP2000089903

    申请日:2000-03-28

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having high transparency to radiation as a chemical amplification type resist, excellent in basic physical properties as a resist such as dry etching resistance, sensitivity, resolution and pattern shape, not causing development defects in microfabrication and capable of producing a semiconductor device in a high yield. SOLUTION: The radiation sensitive resin composition contains (A) an alkali- insoluble or slightly alkali-soluble acid-dissociable group-containing resin having a skeleton of formula 1 preferably as a group of formula 2-1 or 2-2 and convertible to an alkali-soluble resin when the acid-dissociable group is dissociated and (B) a radiation sensitive acid generating agent. The component A is typified by a copolymer comprising repeating units of formula 3.

    RADIATION SENSITIVE MATERIAL
    78.
    发明专利

    公开(公告)号:JP2000131846A

    公开(公告)日:2000-05-12

    申请号:JP30404398

    申请日:1998-10-26

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive material superior in sensitivity, developability, etching endurance, heat resistance, and adhesion to a substrate and developable with an aqueous alkaline developing solution and usable for a positive resist for manufacturing the semiconductor integrated circuit and the like by using a copolymer composed essentially of repeating units derived from specified monomers. SOLUTION: The radiation sensitive material is composed essentially of repeating units derived from the monomers each represented by formulae I and II in which each of (a) and (b) is an integer of 0-10; each of (b) and (c) is an integer of 1-10; (d) is an integer 0-10; (e) is an integer of 0-5; R1 is an H atom or a 1-5C alkyl or phenyl group; R2 is a halogen atom or a 1-5C alkyl or such alkoxy or phenyl or 2-10 dialkylamino group, and when R2 exists by >=2, each of them may be same or different.

    Thermosetting resin composition for forming cured film, radiation-sensitive resin composition for forming cured film, cured film, method for forming the same, semiconductor element, and display element
    79.
    发明专利
    Thermosetting resin composition for forming cured film, radiation-sensitive resin composition for forming cured film, cured film, method for forming the same, semiconductor element, and display element 有权
    用于形成固化膜的热固性树脂组合物,用于形成固化膜的辐射敏感性树脂组合物,固化膜,其形成方法,半导体元件和显示元件

    公开(公告)号:JP2014152192A

    公开(公告)日:2014-08-25

    申请号:JP2013020688

    申请日:2013-02-05

    Abstract: PROBLEM TO BE SOLVED: To provide a resin composition for forming a cured film, which can form a cured film having excellent surface hardness and capable of fully satisfying general characteristics such as chemical resistance, heat resistance, transmittance, and dielectric constant and is excellent in storage stability.SOLUTION: The present invention is the thermosetting resin composition for forming a cured film, which contains [A] a polymer containing: a structural unit (I) containing at least one selected from the group consisting of a group represented by formula (1) and a group represented by formula (2); and a structural unit (II-1) containing a crosslinkable group (a1). In the formula (1), Rand Rare each a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 fluorinated alkyl group. In the formula (2), Rand Rare each a hydrogen atom, a halogen atom, a C1-C4 alkyl group, or a C1-C4 fluorinated alkyl group. Preferably, the crosslinkable group (a1) is at least one selected from the group consisting of an oxiranyl group and an oxetanyl group.

    Abstract translation: 要解决的问题:提供一种形成固化膜的树脂组合物,其可以形成具有优异的表面硬度并能够完全满足诸如耐化学性,耐热性,透射率和介电常数的一般特性的固化膜,并且在 储存稳定性。本发明是用于形成固化膜的热固性树脂组合物,其含有[A]含有下列物质的聚合物:含有选自由式(I)表示的基团的组中的至少一种的结构单元(I) 1)和由式(2)表示的基团; 和含有交联性基团(a1)的结构单元(II-1)。 在式(1)中,兰德Rare各自为氢原子,C1-C4烷基或C1-C4氟化烷基。 式(2)中,Rare Rare各自为氢原子,卤素原子,C1-C4烷基或C1-C4氟化烷基。 优选地,可交联基团(a1)为选自环氧乙烷基和氧杂环丁烷基中的至少一种。

    Positive-type radiation-sensitive resin composition, cured film, method for producing the same, semiconductor element, and display device
    80.
    发明专利
    Positive-type radiation-sensitive resin composition, cured film, method for producing the same, semiconductor element, and display device 有权
    阳离子型辐射敏感性树脂组合物,固化膜,其制造方法,半导体元件和显示装置

    公开(公告)号:JP2014137454A

    公开(公告)日:2014-07-28

    申请号:JP2013005605

    申请日:2013-01-16

    Abstract: PROBLEM TO BE SOLVED: To provide a positive-type radiation-sensitive resin composition capable of forming a cured film excellent in storage stability and in addition, sufficiently satisfying general characteristics such as sensitivity, developing adhesion, heat resistance, chemical resistance, transmittance and dielectric constant while retaining good surface hardness.SOLUTION: The positive-type radiation-sensitive resin composition comprises: [A] a polymer having a structural unit (I) containing at least one selected from the group comprising groups represented by formula (1) mentioned below and groups represented by formula (2) mentioned below and a structural unit (II) containing a cyclic ether structure or a cyclic carbonate structure; and [B] an acid generator. In the formula (1) mentioned below, Rand Rare each independently a hydrogen atom, a 1-4C alkyl group or a 1-4C fluorinated alkyl group. In the formula (2) mentioned below, Rand Rare each independently a hydrogen atom, a halogen atom, a 1-4C alkyl group or a 1-4C fluorinated alkyl group.

    Abstract translation: 要解决的问题:提供能够形成保存稳定性优异的固化膜的正型感光性树脂组合物,另外,充分满足一般特性如感光度,显影粘合性,耐热性,耐化学性,透光率和电介质 常数,同时保持良好的表面硬度。解决方案:正型辐射敏感树脂组合物包含:[A]具有结构单元(I)的聚合物,其含有选自下述式(1)表示的基团中的至少一种 和由下述式(2)表示的基团和含有环醚结构或环状碳酸酯结构的结构单元(II); 和[B]酸生成剂。 在下述式(1)中,兰德尔芳基各自独立地为氢原子,1-4C烷基或1-4C氟化烷基。 在下述式(2)中,兰德尔芳基各自独立地为氢原子,卤素原子,1-4C烷基或1-4C氟化烷基。

Patent Agency Ranking