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    REED RELAY
    72.
    发明申请
    REED RELAY 有权
    REED继电器

    公开(公告)号：US20160379784A1

    公开(公告)日：2016-12-29

    申请号：US15125123

    申请日：2014-03-11

    Applicant: SHENZHEN ZHIYOU BATTERY INTEGRATION TECHNOLOGY CO., LTD

    Inventor： Shugang GONG

    IPC: H01H50/04 ,  H05K5/02 ,  H05K5/00 ,  H01H50/10 ,  H05K1/18

    CPC classification number: H01H50/047 ,  H01H1/5805 ,  H01H50/041 ,  H01H50/10 ,  H01H51/281 ,  H05K1/0203 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0217 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10196 ,  H05K2201/10219 ,  Y02P70/611

    Abstract: A reed switch relay comprises a PCB base (1) and a control assembly (2) electrically connected to the PCB base. The control assembly is mounted on the PCB base by a surface mount technology. The control assembly comprises a hollow coil (21) mounted on the PCB base, a reed switch (22) mounted in the hollow coil, and a shield layer (23) sleeving the outer surface of the hollow coil, the reed switch comprises pins, the shield layer is connected with the pins of the reed switch. In the reed relay, the control assembly is mounted on the PCB base though a surface mount technology, which ensures position tolerance and precision of the reed switch, implements full mechanization of product production, increases productivity, and satisfies requirements of mass production, thereby increasing economic benefits.

    Abstract translation: 簧片开关继电器包括PCB基座（1）和电连接到PCB基座的控制组件（2）。 控制组件通过表面贴装技术安装在PCB基座上。 控制组件包括安装在PCB基座上的中空线圈（21），安装在中空线圈中的舌簧开关（22）和套在中空线圈外表面上的屏蔽层（23），舌簧开关包括销， 屏蔽层与舌簧开关的引脚连接。 在簧片继电器中，控制组件通过表面贴装技术安装在PCB基座上，确保了簧片开关的位置公差和精度，实现产品生产的全面机械化，提高生产率，满足批量生产要求，从而增加 经济效益

    SHIELDED MULTI-STAGE EMI NOISE FILTER
    76.
    发明申请
    SHIELDED MULTI-STAGE EMI NOISE FILTER 有权
    屏蔽多级EMI噪声滤波器

    公开(公告)号：US20150229288A1

    公开(公告)日：2015-08-13

    申请号：US14180119

    申请日：2014-02-13

    Applicant: UT-Battelle, LLC

    Inventor： Roger Allen Kisner ,  David Lee Fugate

    IPC: H03H7/01

    CPC classification number: H03H1/0007 ,  H03H7/0115 ,  H03H2001/0021 ,  H03H2001/0028 ,  H05K1/0209 ,  H05K1/0233 ,  H05K3/0061 ,  H05K2201/09972 ,  H05K2201/1006 ,  H05K2201/10219

    Abstract: Electromagnetic interference (EMI) noise filter embodiments and methods for filtering are provided herein. EMI noise filters include multiple signal exclusion enclosures. The multiple signal exclusion enclosures contain filter circuit stages. The signal exclusion enclosures can attenuate noise generated external to the enclosures and/or isolate noise currents generated by the corresponding filter circuits within the enclosures. In certain embodiments, an output of one filter circuit stage is connected to an input of the next filter circuit stage. The multiple signal exclusion enclosures can be chambers formed using conductive partitions to divide an outer signal exclusion enclosure. EMI noise filters can also include mechanisms to maintain the components of the filter circuit stages at a consistent temperature. For example, a metal base plate can distribute heat among filter components, and an insulating material can be positioned inside signal exclusion enclosures.

    Abstract translation: 本文提供电磁干扰（EMI）噪声滤波器实施例和滤波方法。 EMI噪声滤波器包括多个信号排除外壳。 多信号排除外壳包含滤波电路级。 信号排除外壳可以衰减外壳产生的噪声和/或隔离由外壳内的相应的滤波器电路产生的噪声电流。 在某些实施例中，一个滤波器电路级的输出连接到下一个滤波器电路级的输入端。 多个信号排除外壳可以是使用导电隔板形成的腔室，以分隔外部信号排除罩。 EMI噪声滤波器还可以包括将滤波器电路的部件级保持在恒定温度的机构。 例如，金属基板可以在过滤器部件之间分配热量，并且绝缘材料可以位于信号排除外壳内。

    System for thermal control of red LED(s) chips
    77.
    发明授权
    System for thermal control of red LED(s) chips 有权
    红色LED芯片的热控制系统

    公开(公告)号：US09035331B2

    公开(公告)日：2015-05-19

    申请号：US13711818

    申请日：2012-12-12

    Applicant: GE Lighting Solutions, LLC

    Inventor： Glenn Howard Kuenzler

    IPC: H01L29/18 ,  H01L33/00 ,  H01L27/15 ,  H05B33/08 ,  H05K1/02 ,  F21Y111/00 ,  F21Y113/00 ,  H05K1/18

    CPC classification number: H01L27/15 ,  F21V29/54 ,  F21Y2107/60 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0872 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: A light emitting diode assembly includes a first light emitting diode disposed on a first substrate and a second light emitting diode disposed on a second substrate that is disposed substantially adjacent to the first substrate. The second light emitting diode has a higher rate of performance degradation over time due to temperature than the first light emitting diode. A heat sink is thermally coupled to the first substrate and an electrical cooling circuit is thermally coupled to the second substrate. The electrical cooling circuit is configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.

    Abstract translation: 发光二极管组件包括设置在第一衬底上的第一发光二极管和设置在基本上邻近于第一衬底的第二衬底上的第二发光二极管。 第二发光二极管由于温度而比第一发光二极管具有更高的性能劣化速度。 散热器热耦合到第一衬底，并且电冷却回路热耦合到第二衬底。 电冷却回路构造成当电冷却回路被通电时，减小第二基板的温度。

    SYSTEM FOR THERMAL CONTROL OF RED LED(S) CHIPS
    78.
    发明申请
    SYSTEM FOR THERMAL CONTROL OF RED LED(S) CHIPS 有权
    红色LED（S）灯的热控制系统

    公开(公告)号：US20140159077A1

    公开(公告)日：2014-06-12

    申请号：US13711818

    申请日：2012-12-12

    Applicant: GE LIGHTING SOLUTIONS, LLC

    Inventor： Glenn Howard KUENZLER

    IPC: H01L27/15

    CPC classification number: H01L27/15 ,  F21V29/54 ,  F21Y2107/60 ,  F21Y2113/13 ,  F21Y2115/10 ,  H05B33/0803 ,  H05B33/0872 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: A light emitting diode assembly includes a first light emitting diode disposed on a first substrate and a second light emitting diode disposed on a second substrate that is disposed substantially adjacent to the first substrate. The second light emitting diode has a higher rate of performance degradation over time due to temperature than the first light emitting diode. A heat sink is thermally coupled to the first substrate and an electrical cooling circuit is thermally coupled to the second substrate. The electrical cooling circuit is configured to reduce a temperature of the second substrate when the electrical cooling circuit is electrically energized.

    Abstract translation: 发光二极管组件包括设置在第一衬底上的第一发光二极管和设置在基本上邻近于第一衬底的第二衬底上的第二发光二极管。 第二发光二极管由于温度而比第一发光二极管具有更高的性能劣化速度。 散热器热耦合到第一衬底，并且电冷却回路热耦合到第二衬底。 电冷却回路构造成当电冷却回路被通电时，减小第二基板的温度。

    Thermoelectric conversion module and method for manufacturing the same
    79.
    发明授权
    Thermoelectric conversion module and method for manufacturing the same 有权
    热电转换模块及其制造方法

    公开(公告)号：US08575469B2

    公开(公告)日：2013-11-05

    申请号：US13252223

    申请日：2011-10-04

    Applicant: Yasuhiro Kawauchi ,  Takanori Nakamura

    Inventor： Yasuhiro Kawauchi ,  Takanori Nakamura

    IPC: H01L35/12

    CPC classification number: H01L35/32 ,  H01L35/34 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/10219

    Abstract: A compact, high-performance thermoelectric conversion module includes a laminate having a plurality of insulating layers, p-type thermoelectric semiconductors and n-type thermoelectric semiconductors formed by a technique for manufacturing a multilayer circuit board, particularly a technique for forming a via-conductor. Pairs of the p-type thermoelectric semiconductors and the n-type thermoelectric semiconductors are electrically connected to each other in series through p-n connection conductors to define thermoelectric conversion element pairs. The thermoelectric conversion element pairs are connected in series through, for example, series wiring conductors. The thermoelectric semiconductors each have a plurality of portions in which the peak temperatures of thermoelectric figures of merit are different from each other. These portions are distributed in the stacking direction of the laminate.

    Abstract translation: 小型高性能热电转换模块包括具有多个绝缘层，p型热电半导体和通过用于制造多层电路板的技术形成的n型热电半导体的层压体，特别是形成通孔导体的技术 。 p型热电半导体和n型热电半导体的对通过p-n连接导体串联电连接以限定热电转换元件对。 热电转换元件对通过例如串联布线导体串联连接。 热电半导体各自具有多个热电元件的峰值温度彼此不同的部分。 这些部分沿层叠体的层叠方向分布。

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