公开(公告)号：JP4141340B2

公开(公告)日：2008-08-27

申请号：JP2003197860

申请日：2003-07-16

Applicant: 三洋電機株式会社 ,  関東三洋セミコンダクターズ株式会社

Inventor： 清志 三田 ,  工次郎 亀山

IPC: H01L23/12 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/181 ,  H05K3/3426 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10772 ,  H05K2201/10931 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP2791951A4

公开(公告)日：2015-11-11

申请号：EP12858253

申请日：2012-12-10

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  WEBSTER ALAN P ,  JONES LONNIE G ,  RENNER GARRY L ,  BELL JEFFREY

IPC: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP2791951A1

公开(公告)日：2014-10-22

申请号：EP12858253.3

申请日：2012-12-10

Applicant: Kemet Electronics Corporation

Inventor： MCCONNELL, John, E. ,  WEBSTER, Alan, P. ,  JONES, Lonnie, G. ,  RENNER, Garry, L. ,  BELL, Jeffrey

IPC: H01G4/232 ,  H01G4/12

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP1628511B1

公开(公告)日：2009-03-25

申请号：EP05016596.8

申请日：2005-07-29

Applicant: Muck, Siegfried

Inventor： Muck, Siegfried

IPC: H05K3/36 ,  H01R9/03

CPC classification number: H05K3/363 ,  H01R4/024 ,  H01R12/592 ,  H01R12/721 ,  H01R12/777 ,  H05K3/3405 ,  H05K2201/062 ,  H05K2201/091 ,  H05K2201/1034 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10848

公开(公告)号：EP1758208A1

公开(公告)日：2007-02-28

申请号：EP06017087.5

申请日：2006-08-16

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Nakano, Hiroshi

IPC: H01R12/18

CPC classification number: H05K3/341 ,  H01R12/707 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  H05K2201/10969 ,  Y02P70/613

Abstract: An object of the present invention is to enable a reduction in bonding strength to a circuit board to be restrained while letting bubbles created in solder escape.
A circuit board connector 1 according to the present invention is provided with a connector housing 10, male terminals 20 and fixing members 30. Each fixing member 30 is formed by bending a metal flat plate into an L-shape, and comprised of a mounting portion 31 used to mount the fixing member 30 into the connector housing 10, and a bonding portion 32 to be soldered. The bonding portion 32 is formed with connecting pieces 33 by making substantially "gate"-shaped cuts in the bonding portion 32 to penetrate the bonding portion 32 and then bending parts enclosed by these cuts upward. A clearance S is defined between the bottom edge of the leading end of each connecting piece 33 and the hole wall of a corresponding through hole 34 facing this bottom edge. The clearances S communicate with the through holes 34 formed upon bending the connecting pieces 33. The lower surfaces of the connecting pieces 33 and the inner surfaces of the through holes 34 can be soldered.

Abstract translation: 本发明的一个目的是在焊接产生的气泡逸出的同时，能够抑制与电路板的接合强度的降低。 根据本发明的电路板连接器1设置有连接器壳体10，阳端子20和固定构件30.每个固定构件30通过将金属平板弯曲成L形而形成，并且包括安装部分 31用于将固定构件30安装到连接器壳体10中，以及接合部32被焊接。 接合部32通过在接合部32中形成大致“门”状切口而形成有连接片33，以穿透接合部32，然后将由这些切口包围的部分向上弯曲。 在每个连接件33的前端的底部边缘与面向该底部边缘的对应的通孔34的孔壁之间限定间隙S. 间隙S与弯曲连接片33时形成的通孔34连通。连接件33的下表面和通孔34的内表面可被焊接。

公开(公告)号：EP1044082B1

公开(公告)日：2003-04-23

申请号：EP98956935.5

申请日：1998-11-19

Applicant: Leica Geosystems AG

Inventor： REMY DE GRAFFENRIED, Christian

IPC: B23K1/005

CPC classification number: B23K1/0056 ,  B23K2201/40 ,  G02B6/4238 ,  G02B7/00 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0373 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/101 ,  Y02P70/613 ,  Y10T29/4913

公开(公告)号：EP0783775B1

公开(公告)日：2000-05-03

申请号：EP95937430.7

申请日：1995-09-28

Applicant: NORTH AMERICAN SPECIALITIES CORPORATION

Inventor： SEIDLER, Jack ,  POLLOCK, Leonard, J.

IPC: H01R12/04 ,  H01R12/32

CPC classification number: H01R12/57 ,  H01R4/02 ,  H01R43/0256 ,  H05K3/3405 ,  H05K3/3426 ,  H05K3/3478 ,  H05K2201/10386 ,  H05K2201/10772 ,  H05K2201/10984 ,  Y02P70/613

Abstract: A solder-bearing metallic (114), and methods of fabricating and using it, where the lead is formed with a solder-retaining portion (125) having a cross-sectional profile with undercuts, which may be in a V-shape or flat, where solder (133) surrounds said solder-retaining portion and undercuts, and extends outwardly from the lead while leaving a portion of the lead uncovered by solder to permit the lead metal to form direct contact with a susbstrate or other conductive pad.

公开(公告)号：US08379402B2

公开(公告)日：2013-02-19

申请号：US12633443

申请日：2009-12-08

Applicant: Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

Inventor： Kazuhiro Oshima ,  Yoshikazu Hirabayashi ,  Shigeo Nakajima ,  Yoshitaka Matsushita

IPC: H01R9/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  H05K2201/10318 ,  H05K2201/10772 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wiring board having a lead pin is provided. The wiring board having the lead pin includes a connecting pad which is formed on the wiring board, and to which the lead pin is bonded through a conductive material. The lead pin includes: a shaft portion; a head portion which is provided on one end of the shaft portion; a protruded portion which is formed on a surface side of the head portion opposed to the connection pad; and a first taper portion which is formed between the head portion and a base part of the shaft portion.

Abstract translation: 提供具有引脚的布线板。 具有引线销的布线板包括形成在布线板上的连接焊盘，引导销通过导电材料接合到该连接焊盘。 引导销包括：轴部; 头部，其设置在所述轴部的一端; 形成在所述头部的与所述连接垫相对的表面侧的突出部; 以及形成在所述头部与所述轴部的基部之间的第一锥形部。

公开(公告)号：US20100000761A1

公开(公告)日：2010-01-07

申请号：US12232316

申请日：2008-09-15

Applicant: Hueng Jae Oh ,  Jin Won Choi

Inventor： Hueng Jae Oh ,  Jin Won Choi

IPC: H01B5/00

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

Abstract: Provided is a lead pin for package boards including a disk-shaped head of which the diameter increases toward the middle portion thereof and that has a hexagonal vertical cross-sectional shape; and a connection pin that is formed so as to project from the center of the upper surface of the head.

Abstract translation: 提供一种用于封装板的引脚，包括直径朝向其中间部分增加的圆盘形头部，并且具有六边形垂直横截面形状; 以及形成为从头部的上表面的中心突出的连接销。

公开(公告)号：US20090250824A1

公开(公告)日：2009-10-08

申请号：US12098311

申请日：2008-04-04

Applicant: Xiwang Qi ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy ,  Isao Yamada

Inventor： Xiwang Qi ,  Charan K. Gurumurthy ,  Tamil Selvy Selvamuniandy ,  Isao Yamada

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H05K3/3426 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/15312 ,  H05K2201/10318 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor package comprises a substrate that utilizes one or more pins to form external interconnects. The pins are bonded to bonding pads on the substrate by solder. The pins may each has a pin head that may have a bonding surface, wherein the bonding surface may comprises a center portion and a side portion that is tapered away relative to the center portion. In some embodiments, the bonding surface may comprise a round shape. In some embodiments, a gas escape path may be provided by the shape of the bonding surface to increase pin pull strength and/or solder strength. The package may further comprise a surface finish that may comprise a palladium layer with a reduced thickness to reduce the amount of palladium based IMC precipitation into the solder.

Abstract translation: 半导体封装包括利用一个或多个引脚形成外部互连的基板。 引脚通过焊料与基板上的焊盘接合。 销可以各自具有可以具有接合表面的销头，其中接合表面可以包括中心部分和相对于中心部分逐渐变细的侧部部分。 在一些实施例中，接合表面可以包括圆形。 在一些实施例中，可以通过接合表面的形状提供气体逸出路径，以增加引脚拉伸强度和/或焊接强度。 该封装还可以包括表面光洁度，其可以包括具有减小厚度的钯层，以减少基于钯的IMC沉淀到焊料中的量。