公开(公告)号：WO99044260A1

公开(公告)日：1999-09-02

申请号：PCT/IB1999/000324

申请日：1999-02-23

IPC: H01R12/52 ,  H01R43/16 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: H05K3/366 ,  H01R12/52 ,  H01R43/16 ,  H05K3/3447 ,  H05K2201/10424 ,  H05K2201/10878

Abstract: A contact strip for the electrical and mechanical connection of two mutually perpendicular circuit boards (1, 2) consists of an insulating receiving member in the form of a strip (3) and a plurality of contact elements (8) with a respective transition zone (9) extending in the strip (3). Two contact zones (10, 10') adjoin the transition zone (9) for electrical connection to a first and a second circuit board (1, 2). The strip (3) is essentially an elongate plastic member (4) with a T-shaped cross section having a carrier web (7) and two identical transverse arms (5, 6). The plastic member (4) is arranged as a T at an angle bisecting the angle between the circuit boards (1, 2) extending perpendicularly to one another.

Abstract translation: 用于两个相互垂直的电路板（1,2）的电气和机械连接的接触条由条带（3）形式的绝缘接收构件和具有相应过渡区域的多个接触元件（8）组成 9）在条带（3）中延伸。 两个接触区域（10,10'）邻接过渡区域（9），用于与第一和第二电路板（1,2）电连接。 条带（3）基本上是细长的塑料构件（4），其T形横截面具有载体腹板（7）和两个相同的横向臂（5,6）。 塑料构件（4）以与将彼此垂直延伸的电路板（1,2）之间的角度相等的角度设置为T。

公开(公告)号：WO1996015458A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014844

申请日：1995-11-13

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R01/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07371 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/32 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05166 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45111 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/456 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/2407 ,  H01R13/2464 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/01013 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075

Abstract: A probe card assembly (500) includes a probe card (502), a space transformer (506) having resilient contact structures (probe elements) (524) mounted directly to and extending from terminals (522) on a surface thereof, and an interposer (504) disposed between the space transformer (506) and the probe card (502). The space transformer (506) and interposer are "stacked up" so that the orientation of the space transformer (506), hence the orientation of the tips of the probe elements (524), can be adjusted without changing the orientation of the probe card. Suitable mechanisms (532, 536, 538, 546) for adjusting the orientation of the space transformer (506), and for determining what adjustments to make, are disclosed. Multiple die sites on a semiconductor wafer (508) are readily probed using the disclosed techniques, and the probe elements (524) can be arranged to optimize probing of an entire wafer (508). Composite interconnection elements (200) having a relatively soft core (206) covercoated by a relatively hard shell (218, 220) as the resilient contact structures are described.

Abstract translation: 探针卡组件（500）包括探针卡（502），具有弹性接触结构（探针元件）（524）的空间变换器（506），其直接安装在其表面上并从端子（522）延伸， （504），设置在所述空间变压器（506）和所述探针卡（502）之间。 空间变换器（506）和插入器被“堆叠”，使得可以调节空间变换器（506）的取向，从而可以调节探针元件（524）的尖端的取向而不改变探针卡的取向 。 公开了用于调整空间变换器（506）的取向并用于确定要做出什么调整的适当的机构（532,536,538,546）。 使用所公开的技术容易地探测半导体晶片（508）上的多个裸片位置，并且可以布置探针元件（524）以优化整个晶片（508）的探测。 描述具有由相对较硬的外壳（218,220）作为弹性接触结构覆盖的相对软的芯（206）的复合互连元件（200）。

公开(公告)号：WO2016037432A1

公开(公告)日：2016-03-17

申请号：PCT/CN2014/093781

申请日：2014-12-13

Applicant: 深圳TCL新技术有限公司

Inventor： 林杰 ,  强科文 ,  钟燮和

IPC: F21V29/70 ,  F21V29/80 ,  F21V23/00 ,  F21Y101/02

CPC classification number: F21V29/70 ,  F21V19/0025 ,  F21V23/00 ,  F21V29/80 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/0085 ,  H05K1/0203 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10598 ,  H05K2201/10878

Abstract: 一种LED模组及显示器，LED模组包括LED灯（10）、散热器（20）以及PCB板（30），LED灯包括LED主体（11）以及设于LED主体上的导热块（12）和管脚（13），导热块设于LED主体的面向PCB板的底面（111）上，管脚的自由端贯通PCB板并与PCB板的焊盘（311）电连接，散热器夹持于导热块与PCB板之间，导热块抵触在散热器上。LED模组通过将散热器夹持于LED灯的导热块与PCB板之间，使得导热块紧贴在散热器上，从而使LED灯在工作时所产生的热量能直接通过导热块传导到散热器上进行散热，从而提高LED灯的散热效果。

公开(公告)号：WO2014058577A1

公开(公告)日：2014-04-17

申请号：PCT/US2013/060258

申请日：2013-09-18

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： TROUT, David Allison

IPC: H01R12/58 ,  H05K3/30

CPC classification number: H01R4/26 ,  H01R12/585 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An eye-of-the needle (EON) pin contact (32) is configured to be received within an electrical via (34) that includes conductive material (42). The EON pin contact comprises a compliant segment (60) including two opposing spring arms (64, 66) and an opening defined between the spring arms, the compliant segment being configured to be received within the electrical via such that the spring arms engage the conductive material. A tip segment (62) extending from the compliant segment is configured to be received into the electrical via before the compliant segment is received into the electrical via. The tip segment comprises broaches (82a, 82b) that are configured to displace the conductive material as the tip segment is received into the electrical via so as to plow respective paths (104a, 104b) through the conductive material for reception of the spring arms.

Abstract translation: 针眼（EON）针式触头（32）被配置为被接纳在包括导电材料（42）的电通路（34）内。 EON针接触件包括柔性部分（60），包括两个相对的弹簧臂（64,66）和限定在弹簧臂之间的开口，柔性部分构造成容纳在电通孔内，使得弹簧臂接合导电 材料。 从柔性段延伸的尖端段（62）被构造成在柔性段被接收到电通路内之前被接收到电通路中。 尖端部分包括拉头（82a，82b），其被配置成当尖端部分被接收到电通孔中时移动导电材料，以便通过用于接收弹簧臂的导电材料犁下相应的路径（104a，104b）。

公开(公告)号：WO2012069928A1

公开(公告)日：2012-05-31

申请号：PCT/IB2011/003125

申请日：2011-11-23

Applicant: FCI ,  DROESBEKE, Gert ,  YAHYA, Ould

Inventor： DROESBEKE, Gert ,  YAHYA, Ould

IPC: H05K3/30 ,  H05K3/32

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/1078 ,  H05K2201/1084 ,  H05K2201/10878

Abstract: The present invention relates to a connector assembly comprising : a printed circuit board (PCB) having a through- hole; a connector mounted on a first surface of the PCB and having a mounting peg received in the through- hole. The connector assembly further comprises a locking member cooperating with the mounting peg thereby increasing the retention force of the peg in the through-hole.

Abstract translation: 本发明涉及一种连接器组件，包括：具有通孔的印刷电路板（PCB）; 连接器，其安装在PCB的第一表面上，并且具有容纳在通孔中的安装钉。 连接器组件还包括与安装钉配合的锁定构件，从而增加了钉在通孔中的保持力。

公开(公告)号：WO2006111421A1

公开(公告)日：2006-10-26

申请号：PCT/EP2006/003755

申请日：2006-04-24

Applicant: DBK DAVID + BAADER GMBH ,  GSCHWIND, Thomas ,  BAUER, Hans-Peter

Inventor： GSCHWIND, Thomas ,  BAUER, Hans-Peter

IPC: H01H85/10

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H85/10 ,  H01H2085/0275 ,  H01H2085/0555 ,  H05K3/308 ,  H05K2201/10181 ,  H05K2201/10878 ,  H05K2201/10909

Abstract: Eine Schmelzsicherung für Leiterplattenmontage besitzt Anschlüsse, die mit Leiterbahnen auf der Leiterplatte elektrisch verbindbar sind, sowie mindestens eine leitfähige und schmelzbare Verbindung zwischen den Anschlüssen. Sie ist so gestaltet, dass sie kostengünstig einstückig aus Blech oder leitfähigem Kunststoff gefertigt werden kann. Die Schmelzsicherung kann eine Überhitzung einer Heizvorrichtung, in der sie eingesetzt wird, verhindern, indem sie angepasst ist, die mindestens eine leitfähige und schmelzbare Verbindung bei thermischer Überlast zu trennen.

Abstract translation: 一种用于电路板组件保险丝具有电连接到电路迹线在印刷电路板上的端子，和至少一个导电可熔链路和端子之间。 它被设计成使得它可以在由金属板或导电塑料单件被廉价地制造。 熔丝可以防止在其被使用由适于以分离至少一个导电可熔链路和下热过载的加热器的过热。

公开(公告)号：WO98050954A1

公开(公告)日：1998-11-12

申请号：PCT/US1998/009442

申请日：1998-05-08

IPC: B23K20/00 ,  C25D7/12 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D7/12 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00014

Abstract: High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices (402, 404, 406, 408) atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements (422, 424, 426, 428) extend from the bottommost one of the semiconductor devices, and from the exposed edge portions of the semiconductor devices stacked atop the bottommost semiconductor device. Free-ends of the elongate interconnection elements make electrical contact with terminals of an interconnection substrate (430), such as a PCB. The elongate interconnection elements extending from each of the semiconductor devices are sized so as to reach the terminals of the PCB, which may be plated through holes (432, 434, 436, 438). The elongate interconnection elements are suitably resilient contact structures, and may be composite interconnection elements comprising a relatively soft core (e.g., a gold wire) and a relatively hard overcoat (e.g., a nickel plating).

Abstract translation: 通过将半导体器件（402,404,406,408）彼此顶起堆叠来实现半导体器件在互连衬底上的高密度封装，使得半导体器件的边缘部分延伸超过其顶部堆叠的半导体器件。 细长的互连元件（422,424,426,428）从半导体器件的最底端延伸，并且从半导体器件的暴露的边缘部分堆叠在最底层的半导体器件的顶部。 细长互连元件的自由端与诸如PCB的互连衬底（430）的端子电接触。 从每个半导体器件延伸的细长互连元件的尺寸被设计成到达可以通过孔（432,434,436,438）电镀的PCB的端子。 细长互连元件是合适的弹性接触结构，并且可以是包括相对软的芯（例如，金线）和相对硬的外涂层（例如镀镍）的复合互连元件。

公开(公告)号：WO1998018168A1

公开(公告)日：1998-04-30

申请号：PCT/JP1997003834

申请日：1997-10-22

Applicant: ROHM CO., LTD. ,  SANO, Masashi ,  BAMBA, Yasue ,  SUZUKI, Shinichi ,  NAKAI, Kenichi

Inventor： ROHM CO., LTD.

IPC: H01L31/12

CPC classification number: H01L31/167 ,  H05K3/308 ,  H05K2201/10757 ,  H05K2201/10878

Abstract: A light emitting device (1) and a photodetector (2) face each other with a space therebetween in such a way that the light emitting device (1) emits light and the photodetector (2) receives the light. They are fixed with a package made of an opaque material. The leads of the light emitting device and the photodetector are led out of the bottom surface (A) of the package (3), inserted into the through-holes of a substrate and soldered. Axial movement preventive bent parts (11g and 21g) which have at least 1st bending points at the positions on the leads apart from the bottom surface of the package by a distance smaller than the thickness of the substrate are formed. As a result, when the leads of the photointerruptor are inserted into, e.g., a printed board and soldered, no inclination nor misalignment occurs.

Abstract translation: 发光器件（1）和光电检测器（2）以这样的方式彼此面对，使得发光器件（1）发光并且光电检测器（2）接收光。 它们用不透明材料制成的包装件固定。 将发光器件和光电检测器的引线从插入到基板的通孔中的封装（3）的底表面（A）引出并进行焊接。 形成了轴向运动防止弯曲部分（11g和21g），其在从包装的底表面离开的位置处的至少第一弯曲点距离小于衬底厚度的距离。 结果，当光中断器的引线插入例如印刷电路板并焊接时，不会发生倾斜或不对准。

公开(公告)号：WO1996037331A1

公开(公告)日：1996-11-28

申请号：PCT/US1996007924

申请日：1996-05-24

Applicant: FORMFACTOR, INC. ,  ELDRIDGE, Benjamin, N. ,  MATHIEU, Gaetan, L.

Inventor： FORMFACTOR, INC.

IPC: B23K09/067

CPC classification number: H05K3/4015 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07314 ,  G01R1/07357 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  Y02P70/611 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/81205

Abstract: The efficacy of electrical discharges for severing bond wires (102, 202) and/or for forming balls (234, 236) at the ends of bond wires (including bond wires (202) already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light (130). A "spark gap" is formed between an EFO electrode (118, 232) and the wire (102, 202), one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light (130) is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Abstract translation: 在接合线（包括已经被替代机制切断的接合线（202））的端部处用于切断接合线（102,202）和/或形成球（234,236）的放电的功效通过执行电 在有紫外光的情况下放电（130）。 在EFO电极（118,232）和线（102,202）之间形成“火花隙”，其中一个用作火花隙的阴极。 优选地，紫外线（130）指向用作火花隙的阴极的元件。 在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。 这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

公开(公告)号：WO1996015459A1

公开(公告)日：1996-05-23

申请号：PCT/US1995014885

申请日：1995-11-15

Applicant: FORMFACTOR, INC.

Inventor： FORMFACTOR, INC. ,  KHANDROS, Igor, Y. ,  MATHIEU, Gaetan, L. ,  ELDRIDGE, Benjamin, N. ,  GRUBE, Gary, W.

IPC: G01R01/073

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/0483 ,  G01R31/2863 ,  H01L21/288 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/67138 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45644 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/48744 ,  H01L2924/20751 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

Abstract: Resilient contact structures (430) are mounted directly to bond pads (410) on semiconductor dies (402a, 402b), prior to the dies (402a, 402b) being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies (402a, 402b) to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies (702, 704) with a circuit board (710) or the like having a plurality of terminals (712) disposed on a surface thereof. Subsequently, the semiconductor dies (402a, 402b) may be singulated from the semiconductor wafer, whereupon the same resilient contact structures (430) can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements (430) of the present invention as the resilient contact structures, burn-in (792) can be performed at temperatures of at least 150 DEG C, and can be completed in less than 60 minutes.

Abstract translation: 在将模具（402a，402b）与半导体晶片分离（分离）之前，将弹性接触结构（430）直接安装在半导体管芯（402a，402b）上的接合焊盘（410）上。 这使得半导体管芯（402a，402b）能够通过用具有多个端子的电路板（710）等连接到半导体管芯（702,704）来实现（例如，测试和/或烧入）半导体管芯（402a，402b） （712）设置在其表面上。 随后，半导体管芯（402a，402b）可以从半导体晶片分离，于是可以使用相同的弹性接触结构（430）来实现半导体管芯和其它电子部件（例如布线基板，半导体封装， 等等。）。 使用本发明的全金属复合互连元件（430）作为弹性接触结构，老化（792）可以在至少150℃的温度下进行，并且可以在少于60分钟内完成。