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公开(公告)号：WO1988009599A2
公开(公告)日：1988-12-01
申请号：PCT/US1988001668
申请日：1988-05-16
Applicant: CRAY RESEARCH, INC.
Inventor： CRAY RESEARCH, INC. , CRAY, Seymour, R. , KRAJEWSKY, Nicholas, J.
IPC: H05K03/32
CPC classification number: H01L24/11 , H01L21/4853 , H01L2224/05644 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2224/4943 , H01L2224/78301 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/14 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/368 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , Y10T29/49135 , Y10T29/4914 , Y10T29/49153 , H01L2924/00 , H01L2224/29099 , H01L2224/48
Abstract: A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).
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公开(公告)号：WO8705547A3
公开(公告)日：1988-04-07
申请号：PCT/US8700530
申请日：1987-03-11
Applicant: RAYCHEM CORP
Inventor： NOEL RAYMOND , ROBINSON WILLIAM M , CHERLAN GABE , CLIFFORD THOMAS H , CARLOMAGNO WILLIAM D , DEASY WILLIAM M , GRASSAUER WILLIE K , HAYGOOD DAVID K , SHERLOCK H PAUL , WHITE HARRY E
CPC classification number: H05K3/3478 , B23K3/06 , H05K3/3473 , H05K3/3484 , H05K2201/0125 , H05K2201/10424 , H05K2201/10727 , H05K2201/10946 , H05K2203/0113 , H05K2203/0235 , H05K2203/0338 , H05K2203/041 , H05K2203/0415 , H05K2203/0726
Abstract: Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.
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公开(公告)号：KR1020160035490A
公开(公告)日：2016-03-31
申请号：KR1020140127164
申请日：2014-09-23
Applicant: 삼성전기주식회사
CPC classification number: H01G4/30 , H01G2/065 , H01G4/0085 , H01G4/1227 , H05K3/3442 , H05K2201/10015 , H05K2201/10946 , H05K2201/2045 , Y02P70/613
Abstract: 본발명은, 폭방향으로적층되며단부에리드부를가지는내부전극과, 세라믹본체의길이방향의측면중 일부에상기내부전극의리드부와접속되도록배치된외부전극을포함하는세라믹본체와상기세라믹본체의양 단부에결합되는단자전극을포함하며, 상기단자전극은상기세라믹본체의하측에배치되는수평부와, 상기세라믹본체의길이방향의측면으로부터이격되며상기외부전극과접속되도록배치되는수직부를포함하는적층세라믹커패시터및 그실장기판을제공한다.
Abstract translation: 提供多层陶瓷电容器和具有该多层陶瓷电容器的电路板。 多层陶瓷电容器包括：陶瓷体，其包括在宽度方向上层叠的内部电极，并且具有暴露于其端面的引出部分，以及设置在陶瓷体的端面部分上的外部电极， 内部电极的出口部分; 以及与陶瓷体的两端部连接的端子电极，其中端子电极包括布置在陶瓷体下方的水平部分和与陶瓷体的端面间隔开并连接到外部电极的垂直部分。
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公开(公告)号：KR101365956B1
公开(公告)日：2014-02-21
申请号：KR1020107006199
申请日：2008-08-22
Applicant: 시티에스 코포레이션
Inventor： 맥락켄제프리
CPC classification number: H03L1/04 , H03L1/028 , H05K1/0206 , H05K1/0212 , H05K1/141 , H05K3/305 , H05K2201/09036 , H05K2201/10068 , H05K2201/10151 , H05K2201/10166 , H05K2201/10462 , H05K2201/10545 , H05K2201/10946
Abstract: 오븐 발진기 패키지는 적어도 회로 기판의 대향 측면들 상에 장착된 히터 및 결정 패키지를 포함한다. 비아가 히터로부터 결정 패키지로 열을 전달하기 위해 회로 기판의 본체를 통해 연장된다. 열 전도성 재료의 층이 회로 기판의 본체를 통해 연장되고, 회로 기판 및 그 상부에 장착된 다른 요소 전체에 걸쳐 열을 확산시키기 위해 비아와 열 결합 관계에 있다.
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75.发明公开
公开(公告)号：KR1020040090899A
公开(公告)日：2004-10-27
申请号：KR1020040026103
申请日：2004-04-16
Applicant: 알프스 덴키 가부시키가이샤
IPC: H05K9/00
CPC classification number: H05K1/141 , H01R12/52 , H05K1/0218 , H05K3/3426 , H05K3/445 , H05K2201/10189 , H05K2201/10757 , H05K2201/10946
Abstract: PURPOSE: An electronic circuit unit is provided to achieve improved soldering reliability and shield effect between the electronic circuit unit and a mother board. CONSTITUTION: An electronic circuit unit comprises a circuit board(1) having an upper surface on which electronic components are mounted so as to form a desired electric circuit and a lower surface having a plurality of first land portions(3) connected to the electric circuit; and a connector member(4) arranged in a lower portion of the circuit board. The connector member has an insulating resin portion(4a), a metallic shield plate(5) buried in the insulating resin portion, and a connector terminal(6) having a first terminal portion(6a) exposed and protruded from an upper surface of the insulating resin portion and a second terminal(6c) exposed and protruded from a lower surface of the insulating resin portion. The first terminal portion protruded from the upper surface of the connector terminal is electrically connected to the first land portions and the second terminal portion protruded from the lower surface is electrically connected to second land portions(11) of a mother board(10).
Abstract translation: 目的：提供电子电路单元，以实现电子电路单元和母板之间的焊接可靠性和屏蔽效果的改善。 构成：电子电路单元包括电路板（1），电路板（1）具有安装有电子部件的上表面以形成所需的电路，下表面具有连接到电路的多个第一接地部（3） ; 以及布置在电路板的下部的连接器构件（4）。 连接器构件具有绝缘树脂部分（4a），埋在绝缘树脂部分中的金属屏蔽板（5）和连接器端子（6），其具有从第一端子部分（6a）的上表面露出并突出的第一端子部分 绝缘树脂部分和从绝缘树脂部分的下表面暴露和突出的第二端子（6c）。 从连接器端子的上表面突出的第一端子部分电连接到第一接地部分，并且从下表面突出的第二端子部分电连接到母板（10）的第二接地部分（11）。
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Patent Agency Ranking
公开(公告)号：KR100430208B1
公开(公告)日：2004-05-03
申请号：KR1020017006673
申请日：1999-12-02
Applicant: 폼팩터, 인크.
IPC: G01R1/073
CPC classification number: B23K20/004 , B23K2201/40 , G01R1/06711 , G01R1/06716 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/13099 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2924/0001 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01046 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/141 , H05K3/20 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , H01L2924/00
Abstract: A probe card (321) is provided for contacting an electronic component with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer (310) with resilient contact elements (301), such as springs. A probe card (321) is designed to have terminals to mate with the contact elements on the wafer (310). In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer (324) is prepared with contact posts on one side and terminals on the opposing side. An interposer (325) with spring contacts (333, 334) connects a contact (335) on the opposing side of the space transformer (324) to a corresponding terminal (332) on a probe card (321), which terminal (332) is in turn connected to a terminal (331) which is connectable to a test device such as a conventional tester.
Abstract translation: 探针卡（321）被设置用于使具有凸起的接触元件的电子部件接触。 特别地，本发明可用于使半导体晶片（310）与诸如弹簧的弹性接触元件（301）接触。 探针卡（321）被设计成具有与晶片（310）上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器（324）准备有一侧的接触柱和另一侧的端子。 具有弹簧触点（333,334）的内插器（325）将空间变换器（324）的相对侧上的触点（335）连接到探针卡（321）上的相应端子（332），该端子（332） 又连接到可连接到诸如传统测试器的测试装置的终端（331）。 ＆lt;图像＆GT;
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公开(公告)号：KR1020160051308A
公开(公告)日：2016-05-11
申请号：KR1020140151096
申请日：2014-11-03
Applicant: 삼성전기주식회사
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H05K1/111 , H05K1/181 , H05K3/3426 , H05K2201/0311 , H05K2201/10015 , H05K2201/10757 , H05K2201/10946 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: 본발명은, 세라믹본체의실장면에서로이격되게배치되는제1 및제2 외부전극을포함하는적층세라믹커패시터; 및상기제1 및제2 외부전극의하면에배치되는상부수평부, 상기상부수평부에서하측으로이격되게배치되는하부수평부및 상기상부수평부와상기하부수평부를연결하는연결부를각각포함하며, 상기연결부는상하방향을따라상기세라믹본체의길이방향의양 측면을향해번갈아개방되는복수의스페이스부를가지는제1 및제2 단자전극; 을포함하는적층세라믹전자부품을제공한다.
Abstract translation: 本发明提供了具有减小的声音噪声的多层陶瓷电子部件及其安装基板。 多层陶瓷电子部件包括：多层陶瓷电容器，包括在陶瓷主体的安装表面上彼此分离的第一和第二外部电极; 以及第一和第二端子电极，包括布置在第一和第二外部电极的下表面中的上部水平单元，布置成与上部水平单元分离成下侧的下部水平单元，以及用于连接上部 和较低的水平单位。 连接单元具有沿着垂直方向在陶瓷主体的长度方向上朝向两侧交替打开的多个空间单元。
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公开(公告)号：KR101607020B1
公开(公告)日：2016-04-11
申请号：KR1020140144355
申请日：2014-10-23
Applicant: 삼성전기주식회사
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/224 , H01G4/232 , H05K1/111 , H05K1/181 , H05K3/3426 , H05K2201/0311 , H05K2201/10015 , H05K2201/10757 , H05K2201/10946 , H05K2201/2045 , Y02P70/611 , Y02P70/613
Abstract: 본발명은, 세라믹본체의실장면에서로이격되게배치되는제1 및제2 외부전극을포함하는적층세라믹커패시터; 및상기제1 및제2 외부전극의하면에배치되는상부수평부, 상기상부수평부에서하측으로이격되게배치되는하부수평부및 상기상부수평부의일 단부와상기하부수평부의일 단부를연결하는곡면의수직부를각각포함하며, 상기적층세라믹커패시터의실장면에 '⊂' 및 '⊃'자형상으로서로마주보게배치되는제1 및제2 단자전극; 를포함하는적층세라믹전자부품및 그실장기판을제공한다.
Abstract translation: 提供了一种堆叠的陶瓷电子部件及其安装基板。 叠层陶瓷电子部件包括：层叠陶瓷电容器，其包括在陶瓷体的安装表面上彼此间隔开的第一外部电极和第二外部电极; 以及在叠层陶瓷电容器的安装面上以“⊂”和“⊃”形状彼此面对设置的第一端子电极和第二端子电极，其中每个端子电极包括布置在第一和第二端子的底部上的上部水平部分 和第二外部电极，布置成从上部水平部分向下分离的底部水平部分和连接上部水平部分的一端和底部水平部分的一端的弯曲垂直部分。 根据本发明，提供了具有降低的声学噪声的层叠陶瓷电子部件及其安装基板。
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公开(公告)号：KR101537001B1
公开(公告)日：2015-07-15
申请号：KR1020130126556
申请日：2013-10-23
Applicant: 삼성에스디아이 주식회사
CPC classification number: H01M2/34 , H01M2/105 , H01M2/204 , H01M10/425 , H05K3/3426 , H05K3/4015 , H05K2201/0394 , H05K2201/10037 , H05K2201/1031 , H05K2201/10462 , H05K2201/10515 , H05K2201/1053 , H05K2201/10916 , H05K2201/10946 , Y02P70/611 , Y02P70/613
Abstract: 본발명의일 실시예에따른이차전지팩은복수의단위셀, 복수의단위셀의양극단자또는음극단자에전기적으로결합되며돌출부를포함하는연결탭, 연결탭에전기적으로결합되고돌출부를수용하는관통홀을포함하는연결플레이트및 연결플레이트에전기적으로결합되며결합홈이형성된보호회로모듈을포함하고, 연결플레이트는연결탭과마주보는보호회로모듈의제1 표면에위치되어결합홈과마주보도록설치된다.
Abstract translation: 根据本发明实施例的二次电池组包括：多个单元电池;电连接到多个单元电池的正极端子或负极端子并包括突起的连接片;电连接到连接片的连接片; 以及一保护电路模块，电性耦接至该连接板并包含一通孔，其中该连接板位于该保护电路模块的该第一表面上，面对该连接接头， 是的。
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公开(公告)号：KR1020140094425A
公开(公告)日：2014-07-30
申请号：KR1020130126556
申请日：2013-10-23
Applicant: 삼성에스디아이 주식회사
CPC classification number: H01M2/34 , H01M2/105 , H01M2/204 , H01M10/425 , H05K3/3426 , H05K3/4015 , H05K2201/0394 , H05K2201/10037 , H05K2201/1031 , H05K2201/10462 , H05K2201/10515 , H05K2201/1053 , H05K2201/10916 , H05K2201/10946 , Y02P70/611 , Y02P70/613
Abstract: A secondary battery pack according to one embodiment of the present invention includes a plurality of unit cells, a connection tab which is electrically connected to positive terminals or negative terminals of the unit cells and includes a protrusion part, a connection plate which is electrically combined with the connection tab and includes a through hole for receiving the protrusion part, and a protection circuit module which is electrically connected to the connection plate and includes a combination groove. The connection plate is located on a first surface of the protection circuit module facing the connection tab and faces the combination groove.
Abstract translation: 根据本发明的一个实施例的二次电池组包括多个单元电池，电连接到单元电池的正极端子或负极端子的连接接线片，并且包括突出部分，与 连接片，并且包括用于接收突出部的通孔，以及与连接板电连接并包括组合槽的保护电路模块。 连接板位于保护电路模块的面向连接接头并面向组合槽的第一表面上。
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