公开(公告)号：DE10234951A1

公开(公告)日：2004-02-12

申请号：DE10234951

申请日：2002-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  FRANKOWSKY GERD ,  VASQUEZ BARBARA

IPC: H01L21/60 ,  H01L21/68 ,  H01L21/98 ,  H01L23/538 ,  H01L21/58 ,  H01L25/065

Abstract: Production of a semiconductor module (31) comprises: (a) applying a structured connecting layer (11) on a supporting substrate; (b) applying active switching units (12) and/or passive switching units (13) with contact surfaces (12', 13') pointing to a transfer substrate on the structured connecting layer; (c) connecting the switching units with each other using a filler (14) between the units; (d) removing the transfer substrate; and (e) applying electrical connecting units (16) to selectively contact the contact surfaces of the switching units. An Independent claim is also included for a semiconductor module produced by the above process.

公开(公告)号：DE10223738A1

公开(公告)日：2003-12-18

申请号：DE10223738

申请日：2002-05-28

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  POHL JENS ,  IRSIGLER ROLAND

IPC: H01L21/98 ,  H01L23/31 ,  H01L23/485 ,  H01L25/065 ,  H01L21/60 ,  H01L23/50

Abstract: The second integrated circuit (C2) is mounted above the first integrated circuit (C1) in a housing (VK). The bottom of the housing is closed by a substrate (P) with contacts (PKF) at the bottom. Connectors (80) extend from the first integrated circuit to bonding pads (BP') on the substrate. The space between the first and second integrated circuits is filled with an adhesive material (300). Flexible contacts on the underside of the second integrated circuit touch flexible contacts on the upper side of the first integrated circuit.

公开(公告)号：DE10153609C2

公开(公告)日：2003-10-16

申请号：DE10153609

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BARBARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L23/538

公开(公告)号：DE10164800A1

公开(公告)日：2003-08-14

申请号：DE10164800

申请日：2001-11-02

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  FRANKOWSKY GERD ,  IRSIGLER ROLAND ,  VASQUEZ BABARA

IPC: H01L21/98 ,  H01L25/065 ,  H01L21/58 ,  H01L23/50

公开(公告)号：DE10239318A1

公开(公告)日：2003-04-17

申请号：DE10239318

申请日：2002-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  MEYER THORSTEN ,  RUCKMICH STEFAN ,  VASQUEZ BARBARA

IPC: H01L23/48 ,  H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/525 ,  H01L23/50

Abstract: A method for forming printed re-routing for wafer level packaging, especially chip size packaging. The method includes forming a contact layer on a semiconductor die, printing a conductive redistribution structure on the contact layer, and etching the contact layer of the die by using the conductive redistribution structure as a self-aligning mask.

公开(公告)号：DE10137346A1

公开(公告)日：2003-02-27

申请号：DE10137346

申请日：2001-07-31

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/50

Abstract: An insulating layer (6) is applied to the outer surface, except for in a contact pad region (4). At least one structured trench layer (8) is applied to the insulating layer and comprises at least one trench (10) corresponding to the path of a conductive track (18), and in contact with the contact pad (4). Solder is placed in the trench to form a conductive track. An Independent claim is also included for a method of manufacturing a chip device.

公开(公告)号：DE10135393A1

公开(公告)日：2003-02-27

申请号：DE10135393

申请日：2001-07-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HOEGERL JUERGEN ,  GEBAUER UTA ,  STRUTZ VOLKER ,  HEDLER HARRY

IPC: B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  H01L23/50 ,  H01L21/58

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

公开(公告)号：DE10130786C1

公开(公告)日：2003-02-13

申请号：DE10130786

申请日：2001-06-26

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H01L21/82 ,  H01L23/525

Abstract: Laser Programming of Integrated Circuits. The invention relates to the laser adjustment or laser programming of laser fuses of an integrated circuit on a chip, with laser light, the integrated circuit having a plurality of laser fuses and being connected to a plurality of contact pads on the chip, and the chip being covered with a polymer layer which has at least windows on the plurality of contact pads, and comprising at least one wiring interconnect on the polymer layer which is electrically connected to at least one of the plurality of contact pads and ends at a predetermined location on a surface of the chip. To make it possible for integrated circuits to be programmed with laser light as late as possible in the production process, according to the invention the chip is irradiated in a predetermined region with intensive laser light, so that in the wiring interconnect there is created an interconnect opening, in the polymer layer lying thereunder there is created a layer opening and at least one of the plurality of laser fuses is interrupted in the predetermined region.

公开(公告)号：DE10126296A1

公开(公告)日：2002-12-12

申请号：DE10126296

申请日：2001-05-30

Applicant: INFINEON TECHNOLOGIES AG

Inventor： VASQUEZ BARBARA ,  BRINTZINGER AXEL ,  HEDLER HARRY

IPC: H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50

Abstract: Production of an electronic component, especially a chip, mounted on a support comprises spraying or casting an elastic material using a spray or casting mold to form elastic material sections (6) which form a contact element which is coated with a conducting layer (7). An Independent claim is also included for the electronic component produced. Preferred Features: A metallized layer is further applied. A further elastic layer is applied using the spraying or casting step.

公开(公告)号：DE102006024213A1

公开(公告)日：2007-11-29

申请号：DE102006024213

申请日：2006-05-23

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SINGLETON LAURENCE EDWARD ,  HEDLER HARRY ,  IRSIGLER ROLAND

IPC: H05K3/34 ,  H01L21/60

Abstract: The method involves providing a chip (1) with a contact surface (2) and applying a contact bump (3) on the contact surface. A soldering material (6) is applied on the contact bump that is arranged as a stud-bump made of a material e.g. gold. The soldering material is formed by dipping the contact bump into a bath having a liquid soldering material. The soldering material is applied by a screen printing process on the contact bump.