公开(公告)号：EP1468042A2

公开(公告)日：2004-10-20

申请号：EP03731660.1

申请日：2003-01-23

Applicant: Jenoptik Automatisierungstechnik GmbH

Inventor： FEISTEL, Ulf ,  DIENER, Roland ,  WEINZIERL, Uwe

IPC: C08J9/00 ,  C09J5/08

CPC classification number: G02B6/4405 ,  G02B6/4226 ,  H05K1/0281 ,  H05K1/0289 ,  H05K3/4084 ,  H05K2201/0112 ,  H05K2201/057 ,  H05K2201/2009 ,  H05K2203/107 ,  H05K2203/1189

Abstract: The aim of the invention is to provide positioning and mounting options with improved handling characteristics even at places that are difficult to access or in other difficult conditions. Said aim is achieved by using functional elements comprising at least one area that can be foamed by supplying energy. At least one of said areas is used as a positioning element for positioning an object or for stiffening flexible or easily bendable materials in a shape-stabilizing manner.

公开(公告)号：EP1386689A1

公开(公告)日：2004-02-04

申请号：EP02708719.6

申请日：2002-03-29

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： KOBAYASHI, Nobutaka, Mitsubishi Denki K.K. ,  TAKENO, Shozui, Mitsubishi Denki K.K. ,  ITO, Kenji, Mitsubishi Denki Kabushiki Kaisha ,  MORIYASU, Masaharu, Mitsubishi Denki K.K.

IPC: B23K26/38 ,  B23K26/40 ,  H05K3/00

CPC classification number: B23K26/0622 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50 ,  H05K1/0366 ,  H05K3/0038 ,  H05K2201/0112 ,  H05K2203/111

Abstract: A method of the present invention is a method for processing a multilayer material, in which one or more conductor layers and insulating layers are layered, with a laser beam. The method includes the step of irradiating the conductor layer with a first laser beam to form a hole at a processing point in the conductor layer, and the step of irradiating the hole with a second laser beam to process the insulating layer, layered on the conductor layer. The second laser beam has a smaller beam diameter at the processing point than the first laser beam.

Abstract translation: 本发明的方法是一种用激光束层叠一个或多个导体层和绝缘层的多层材料的加工方法。 该方法包括以下步骤：用第一激光束照射导体层，以在导体层中的处理点处形成孔，以及用第二激光束照射孔以处理绝缘层，层叠在导体上的步骤 层。 第二激光束在处理点处具有比第一激光束更小的光束直径。

公开(公告)号：EP1219150B1

公开(公告)日：2003-03-05

申请号：EP00979397.7

申请日：2000-09-29

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： VAN PUYMBROECK, Jozef ,  HEERMAN, Marcel ,  DE STEUR, Hubert

IPC: H05K3/00 ,  B23K26/00

CPC classification number: H05K3/0038 ,  B23K26/40 ,  B23K2203/16 ,  B23K2203/30 ,  B23K2203/50 ,  H05K3/0055 ,  H05K2201/0112 ,  H05K2203/0195

Abstract: In order to laser drill laminates which comprise at least one metal layer and at least one dielectric layer made of an organic material, a frequency-doubled Nd vanadate laser is used that has the following parameters: pulse duration

公开(公告)号：EP1097806A3

公开(公告)日：2002-09-25

申请号：EP00309749.0

申请日：2000-11-03

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Gaku, Morio, c/o Mitsubishi Gas Chemical Co., Inc. ,  Ikeguchi, Nobuyuki, c/o Tokyo Works of Mitsubishi ,  Kato, Yoshihiro, c/o Tokyo Works of Mitsubishi ,  Yoshida, Taro, c/o Tokyo Works of Mitsubishi

IPC: B32B15/08 ,  H05K3/00 ,  B23K26/18

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/281 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/384 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/0346 ,  H05K2203/0353 ,  H05K2203/0723

Abstract: A copper-clad board suitable for making a hole with a carbon dioxide gas laser, which copper-clad board is obtained by disposing a double-side-treated copper foil (b) provided with a metallic-treatment layer (c) having a high absorption rate of a carbon dioxide gas laser energy on at least one surface, at least on an outer layer (t) of a thermosetting resin composition layer such that the metallic-treatment layer (c) is formed on a shiny surface of the copper foil (b) which shiny surface is to be a surface layer, and laminate-forming the double-side-treated copper foil (b) and the thermosetting resin composition layer (t) under heat and pressure, to make an alloy of the metallic-treatment layer and the copper by the above heating, a method of making hole in the above copper-clad board and a printed wiring board comprising the above copper-clad board.

公开(公告)号：EP0943392A2

公开(公告)日：1999-09-22

申请号：EP99302090.8

申请日：1999-03-18

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Gaku, Morio, c/o Mitsubishi Gas Chem. Co., Inc. ,  Ikeguchi, Nobuyuki, Mitsubishi Gas Chem. Co., Inc. ,  Tanaka, Yasuo, c/o Mitsubishi Gas Chem. Co., Inc. ,  Kato, Yoshihiro, Mitsubishi Gas Chem. Co., Inc.

IPC: B23K26/18

CPC classification number: H05K3/0038 ,  B23K26/18 ,  H05K1/0373 ,  H05K3/427 ,  H05K2201/0112 ,  H05K2201/0215 ,  H05K2201/0323 ,  H05K2203/1383

Abstract: A method of making a small-diameter through hole having high reliability with regard to a hole wall at a high rate with the energy of a high-output carbon dioxide gas laser without pre-making any hole in a copper foil, forming or disposing a coating or a sheet of an organic substance containing 3 to 97 % by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900°C and a bond energy of at least 300 KJ/mol on at least a copper foil surface to be irradiated with the carbon dioxide gas laser, and irradiating a surface thereof with necessary pulses of the carbon dioxide gas laser to form the penetration hole, and an auxiliary material for use when a penetration hole is made in the copper-clad laminate with a carbon dioxide gas laser, the auxiliary material being a coating or a sheet of an organic substance containing 3 to 97 % by volume of at least one powder selected from the group consisting of a metal compound powder, a carbon powder and metal powder which have a melting point of at least 900°C and a bond energy of at least 300 KJ/mol.

Abstract translation: 使小直径的通孔具有以高速率与高输出的二氧化碳气体激光器的未做预任何孔的铜箔，形成或设置一能量相对于孔壁高的可靠性的方法 涂层或者包含3〜97％的选自下组的金属化合物粉末，碳粉末和金属粉末具有至少900℃，熔点的选择的至少一种粉末的体积的有机物质的片材 至少一个铜箔表面上的至少300千焦/摩尔的键能与二氧化碳气体激光照射，并用二氧化碳气体激光的必要脉冲，以形成贯通孔照射其表面，和辅助材料的 用于当一个贯通孔设置在与二氧化碳气体激光的覆铜层压板制成，该辅助材料是涂料或含有3至97％的至少一种粉末的体积的有机物质从第一个选择的片材 E组由金属化合物粉末，碳粉末和金属粉末具有至少900℃的熔点和至少300 KJ / mol的键能的。

公开(公告)号：EP0661734A3

公开(公告)日：1996-11-06

申请号：EP94120674.0

申请日：1994-12-27

Applicant: NEC CORPORATION

Inventor： Belgacem, Haba, c/o NEC Corporation ,  Morishige, Yukio, c/o NEC Corporation

IPC: H01L21/48 ,  B23K26/00

CPC classification number: H05K3/0032 ,  B23K26/16 ,  B23K26/382 ,  B23K26/40 ,  B23K2201/40 ,  B23K2201/42 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/14 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  H01L21/486 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/388 ,  H05K2201/0112 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/0285 ,  H05K2203/1388

Abstract: A method of forming via holes (6) in an organic insulation film (1) or cutting the film (1) comprises the steps of exposing predetermined parts of the film (1) to a laser beam to raise a temperature of the exposed parts of the film (1) until the exposed parts are transformed or decomposed and subjecting the film (1) to an ultra sonic wave (5) so that the transformed or decomposed parts are dispersed.

Abstract translation: 形成通孔（6）的有机绝缘电影的（1）或切割薄膜（1）的方法包括暴露所述薄膜（1）的预定部分，以将激光束的步骤，以提高的露出部分的温度 薄膜（1），直到露出部分被转化或分解，并在超声波（5），以便DASS模具转化或分解份分散使所述膜（1）至。

公开(公告)号：EP0178409B1

公开(公告)日：1992-05-20

申请号：EP85109845.9

申请日：1985-08-06

Applicant: International Business Machines Corporation

Inventor： Gregor, Lawrence V.

IPC: H01L21/48

CPC classification number: H05K3/0029 ,  H01L21/4857 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/1241 ,  H05K3/1258 ,  H05K3/4629 ,  H05K2201/0112 ,  H05K2201/09036

公开(公告)号：EP0040360B1

公开(公告)日：1985-04-03

申请号：EP81103447.9

申请日：1981-05-06

Applicant: GTE Products Corporation

Inventor： Brower, Boyd G. ,  Houseknecht, Gary

IPC: G03B15/04

CPC classification number: G03B15/0457 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2203/173

公开(公告)号：EP0055410A3

公开(公告)日：1982-10-06

申请号：EP81110357

申请日：1981-12-11

Applicant: GTE Products Corporation

Inventor： Broadt, David R. ,  Kackenmeister, Carl F.

IPC: G03B15/04 ,  H05K01/00

CPC classification number: G03B15/0457 ,  G03B15/0442 ,  H05K1/0293 ,  H05K2201/0112 ,  H05K2203/173

Abstract: A photoflash unit comprising a plurality of 2n flashlamps attached to a printed circuit board and disposed in a linear array with the longitudinal axes of respective lamps aligned in parallel. The circuit board has a substantially rectangular portion with n spaced apart extensions projecting vertically from a longer side thereof, the extensions being located behind alternate lamps of the linear array. Each extension contains portions of circuit patterns bridged by a mass of switch material to provide a solid state radiation switch on each extension and adjacent to a respective lamp for receiving radiant energy emitted by that lamp. The unit further includes a plurality of reflector cavities within each of which a respective one of the flashlamps is nested. Each reflector cavity includes a recessed rear wall section for accommodating a circuit board extension, such that each of the extensions are disposed between a respective lamp envelope and the recessed rear wall of the associated reflector. With the lamp contiguous with an upper portion of each reflector cavity and each circuit board extension contiguous with a recessed lower portion of a respective cavity, substantially equal predetermined spacings are maintained between the switches of the n extensions and the alternate lamp envelopes associated therewith.

公开(公告)号：WO2014108995A1

公开(公告)日：2014-07-17

申请号：PCT/JP2013/050088

申请日：2013-01-08

Applicant: 富士機械製造株式会社

Inventor： 塚田　謙磁 ,  藤田　政利 ,  杉山　和裕 ,  川尻　明宏 ,  鈴木　雅登 ,  橋本　良崇

IPC: C23C26/00 ,  B05D3/02 ,  B05D7/24 ,  H01B13/00

CPC classification number: H01L51/0022 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/38 ,  H05K2201/0112 ,  H05K2203/107 ,  H05K2203/1581

Abstract: 　回路基板１２を支持する基板保持装置３２と、金属粒子が溶剤中に分散された粒子分散液を吐出する吐出ヘッドとを備えた印刷装置１０によって、回路基板上に金属膜を形成する金属膜形成方法において、吐出ヘッドにより粒子分散液を吐出することで、粒子分散液の塗膜７０を回路基板上に形成し、回路基板と塗膜との間，基板保持装置，回路基板，塗膜の下部，の少なくとも１つに含まれる電磁波吸収材７２に電磁波を照射することで、塗膜を回路基板に接する側の面から加熱する。これにより、溶剤の蒸発等が、塗膜の下方から上方に向かって進行するため、金属粒子の融着は阻害されず、緻密な金属膜が形成される。また、塗膜が回路基板に接する側の面から加熱されることで、金属粒子が効率的に回路基板の内部に拡散する。これにより、金属膜と回路基板との密着性が高くなる。

Abstract translation: 一种金属膜形成方法，用于通过使用具有用于保持电路板（12）的基板保持单元（32）的印刷装置（10）和用于在电路板上排出颗粒 - 通过将金属颗粒分散在溶剂中而制备的分散液体，其中通过使用排出头排出分散有颗粒的液体，在电路板上形成颗粒分散液体的涂膜（70），并且从表面 通过电磁波吸收材料（72）的电磁波照射与电路板接触，电磁波吸收材料（72）包含在以下至少一个中：在电路板和涂膜之间，在基板保持单元中，在电路板 ，或在涂膜的底部。 由于溶剂等的蒸发从涂层的底部向顶部发生转移，所以不会妨碍金属颗粒的熔融，因此形成致密的金属膜。 此外，由于涂膜从与电路板接触的表面加热，金属颗粒有效地分散在电路板中。 因此，改善了金属膜和电路板之间的粘附性。