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    Fixed network resistor
    81.
    发明授权
    Fixed network resistor 有权
    固定网络电阻

    公开(公告)号：US07227443B2

    公开(公告)日：2007-06-05

    申请号：US10533035

    申请日：2003-10-28

    Applicant: Takahiro Kuriyama

    Inventor： Takahiro Kuriyama

    IPC: H01C1/02

    CPC classification number: H05K3/3442 ,  H01C1/16 ,  H01C13/02 ,  H05K2201/09172 ,  H05K2201/10045 ,  Y02P70/613

    Abstract: A fixed resistor network has an insulating substrate, a plurality of film resistors arranged on a top surface of the insulating substrate, terminal electrodes formed for the film resistors on each lengthwise sidewall of the insulating substrate at a given pitch along the sidewall, and recesses provided between the terminal electrodes. The occurrence of solder bridges between the terminal electrodes during solder mounting and the occurrence of chipping in the terminal-electrode-forming areas between the recesses on the lengthwise sidewall are both reduced by making the width of the recesses along the lengthwise sidewall either 0.44 to 0.48 times or 0.525 to 0.625 times the pitch.

    Abstract translation: 固定电阻网络具有绝缘基板，布置在绝缘基板的顶表面上的多个薄膜电阻器，沿着侧壁以给定的间距为绝缘基板的每个纵向侧壁上的薄膜电阻器形成的端子电极和设置的凹部 在端子电极之间。 在焊接安装期间在端子电极之间出现焊接桥，并且在纵向侧壁上的凹部之间的端子电极形成区域中发生切屑的情况都通过使沿着纵向侧壁的凹部的宽度为0.44至0.48 次或0.525到0.625倍。

    Optoelectronic transceiver
    82.
    发明申请
    Optoelectronic transceiver 有权
    光电收发器

    公开(公告)号：US20060072881A1

    公开(公告)日：2006-04-06

    申请号：US11133782

    申请日：2005-05-20

    Applicant: Nikolaus Schunk

    Inventor： Nikolaus Schunk

    IPC: G02B6/36

    CPC classification number: G02B6/305 ,  G02B6/02033 ,  G02B6/3885 ,  G02B6/421 ,  G02B6/4246 ,  H05K1/0203 ,  H05K1/147 ,  H05K2201/10045 ,  H05K2201/10121 ,  H05K2201/1056

    Abstract: An opto-electronic transceiver having: a transmitting component for converting electrical signals into optical signals; a first circuitry module for the transmitting component; a receiving component for converting optical signals into electrical signals; a second circuitry module for the receiving component; a printed circuitboard with conductor tracks, on which the transmitting component, the receiving component, the first circuitry module and the second circuitry module are arranged; and a transceiver housing including a nonconductive material and has a connector receptacle for receiving and coupling an optical connector. The transmitting component, the first circuitry module, the receiving component and the second circuitry module form at least one subassembly, the subassembly having: an encapsulation composition, in which the components of the subassembly are embedded, and a wiring layer embodied using thin-film technology, the wiring layer providing an electrical contact connection between the subassembly components and to associated contacts of the printed circuit board.

    Abstract translation: 一种光电收发器，具有：用于将电信号转换为光信号的发送部件; 用于所述发射部件的第一电路模块; 用于将光信号转换成电信号的接收部件; 用于所述接收部件的第二电路模块; 具有导体轨迹的印刷电路板，其上布置有发射部件，接收部件，第一电路模块和第二电路模块; 以及收发器壳体，其包括非导电材料并且具有用于接收和耦合光学连接器的连接器插座。 发射部件，第一电路模块，接收部件和第二电路模块形成至少一个子组件，该子组件具有：嵌入组件的部件的封装组合物，以及使用薄膜实现的布线层 技术，布线层提供子组件部件之间的电接触连接和印刷电路板的相关联的接触。

    Through hole insertion type electronic component and method of packaging same
    83.
    发明授权
    Through hole insertion type electronic component and method of packaging same 失效
    通孔插入型电子元件及其包装方法

    公开(公告)号：US06734373B2

    公开(公告)日：2004-05-11

    申请号：US10176521

    申请日：2002-06-24

    Applicant: Hideki Seki

    Inventor： Hideki Seki

    IPC: H05K116

    CPC classification number: H05K1/184 ,  H05K3/045 ,  H05K3/301 ,  H05K3/403 ,  H05K3/4046 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/10045 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49165 ,  Y10T29/49169

    Abstract: When an electrode component is inserted into a through hole from one side and then rotated, parts of a conductive film are cut by a cutting blade. Another electrode component including a chip component whose one terminal is connected to an electrode of this electrode component is inserted into the through hole from the other side. When compression bonding is applied to the both electrode components so as to be joined together, an electrode of the former electrode component and the electrode of the latter electrode component are spread within the through hole with the pressure. The spread electrode of the former electrode component contacts a portion of the conductive film that is electrically connected to a front surface wiring, and the spread electrode of the latter electrode component contacts another portion of the conductive film that is electrically connected to a back surface wiring.

    Abstract translation: 当电极组件从一侧插入通孔中然后旋转时，导电膜的一部分被切割刀片切割。 包括其一个端子连接到该电极部件的电极的芯片部件的另一个电极部件从另一侧插入到通孔中。 当对两个电极部件进行压接以便接合在一起时，前一电极部件的电极和后一电极部件的电极在该压力下在通孔内扩散。 前电极部件的扩散电极与导电膜的与前面布线电连接的部分接触，后一电极部件的扩散电极与电连接到背面布线的导电膜的另一部分接触 。

    Through hole insertion type electronic component and method of packaging same
    84.
    发明申请
    Through hole insertion type electronic component and method of packaging same 失效
    通孔插入型电子元件及其包装方法

    公开(公告)号：US20020196613A1

    公开(公告)日：2002-12-26

    申请号：US10176521

    申请日：2002-06-24

    Applicant: NEC CORPORATION

    Inventor： Hideki Seki

    IPC: H05K003/30 ,  H05K003/32

    CPC classification number: H05K1/184 ,  H05K3/045 ,  H05K3/301 ,  H05K3/403 ,  H05K3/4046 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/10045 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2203/0242 ,  Y02P70/611 ,  Y10T29/49165 ,  Y10T29/49169

    Abstract: When an electrode component is inserted into a through hole from one side and then rotated, parts of a conductive film are cut by a cutting blade Another electrode component including a chip component whose one terminal is connected to an electrode of this electrode component is inserted into the through hole from the other side. When compression bonding is applied to the both electrode components so as to be joined together, an electrode of the former electrode component and the electrode of the latter electrode component are spread within the through hole with the pressure. The spread electrode of the former electrode component contacts a portion of the conductive film that is electrically connected to a front surface wiring, and tho spread electrode of the latter electrode component contacts another portion of the conductive film that is electrically connected to a back surface wiring.

    Abstract translation: 当电极组件从一侧插入到通孔中然后旋转时，导电膜的一部分被切割刀片切割。另外，包括其一个端子连接到该电极部件的电极的芯片部件的电极部件插入到 通孔从另一边。 当对两个电极部件进行压接以便接合在一起时，前一电极部件的电极和后一电极部件的电极在该压力下在通孔内扩散。 前电极部件的扩散电极与导电膜的与前面布线电连接的部分接触，后电极部件的扩散电极与电连接到背面布线的导电膜的另一部分接触 。

    Ball grid array resistor network
    85.
    发明授权
    Ball grid array resistor network 有权
    球栅阵列电阻网络

    公开(公告)号：US06326677B1

    公开(公告)日：2001-12-04

    申请号：US09146826

    申请日：1998-09-04

    Applicant: Terry R. Bloom ,  Stephen W. Burry ,  Lewis L. Seffernick ,  Robert M. VandenBoom ,  John Zdanys, Jr.

    Inventor： Terry R. Bloom ,  Stephen W. Burry ,  Lewis L. Seffernick ,  Robert M. VandenBoom ,  John Zdanys, Jr.

    IPC: H01L101

    CPC classification number: H01C1/144 ,  H01C1/16 ,  H01L2924/15311 ,  H05K1/092 ,  H05K1/095 ,  H05K1/141 ,  H05K1/167 ,  H05K2201/10045 ,  H05K2201/10734 ,  H05K2203/041

    Abstract: A ball grid array resistor network has a substrate that has top and bottom surfaces. Resistors are disposed on the top surface. Conductors are disposed on the top surface, and each conductor is electrically connected to an end of each resistor. Vias extend through the substrate and are electrically connected to the conductors. Solder spheres are disposed on the bottom surface, and are electrically connected to the vias. A cover coat is disposed over the conductors and resistors. In an alternative embodiment, the vias are eliminated and the resistor network is formed on the bottom surface of the substrate. The resistor network provides a high density of resistors per unit area.

    Abstract translation: 球栅阵列电阻网络具有具有顶表面和底表面的基底。 电阻器设置在顶表面上。 导体设置在顶表面上，并且每个导体电连接到每个电阻器的一端。 通孔延伸穿过基板并与导体电连接。 焊球设置在底表面上，并且电连接到通孔。 导体和电阻器上设置覆盖层。 在替代实施例中，消除了通孔，并且电阻网络形成在衬底的底表面上。 电阻网络提供每单位面积的高密度电阻。

    Ball grid array resistor terminator network
    86.
    发明授权
    Ball grid array resistor terminator network 失效
    球栅阵列电阻终端网络

    公开(公告)号：US06246312B1

    公开(公告)日：2001-06-12

    申请号：US09620396

    申请日：2000-07-20

    Applicant: David L. Poole ,  Robert L. Reinhard ,  Richard O. Cooper ,  Richard S. DeMars

    Inventor： David L. Poole ,  Robert L. Reinhard ,  Richard O. Cooper ,  Richard S. DeMars

    IPC: H01C1012

    CPC classification number: H05K1/0246 ,  H01C13/02 ,  H05K2201/10022 ,  H05K2201/10045 ,  H05K2201/10734

    Abstract: A resistor network for terminating active electronic circuits such as stub series terminated logic and emitter coupled logic circuits. The network has a substrate with top and bottom surfaces and a common via extending through the substrate. Several resistor pairs are located on the first surface surrounding the common via. Each resistor pair has first and second vias. Resistors are connected between the first and second vias. Several solder spheres are located on the bottom surface. Each of the solder spheres are electrically connected to one of the first, second or common vias.

    Abstract translation: 用于端接有源电子电路的电阻网络，例如短截线端接逻辑和发射极耦合逻辑电路。 网络具有具有顶表面和底表面的基底以及延伸穿过基底的公共通孔。 几个电阻对位于围绕公共通孔的第一表面上。 每个电阻对具有第一和第二通孔。 电阻器连接在第一和第二通孔之间。 几个焊球位于底面。 每个焊球都电连接到第一，第二或共用通孔之一。

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