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公开(公告)号：WO2011125519A1
公开(公告)日：2011-10-13
申请号：PCT/JP2011/057204
申请日：2011-03-24
CPC classification number: H05K5/0091 , H01L23/053 , H01L23/13 , H01L23/49805 , H01L23/49838 , H01L2924/0002 , H01L2924/15162 , H01L2924/16195 , H03H9/1021 , H05K3/3431 , H05K3/3442 , H05K5/0095 , H05K2201/09381 , H05K2201/10068 , H05K2201/10075 , Y02P70/613 , H01L2924/00
Abstract: 表面実装型の電子部品用パッケージのベースは、電子部品素子を保持し、導電性接合材を用いて回路基板に実装するものであり、当該ベースには、回路基板に電気的に接続するための外部接続端子が主面に形成されている。前記外部接続端子上に、前記外部接続端子よりも小さいバンプが形成されている。また、当該ベースを回路基板に実装した際に生じる前記外部接続端子上の応力が減衰する応力減衰方向に沿った、前記外部接続端子の外周端縁から、前記バンプの外周端縁までの距離を距離ｄとし、前記距離ｄは、０．００ｍｍ超０．４５ｍｍ以下に設定される。
Abstract translation: 公开了一种表面安装型电子元件用包装件的基座，其保持电子元件元件，并且使用导电粘合剂安装在电路基板上，其中，在基座上具有电连接到 电路基板形成在其主表面上。 在外部连接端子上形成比外部连接端子小的灯泡。 此外，当将距离d设定为距外部连接端子的外周边缘的距离时，沿着应力衰减方向，其中当基座安装在电路基板上时产生的外部连接端子上的应力被衰减到 凸起的外周边缘，则距离d设定为大于0.00mm且小于或等于0.45mm。
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82.发明申请A SHOCK DAMPING AND THERMAL ISOLATION SYSTEM FOR A SURFACE MOUNTED VIBRATION SENSITIVE DEVICE 审中-公开表面安装振动敏感装置的震动阻尼和热隔离系统
公开(公告)号：WO2011057390A1
公开(公告)日：2011-05-19
申请号：PCT/CA2010/001757
申请日：2010-11-12
Applicant: NOVATEL INC . , BECZE, Karoly , LANNEVILLE, Pee-Jay
Inventor： BECZE, Karoly , LANNEVILLE, Pee-Jay
CPC classification number: H05K3/325 , H05K2201/0314 , H05K2201/10075 , H05K2201/10393 , H05K2201/10409 , H05K2201/10598 , H05K2201/2045 , Y10T29/4913
Abstract: The inventive shock damping system for vibration sensitive surface mounted devices consists of an elastomeric material having conductive fiber material disposed between a printed circuit board (PCB) and a surface mounted device. Once disposed between PCB and surface mounted device, the elastomeric material, the PCB and the surface mounted device are compressed together with a component restraining system, to provide a secure electrical connection between one or more interconnect pads conductively attached to surface mounted device and the PCB. The elastomeric material allows signals and current to flow between surface mounted device and PCB without the use of any attached wires or leads while at the same time providing a system for damping any shocks or vibrations that may be transferred to surface mounted device through the PCB or through the protective component restraining system that encloses the device and the elastomeric material.
Abstract translation: 用于振动敏感表面安装装置的本发明的减震系统由具有设置在印刷电路板（PCB）和表面安装装置之间的导电纤维材料的弹性体材料组成。 一旦设置在PCB和表面安装的装置之间，弹性体材料，PCB和表面安装的装置与部件约束系统一起压缩，以提供导电连接到表面安装的装置和PCB之间的一个或多个互连焊盘之间的安全的电连接 。 弹性体材料允许信号和电流在表面安装的装置和PCB之间流动，而不使用任何附接的导线或引线，同时提供用于阻尼任何冲击或振动的系统，所述冲击或振动可通过PCB传递到表面安装的装置，或 通过包围装置和弹性体材料的保护部件限制系统。
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公开(公告)号：WO2009108324A2
公开(公告)日：2009-09-03
申请号：PCT/US2009001204
申请日：2009-02-26
Applicant: CTS CORP
Inventor： STOLPMAN JAMES L , MCCRACKEN JEFFREY A
IPC: H03L1/04
CPC classification number: H03L1/04 , H05K1/0212 , H05K1/0243 , H05K1/181 , H05K3/403 , H05K2201/09181 , H05K2201/10022 , H05K2201/10075 , H05K2201/10151 , H05K2203/165
Abstract: An oscillator assembly including an oscillator seated on a pad of thermally conductive material formed on the surface of a printed circuit board and covered by a lid defining an oven for the oscillator. In one embodiment, a plurality of heaters are located on different sides of the oscillator and at least partially seated on the pad for evenly transferring heat to the pad and the oscillator. In one embodiment, the oscillator is a temperature compensated crystal oscillator and an integrated amplifier controller circuit on the printed circuit board integrates at least one operational amplifier for controlling the heater(s) and one or more transistors for providing heat to the oven. A canopy seated on the pad and covering the oscillator can be used for transferring heat more evenly to the oscillator. A cavity in the bottom of the printed circuit board defines an insulative air pocket.
Abstract translation: 一种振荡器组件，包括位于印刷电路板的表面上形成并由限定用于振荡器的烘箱的盖子覆盖的导热材料垫上的振荡器。 在一个实施例中，多个加热器位于振荡器的不同侧，并且至少部分地位于该垫上，以将热量均匀地传递到该垫和该振荡器。 在一个实施例中，振荡器是温度补偿晶体振荡器，并且印刷电路板上的集成放大器控制器电路集成了至少一个用于控制加热器的运算放大器和用于向烘箱提供热量的一个或多个晶体管。 位于垫上并覆盖振荡器的顶盖可用于将热量更均匀地传递到振荡器。 印刷电路板底部的空腔限定了绝缘气囊。
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公开(公告)号：WO2017015835A1
公开(公告)日：2017-02-02
申请号：PCT/CN2015/085207
申请日：2015-07-27
Applicant: 广东大普通信技术有限公司
IPC: H03B5/04
CPC classification number: H03B5/04 , H03B5/36 , H03L1/04 , H05K1/0212 , H05K1/167 , H05K1/181 , H05K2201/10075 , H05K2201/10151
Abstract: 一种直接测温式恒温晶体振荡器，属于石英晶体振荡器技术领域，不需要在晶体振荡器内部装配晶片测温的额外部件，而是将测温器件（6）设置在晶片（3）的表面上以对晶片（3）本身的温度直接测温，从而实现对晶片（3）本身的精确测温。恒温晶体振荡器结构简单、易于生产制造，直接对晶片本身测温使得测温更精确。
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公开(公告)号：WO2016111281A1
公开(公告)日：2016-07-14
申请号：PCT/JP2016/050098
申请日：2016-01-05
Applicant: 株式会社村田製作所
Inventor： 菅 達典
CPC classification number: H05K1/18 , H01L23/10 , H01L23/13 , H01L2224/16225 , H01L2924/0002 , H01L2924/16152 , H03H9/1014 , H03H9/1057 , H05K1/0306 , H05K3/1291 , H05K3/46 , H05K2201/10075 , H01L2924/00
Abstract: 電極のセラミック絶縁層に対する密着性を向上するための密着層を形成することにより、セラミック絶縁層に構造欠陥が生じるのを抑制して、電極が配置された部分におけるセラミック絶縁層の構造を緻密化することができる技術を提供する。 電極２２，２３のセラミック絶縁層２１に対する密着性を向上することができる密着層２５ａ，２５ｂをガラスペーストを焼成することにより低コストで形成することができる。また、電極２２，２３、セラミック絶縁層２１および密着層２５ａ，２５ｂが同時に焼成される際に、ガラスペーストが最後に焼結するため、収縮率の差に起因して生じる応力により焼成時に収縮するのが妨げられてセラミック絶縁層２１の電極２２，２３が配置された部分にボイドや欠陥等が生じるのを抑制することができるので、当該部分におけるセラミック絶縁層２２，２３の構造を密着層２５ａ、２５ｂにより緻密化することができる。
Abstract translation: 提供了一种技术，通过形成粘合层，通过抑制陶瓷绝缘层中的结构缺陷的发生，可以在其中放置电极的部分中细化陶瓷绝缘层的结构，以增强电极的附着力 陶瓷绝缘层。 通过烧制玻璃浆料，可以以低成本形成增强电极22和23对陶瓷绝缘层21的附着力的粘附层25a和25b。此外，当电极22和23，陶瓷绝缘层21 ，并且粘附层25a和25b同时烧制，因为最终烧结玻璃浆料，所以防止了由于收缩因素的差异而产生的应力引起的焙烧期间的收缩，这抑制了空隙的发生，缺陷 在其中放置电极22和23的陶瓷绝缘层21的部分中; 因此，可以通过粘合层25a和25b来改善陶瓷绝缘层21中那些部分的结构。
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Patent Agency Ranking
公开(公告)号：WO2015016289A1
公开(公告)日：2015-02-05
申请号：PCT/JP2014/070141
申请日：2014-07-30
Applicant: 京セラ株式会社
Inventor： 川崎 晃一
CPC classification number: H05K1/111 , H01L23/13 , H01L23/24 , H01L23/49838 , H01L24/32 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83385 , H01L2924/181 , H05K1/0209 , H05K1/181 , H05K3/243 , H05K3/244 , H05K3/3431 , H05K3/4629 , H05K2201/09154 , H05K2201/09163 , H05K2201/09381 , H05K2201/094 , H05K2201/09418 , H05K2201/09663 , H05K2201/097 , H05K2201/098 , H05K2201/10068 , H05K2201/10075 , H05K2201/10106 , H05K2201/10151 , H05K2201/2054 , H05K2203/1178 , Y02P70/611 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
Abstract: 【課題】 電極上に電子部品を接合する際に、接合材内にボイドが発生する可能性を低減すること。 【解決手段】 配線基板１は、絶縁基板11と、絶縁基板11上に平面視で隣り合うようにして複数設けられた電極12とを有しており、電極12は外周縁に開口部12ｂを有して外周縁から内側に向かうスリット12ａを有し、隣り合う２つの電極12のうち、一方の電極12にあるスリット12ａは、スリット12ａに引いた中心線12ｃが他方の電極12の外周縁と交わっている。
Abstract translation: [问题]为了减少当将电子部件接合到电极时在接合材料内出现空隙的可能性。 布线基板（1）具有绝缘基板（11）和在绝缘基板（11）上平面地并排设置的多个电极（12），电极（12） 在外周具有开口（12b）和从外周到内部的狭缝（12a），并且在彼此相邻的两个电极（12）中，一个电极（12）中的狭缝（12a）具有 ，与另一个电极（12）的外周相交，跟踪到狭缝（12a）的中心线（12c）。
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公开(公告)号：WO2003096777A2
公开(公告)日：2003-11-20
申请号：PCT/US2003/015324
申请日：2003-05-08
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor： OLZAK, Richard, A. , KHAN, Tehmosp
IPC: H05K3/34
CPC classification number: H05K1/141 , H05K3/3447 , H05K3/429 , H05K2201/049 , H05K2201/09418 , H05K2201/096 , H05K2201/09954 , H05K2201/10075 , H05K2201/10689
Abstract: An electrical adapter formed on a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.
Abstract translation: 形成在具有相对的一次侧和次侧的印刷线路板上的电适配器和至少一个印刷电路，所述至少一个印刷电路具有布置成与表面贴装技术（SMT）器件的输入/输出信号引脚相互连接的多个焊盘，以及多个电镀 布置成与一个或多个分立电气部件的输入/输出信号引脚互连的通孔; 一个或多个电镀通孔，其延伸在所述基板的所述主侧和次侧之间并且电耦合到所述印刷电路，所述电镀通孔以构造成与母电路板中的电镀通孔匹配的图案定位; 以及多个输入/输出信号互连引脚，其机械地和电耦合到所述电镀孔并且延伸超过所述板的次级侧的距离。
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公开(公告)号：EP3358925A1
公开(公告)日：2018-08-08
申请号：EP16850904.0
申请日：2016-08-05
Applicant: Hitachi Automotive Systems, Ltd.
Inventor： KANEKO Yujiro , KAWAI Yoshio
CPC classification number: H05K5/0017 , B60R16/02 , H01L23/29 , H05K1/0203 , H05K1/0216 , H05K1/181 , H05K3/28 , H05K3/284 , H05K5/00 , H05K5/065 , H05K7/14 , H05K7/20 , H05K7/20409 , H05K9/00 , H05K9/0007 , H05K9/0084 , H05K2201/10075 , H05K2201/10371 , H05K2201/10522 , H05K2203/1316 , H05K2203/1327
Abstract: Providing an electronic control device excellent in electromagnetic shielding property with low cost. An electronic control device includes: an electronic component; a control substrate on which the electronic component is mounted; a sealing resin that seals the control substrate; and a metal housing case at least a portion of which is sealed with the sealing resin. The housing case consists of: a heat sink portion a portion of which is exposed from the sealing resin to dissipate heat of the inside of the sealing resin; an electromagnetic shield unit that shields electromagnetic noise by covering the electronic component; and a fixing portion exposed from the sealing resin to achieve fixation to a vehicle body.
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公开(公告)号：EP3308612A1
公开(公告)日：2018-04-18
申请号：EP16731957.3
申请日：2016-06-09
Applicant: Semblant Limited
Inventor： ARESTA, Gianfranco , HENNIGHAN, Gareth , BROOKS, Andrew Simon Hall , SINGH, Shailendra Vikram
IPC: H05K3/28
CPC classification number: H05K3/467 , C23C16/30 , C23C16/505 , H05K1/181 , H05K3/285 , H05K2201/0104 , H05K2201/0162 , H05K2201/09872 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10037 , H05K2201/10053 , H05K2201/10075 , H05K2201/10083 , H05K2201/10098 , H05K2201/10106 , H05K2201/10121 , H05K2201/10128 , H05K2201/10166 , H05K2201/10174 , H05K2201/10181 , H05K2203/095 , H05K2203/121 , H05K2203/1322 , H05K2203/1338
Abstract: An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O2, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.
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公开(公告)号：EP3100359A1
公开(公告)日：2016-12-07
申请号：EP15742811.1
申请日：2015-01-26
Applicant: Ricoh Company, Ltd.
Inventor： ADACHI, Kazuhiko , HARASAKA, Kazuhiro , ITOH, Akihiro
CPC classification number: H03L7/26 , G04F5/14 , H01L23/345 , H01L2224/45144 , H01L2224/48091 , H01S5/005 , H01S5/02248 , H01S5/02453 , H01S5/183 , H05K1/028 , H05K1/0296 , H05K1/11 , H05K1/189 , H05K3/0052 , H05K2201/052 , H05K2201/055 , H05K2201/056 , H05K2201/09063 , H05K2201/10075 , H05K2201/10174 , H05K2201/2018 , H01L2924/00014 , H01L2924/00
Abstract: An atomic oscillator includes a gas cell and a plurality of components. The plurality of components includes a temperature control device for the gas cell; an excitation light source that emits excitation light to excite atoms enclosed in the gas cell; a temperature control device for the excitation light source; and a light receiving element that detects the excitation light that passes through the gas cell. The plurality of components is mounted on an insulating film having wiring.
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