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公开(公告)号：KR101845514B1
公开(公告)日：2018-04-04
申请号：KR1020100130323
申请日：2010-12-17
Applicant: 삼성전자주식회사
IPC: H04B10/548 , H04B10/532 , H04B10/50 , G02B6/30 , G02F1/225
CPC classification number: G02B6/305 , G02B6/30 , G02F1/225 , G02F2201/307
Abstract: 소형광 변조기및 이를포함하는광 송신기가개시된다. 본발명에따른광 변조기는변조되지않은입력광 신호를수신하여제1 광신호와제2 광신호로나누어광 도파로의제1 및제2 경로로각각전송하는광 입출력부, 상기제1 및제2 경로중 적어도하나에위치하여, 전기신호에따라상기제1 경로로전송되는제1 광신호및 상기제2 경로로전송되는제2 광신호중 적어도하나의위상을변조하여위상변조신호를출력하는위상천이기, 및상기제1 경로로전송된신호및 상기제2 경로로전송된신호를각각동일한경로로반사시키는반사형그레이팅커플러를포함하여, 안정성확보및 소형화가가능한효과가있다.
Abstract translation: 公开了一种小型光学调制器和包括其的光学发射器。 根据本发明的光调制器接收未调制的第一光信号和所述第二第一光输出单元，以分别发送到光波导路径插入光学弧，第一mitje第二路径中的至少一个的所述第二路径中的一个mitje输入光信号 并且通过根据电信号调制传输到第一路径的第一光信号和传输到第二路径的第二光信号的至少一个相位来输出调相信号， 还有一种反射型光栅耦合器，它将传输到第一路径的信号和传输到第二路径的信号反射到同一路径，从而实现稳定性和小型化。
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公开(公告)号：KR101758141B1
公开(公告)日：2017-07-14
申请号：KR1020100091583
申请日：2010-09-17
Applicant: 삼성전자주식회사
CPC classification number: G02F1/01708 , G02F1/0054 , G02F1/01 , G02F1/011 , G02F1/015 , G02F1/01725 , G02F1/025 , G02F1/2257 , G02F2202/10
Abstract: 광전자장치가개시된다. 상기광전자장치는반도체기판내에형성된 p-도핑영역과 n-도핑영역; 상기 p-도핑영역과상기 n-도핑영역사이에형성된광 도파로코어영역; 상기광 도파로코어영역과상기 p-도핑영역사이에형성되고, 각각이제1거리로이격되어형성되며상기광 도파로코어영역의상기두께와동일한두께는갖는복수의제1슬랩들; 및상기광 도파로코어영역과상기 n-도핑영역사이에형성되고, 각각이제2거리로이격되어형성되며상기광 도파로코어영역의상기두께와동일한두께는갖는복수의제2슬랩들을포함한다.
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公开(公告)号：KR1020140111810A
公开(公告)日：2014-09-22
申请号：KR1020130026178
申请日：2013-03-12
Applicant: 삼성전자주식회사
CPC classification number: G02B6/4206 , G02B6/4203 , G02B6/4214
Abstract: An optical package includes a semiconductor chip, a conductive bump, an optical element, and an optical fiber module. The semiconductor chip includes a first surface which has pads arranged to receive and output electrical signals and a second surface on the opposite side of the first surface. The conductive pump is electrically connected to the pads. The optical element is built in the semiconductor chip and exchanges the optical signals with the second surface of the semiconductor chip. The optical fiber module is connected to the second surface of the semiconductor chip to transmit the optical signals. The electrical signals are transmitted through the conductive bump arranged on the first surface of the semiconductor chip to be rapidly transmitted. Also, the optical signals are transmitted through the optical fiber module arranged on the second surface of the semiconductor chip to be rapidly transmitted without using a separate optical delivery member. Accordingly, the optical package can have advantages such as low price, compact size, and low power consumption.
Abstract translation: 光学封装包括半导体芯片，导电凸块，光学元件和光纤模块。 半导体芯片包括具有布置成接收和输出电信号的焊盘的第一表面和位于第一表面的相对侧上的第二表面。 导电泵电连接到焊盘。 光学元件内置在半导体芯片中，并与半导体芯片的第二表面交换光信号。 光纤模块连接到半导体芯片的第二表面以传输光信号。 电信号通过布置在半导体芯片的第一表面上的导电凸块传输以被快速传输。 此外，光信号通过布置在半导体芯片的第二表面上的光纤模块传输，以便不使用单独的光学传送构件快速传输。 因此，光学封装可以具有价格低廉，尺寸紧凑，功耗低等优点。
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Patent Agency Ranking
公开(公告)号：KR101683543B1
公开(公告)日：2016-12-07
申请号：KR1020100011472
申请日：2010-02-08
Applicant: 삼성전자주식회사
Abstract: 벌크실리콘기판을사용하는변조기가제공된다. 본발명에따른변조기는소정의폭과소정의깊이로식각된트랜치를포함하는벌크실리콘기판; 상기벌크실리콘기판의상기트랜치에형성되는하부클래드층; 상기하부클래드층의위에형성되는복수개의도파로들; 상기하부클래드층의위에형성되며, 도파로의굴절률을변조하여도파로를통과하는광 신호의위상을변조하는위상변조부; 및상기복수개의도파로들및 상기위상변조부위에형성되는상부클래드층을포함한다. 본발명에의하면, 벌크실리콘기판을사용하므로변조기의제작단가를낮출수 있다는효과가있다.
Abstract translation: 目的：提供使用体硅衬底的调制器，以高速操作并扩大工作频带。 构成：体硅衬底（281）包括以预设宽度和深度蚀刻的沟槽。 在本体硅衬底的沟槽中形成下覆盖层。 多个光波导（210,230,240,260）形成在下包层上。 在下包层上形成相位调制单元（270），通过调制光波导的折射率来调制通过光波导的光信号的相位。 在相位调制单元和多个光波导上形成上包层。
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公开(公告)号：KR1020140075821A
公开(公告)日：2014-06-20
申请号：KR1020120133147
申请日：2012-11-22
Applicant: 삼성전자주식회사
CPC classification number: G02F1/025 , G02F1/3133 , G02F2201/58 , G02F2203/15
Abstract: Provided is a wavelength tunable optical transmitter comprising a first waveguide receiving input light by an input port thereof and outputting the input light through a first output port thereof; a resonant modulator disposed to be adjacent to the first waveguide and varying a resonant wavelength according to a wavelength of the input light; and a second waveguide disposed to be parallel to the first waveguide with the resonant modulator interposed therebetween and outputting output light by a second output port thereof. The resonant modulator comprises a silicon resonator formed of a circular annular crystallized silicon film disposed between the first waveguide and the second waveguide; a first electrode formed of a first conductivity-type silicon film disposed on an inner circumferential surface of the silicon resonator; and a second electrode formed of a second conductivity-type silicon film disposed on a portion of an outer circumferential surface of the silicon resonator, wherein the resonant wavelength of the silicon resonator is varied by a direct current (DC) bias current applied between the first electrode and the second electrode.
Abstract translation: 提供了一种波长可调光发射机，包括：第一波导，通过其输入端口接收输入光，并通过其第一输出端口输出输入光; 设置为与所述第一波导相邻并且根据所述输入光的波长改变谐振波长的谐振调制器; 以及设置成平行于第一波导的第二波导，谐振调制器插入其间并通过其第二输出端输出输出光。 谐振调制器包括由设置在第一波导和第二波导之间的环形结晶硅膜形成的硅谐振器; 由设置在所述硅谐振器的内周面上的第一导电型硅膜形成的第一电极; 以及由设置在所述硅谐振器的外周表面的一部分上的第二导电型硅膜形成的第二电极，其中所述硅谐振器的谐振波长由施加在所述第一 电极和第二电极。
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公开(公告)号：KR1020110092043A
公开(公告)日：2011-08-17
申请号：KR1020100011471
申请日：2010-02-08
Applicant: 삼성전자주식회사
IPC: H04B10/516 , H04B10/548
Abstract: PURPOSE: A modulator of an optical communication system is provided to perform a high speed operation and have a wide operation spectrum band. CONSTITUTION: A plurality of branch waveguides input distributed optical signals by a second connection part. A phase modulation unit(17) modulates the reflection ratio of one or more branch waveguides. The phase modulation unit modulates the phases of the optical signals which pass through one or more branch waveguides. A plurality of reflecting parts(19) are located on each end of the branch waveguides. The reflecting bodies reflect the distributed optical signals.
Abstract translation: 目的：提供光通信系统的调制器，以执行高速操作并具有宽的操作频谱带。 构成：多个分支波导通过第二连接部分输入分布式光信号。 相位调制单元（17）调制一个或多个分支波导的反射比。 相位调制单元调制通过一个或多个分支波导的光信号的相位。 多个反射部分（19）位于分支波导的每一端。 反射体反映分布式光信号。
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公开(公告)号：KR1020110064691A
公开(公告)日：2011-06-15
申请号：KR1020090121396
申请日：2009-12-08
Applicant: 삼성전자주식회사
IPC: H01L21/77
CPC classification number: G02B6/4214 , G02B6/3652 , G02B6/3692 , G02B6/4206 , G02B6/43 , H05K1/0274 , H05K1/141 , H05K2201/10159 , Y10T29/4913
Abstract: PURPOSE: A memory module with an optical route and an electric/electronic device with the memory module are provided to exchange signals for processing and controlling data between a memory chip and a memory controller, thereby quickly processing data. CONSTITUTION: At least one memory package(100) includes an optical signal input/output apparatus(115). A printed circuit board(200) comprises an optical route of transferring an optical signal to the optical signal input/output apparatus. A medium unit(300) mounts the memory package on the printed circuit board. The medium unit matches the refractive indexes of the optical signal input/output apparatus and the optical route.
Abstract translation: 目的：提供具有光学路线的存储器模块和具有存储器模块的电气/电子设备，以交换用于处理和控制存储器芯片和存储器控制器之间的数据的信号，从而快速处理数据。 构成：至少一个存储器封装（100）包括光信号输入/输出装置（115）。 印刷电路板（200）包括将光信号传送到光信号输入/输出装置的光路。 介质单元（300）将存储器封装安装在印刷电路板上。 介质单元匹配光信号输入/输出设备和光路的折射率。
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公开(公告)号：KR1020110062393A
公开(公告)日：2011-06-10
申请号：KR1020090119107
申请日：2009-12-03
Applicant: 삼성전자주식회사
CPC classification number: G02B6/12004 , G02B6/125 , G02F1/065
Abstract: PURPOSE: An optical waveguide device using a bulk silicon wafer and a manufacturing method thereof are provided to achieve high speed signal transmission, low power consumption, large capacity and compactness, by using optical interconnection technology. CONSTITUTION: A trench region(12) is formed on a part of a bulk silicon wafer(10). A bottom clad layer(14) is formed in the trench region. An optical waveguide core layer(22a) is formed on the bottom clad layer, far from one side of the trench region. A top clad layer(24) is formed to cover the optical waveguide core layer.
Abstract translation: 目的：提供使用体硅晶片的光波导器件及其制造方法，通过使用光互连技术实现高速信号传输，低功耗，大容量和紧凑性。 构成：在体硅晶片（10）的一部分上形成沟槽区（12）。 在沟槽区域中形成底部覆层（14）。 光波导芯层（22a）形成在底部包层上，远离沟槽区域的一侧。 形成顶部覆层（24）以覆盖光波导芯层。
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