Abstract:
The present invention relates to a rinse liquid for an insulating film and a method for rinsing an insulating film, wherein the rinse liquid includes a solvent represented by chemical formula 1. In chemical formula 1, R^1 and R^a to R^e are defined as in the specification.
Abstract translation:本发明涉及一种用于绝缘膜的冲洗液和一种用于漂洗绝缘膜的方法,其中冲洗液包括由化学式1表示的溶剂。在化学式1中,R 1和R 2 a至R e 被定义为在说明书中。
Abstract:
Provided are a manufacturing method of a filler for filling a gap, comprising manufacturing hydrogenation polysilazane by putting 50-70 parts by weight of ammonia based on 100 parts by weight of halo-silane at a rate of 1 to 15 g/hr after injecting the halo-silane into an alkaline solvent, a filler for filling a gap manufactured by the manufacturing method, and a manufacturing method of a semiconductor capacitor using the same.
Abstract:
Provided is a modified hydrogenated polysiloxazane prepared by reacting hydrogenated polysiloxazane with a silane compound selected from the group consisting of polysilane, polycyclosilane and a silane oligomer. The modified hydrogenated polysiloxazane has small molar ratio of nitrogen atoms with respect to silicon atoms, and can markedly decrease layer shrinkage ratio during manufacturing a silica-based insulating layer when applied in a composition for manufacturing the silica-based insulating layer.
Abstract:
주쇄에 Si-N 연결(linkage)을가지는폴리실라잔중합체의제조방법으로서, 하기화학식 1로나타내어지는아미노실란단량체를, 상기아미노실란의 Si원자를배위할수 있는친핵성화합물의존재하에활성화시켜불균등화반응및 재배열반응을통해중합시키는단계를포함하는중합체제조방법및 이렇게제조된중합체를포함하는절연막형성용조성물이제공된다:상기화학식 1에서, R, R, 및 R는동일하거나상이하며, 각각독립적으로, 수소, -Si(R), C1 내지 C30의알킬기, C6 내지 C20의아릴기, C1 내지 C10의알콕시기, C6 내지 C20의아릴옥시기, C1 내지 C20의알킬또는아릴옥시카르보닐기, C1 내지 C20의아실기, 또는 C1 내지 C20의아실옥시기이되, R, R, 및 R중하나이상은 -Si(R)이고, 여기서 R는동일하거나상이하며, 각각독립적으로, 수소, C1 내지 C30의알킬기, C6 내지 C20의아릴기, C1 내지 C10의알콕시기, 또는 C6 내지 C20의아릴옥시기이되, R중하나이상은수소이다.
Abstract:
Provided is a method of forming a ceramic film which includes a step of preparing a composite for forming a ceramic film; a step of coating a substrate with the composite for forming a ceramic film; a step of firstly hardening the substrate coated with the composite for forming a ceramic film at a temperature of 100°C to 500°C under a reducing atmosphere; and a step of secondarily hardening the firstly hardened substrate at a temperature of 200°C to 3,000°C under an oxidizing atmosphere.